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IPC-IPC North American PCB Statistical Program Subscription

IPC North American PCB Statistical Program Subscription

Document #:
IPC-I3-PCB
Revision
0
Product Type
Intelligence Subscription
Language
English
Current Revision
IPC conducts statistical programs for the EMS, PCB, and solder segments of the electronics manufacturing industry. The North American PCB Statistical Program aggregates industry data covering sales, orders and growth rates by product types and company-size tiers for rigid PCBs and by product types for flexible circuits, as well as separate rigid and flex book-to-bill ratios. Backlogs, inventory...
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IPC-IPC North American EMS Market Statistical Program Subscription

IPC North American EMS Market Statistical Program Subscription

Document #:
IPC-I3-EMS
Revision
0
Product Type
Intelligence Subscription
Language
English
Current Revision
IPC conducts statistical programs for the EMS, PCB, and solder segments of the electronics manufacturing industry. The North American EMS Market Statistical Program aggregates industry data covering EMS sales growth by type of production and company size tier, order growth and backlogs by company size tier, vertical market growth, the EMS book-to-bill ratio, and 3-month and 12 month sales outlook...
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IPC-IPC Global Solder Statistical Program Subscription

IPC Global Solder Statistical Program Subscription

Document #:
IPC-I3-SOLDER
Revision
0
Product Type
Intelligence Subscription
Language
English
Current Revision
IPC conducts statistical programs for the EMS, PCB, and solder segments of the electronics manufacturing industry. IPC’s Global Solder Statistical Program aggregates industry data covering the volume of solder consumption by product type and by regional market, with quarterly growth rates and a lead-free breakdown, as well as percentages of lead-free solder using SAC alloys. Three-month and 12...
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Coming Soon

IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards