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IPC-TW - Conference Presentations

Tin Whisker Inorganic Coatings Evaluation (TWICE)

Document #:
IPC-TW
Revision
Original Version
Product Type
Conference Presentation/Proceedings
Released:  05/23/2012
Language
English
Current Revision
This multimedia presentation was given at the IPC Tin Whisker Conference, April 2012, by David Hillman, metallurgical engineer in the Advanced Operations Engineering Department of Rockwell Collins. The author describes a program funded by the Strategic Environmental Research and Development Program (SERDP) to evaluate various conformal coatings to mitigate tin whisker growth. He also introduces an...
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IPC-UF - Conference Presentations

Underfill Selection and the Impact on Reliability

Document #:
IPC-UF
Revision
Original Version
Product Type
Conference Presentation/Proceedings
Released:  12/01/2011
Language
English
Current Revision
"Underfill Selection and the Impact on Reliability" was presented at the IPC Conference on Reliability: Assembly Process for a Reliable Product in November 2011 by Dr. Brian Toleno, director of technical services and applications for Henkel. The author defines underfill and describes the types. He explaines the need for underfill and where it is typically used. He also explains the effects of...
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IPC-ASSY - Conference Presentations

HDI Assembly Related Issues

Document #:
IPC-ASSY
Revision
Original Version
Product Type
Conference Presentation/Proceedings
Released:  03/30/2011
Language
English
Current Revision
This presentation "HDI Assembly Related Issues" was given by Ian Williams, manager of customer interconnect core competency team at Intel Corp. at the IPC Conference on HDI Technology High Performance: Strategies for the 21st Century at Baltimore, Md., in March 2011. The author describes an Intel investigation into assembly challenges, capabilities, quality, reliability and testability of HDI...
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IPC-IMGTR - Conference Presentations

Abilities and Gaps: Image Transfer Technologies in PWB Fabrication

Document #:
IPC-IMGTR
Revision
Original Version
Product Type
Conference Presentation/Proceedings
Released:  05/04/2009
Language
English
Current Revision
Presentation by Karl Dietz, Ph.D., DuPont at the Technology Interchange meeting at EIT in Endicott, N.Y. Contains powerpoint slides and recorded presentation. Includes overview, capabilities, challenges and advances of laser direct imaging techniques, photolithography and etching. Also includes problems in etching and how to minimize them. Excellent 37 minute non-commercial tutorial on the subject...
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IPC-APEX - Conference Presentations

IPC APEX 2019 Technical Conference Proceedings

Document #:
IPC-APEX
Revision
2019
Product Type
Conference Presentation/Proceedings
Released:  04/11/2019
Language
English
Current Revision
The 2019 IPC APEX EXPO technical conference is one of the most outstanding in the electronics industry. Proceedings from this technical conference include: 98 presentations from 34 sessions, 20 poster papers and 5 buzz session presentations on Automation in Electronics Manufacturing, Adhesives, Advanced Technology, Area Array/Flip Chip/0201 Metric, Assembly and Rework Processes, BGA/CSP Packaging...
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IPC-APEX - Conference Presentations 2020

IPC APEX 2020 Technical Conference Proceedings

Document #:
IPC-APEX
Revision
2020
Product Type
Conference Presentation/Proceedings
Released:  03/16/2021
Language
English
The 2020 IPC APEX EXPO technical conference is one of the most outstanding in the electronics industry. Proceedings from this technical conference include: 78 presentations from 29 sessions, 24 poster abstracts and 19 sessions @ the intersections. Advanced Technology, Area Array/Flip Chip/0201, Assembly Processes, BGA Packaging, Black Pad, Business & Supply Chain Issues Counterfeit Electronics...
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IPC-APEX - Conference Presentations 2018

IPC APEX 2018 Technical Conference Proceedings

Document #:
IPC-APEX
Revision
2018
Product Type
Conference Presentation/Proceedings
Released:  03/19/2018
Language
English
The 2018 IPC APEX EXPO technical conference is one of the most outstanding in the electronics industry. Proceedings from the technical conference include: 70 presentations from 28 sessions, 24 poster papers and 5 buzz session presentations. Advanced Technology, Area Array/Flip Chip/0201, Assembly Processes, BGA Packaging, Black Pad, Business & Supply Chain Issues Counterfeit Electronics, Design...
1-12 of 12

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IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards