IPC-6921 establishes and defines the qualification, performance, and acceptance requirements for wire bonding IC substrate products and flip chip IC substrate products. It provides photographs and illustrations of acceptable and defect conditions observed internally or externally on organic IC substrates, including requirements for critical IC substrate functional areas such as WB pads, SMT pads, ball pads, die attach areas, and solder mask areas. The document also contains performance requirements for organic IC substrates, including surface finish, surface plating, conductors, holes/vias, acceptance test frequency and quality conformance requirements for multilayer substrates; as well as electrical, mechanical, and environmental reliability requirements.