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IPC-MIL - Roadmap

PWB Technology Roadmap

Document #:
IPC-MIL
Revision
Original Version
Product Type
Roadmap
Released:  01/18/2012
Language
English
Current Revision
"PWB Technology Roadmap" was presented by Lance Auer, product development engineering, Raytheon Missile Systems Division, at the IPC Conference for the PCB Industry: Critical Issues for the Military Market in Washington D.C., in December 2011.The author explores the developing challenges of PCB design. Design types, digital, power and high speed RF circuits present conflicting requirements of more...
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IPC-Roadmap-15 - Roadmap

IPC International Technology Roadmap for Electronic Interconnections-2015

Document #:
IPC-Roadmap-15
Revision
Original Version
Product Type
Roadmap
Released:  02/20/2015
Language
English
Current Revision
The IPC 2015 International Technology Roadmap provides vision and direction for product and process development and the services required to satisfy current and future needs of companies that design, build, buy or specify electronic equipment and materials. The IPC Roadmap is an invaluable resource for any person or company in or having interest in the global electronics supply chain. It is an...
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IPC-PCB Technology Trends 2016

IPC-PCB Technology Trends 2016

Document #:
IPC-TT
Revision
2016
Product Type
Industry Report
Released:  05/04/2017
Language
English
Current Revision
Based on data from 118 electronics assembly companies and PCB fabricators worldwide, this report presents data on the current state (2016) of PCB fabrication and assembly, and the industry’s predictions for the data by 2021. The data are segmented by five applications: automotive, defense and aerospace, high-end systems, industrial and medical electronics. Topics covered include board properties...
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IPC-PCB Prototype Trends North America 2017

IPC-Trends in the North American Market for PCB Prototypes

Document #:
IPC-PCBPROTOTYPE
Revision
2017
Product Type
Industry Report
Released:  10/16/2017
Language
English
Current Revision
This report shows trends in PCB prototype sales and growth based on data from IPC's North American PCB Statistical Program covering 2014 through mid-2017. Data on prototype sales percentages by month compared to regular-production PCB sales, and estimates of North American prototype market sizes, are reported for all PCBs as well as for rigid PCBs and flexible circuits separately. The vertical...
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IPC-Annual PCB Report 2017

2017 Annual Report on the North American PCB Industry

Document #:
IPC-ANPCB
Revision
2017
Product Type
Industry Report
Released:  09/18/2017
Language
English
Current Revision
This survey-based study about the current state of the the North American PCB industry covers data for 2016 and the first half of 2017 from IPC's PCB Statistical Program. It includes market size estimates, sales and production growth, sales by product type, product mix (e.g, prototype), vertical markets, revenue per employee, capacity utilization, inventory turns, lead times, US PCB imports and...
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IPC-Annual Report and Forecast for the North American EMS Industry 2019

IPC-2019 Annual Report and Forecast for the North American EMS Industry

Document #:
IPC-ANEMS
Revision
2019
Product Type
Industry Report
Language
English
Current Revision
The 2019 Annual Report & Forecast for the North American EMS Industry is based on data collected from IPC’s EMS statistical program and includes a five-year market forecast from New Venture Research. It covers market sizes, potential for market growth, sales and order growth, sales by product type, vertical markets, order backlogs, domestic production and number of EMS facilities. Management data...
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IPC-Wage Rate & Salary Study for the North American Electronics Assembly Industry 2022

IPC-Wage Rate & Salary Study for the North American Electronics Assembly Industry 2022

Document #:
IPC-WAGE
Revision
2022
Product Type
Industry Report
Released:  10/25/2022
Language
English
Current Revision
Th 2022 Wage Rate & Salary Study for the North American Electronics Assembly Industry contains the results of IPC's biennial wage survey in which 30 U.S. companies participated, including both contract manufacturers/EMS companies and OEMs. It shows the data in averages and average ranges on 2022 hourly wages, annual salaries, and sales compensation in the USA. Salary budget growth and pay...
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IPC-IPC North American PCB Statistical Program Subscription

IPC North American PCB Statistical Program Subscription

Document #:
IPC-I3-PCB
Revision
0
Product Type
Intelligence Subscription
Language
English
Current Revision
IPC conducts statistical programs for the EMS, PCB, and solder segments of the electronics manufacturing industry. The North American PCB Statistical Program aggregates industry data covering sales, orders and growth rates by product types and company-size tiers for rigid PCBs and by product types for flexible circuits, as well as separate rigid and flex book-to-bill ratios. Backlogs, inventory...
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IPC-IPC North American EMS Market Statistical Program Subscription

IPC North American EMS Market Statistical Program Subscription

Document #:
IPC-I3-EMS
Revision
0
Product Type
Intelligence Subscription
Language
English
Current Revision
IPC conducts statistical programs for the EMS, PCB, and solder segments of the electronics manufacturing industry. The North American EMS Market Statistical Program aggregates industry data covering EMS sales growth by type of production and company size tier, order growth and backlogs by company size tier, vertical market growth, the EMS book-to-bill ratio, and 3-month and 12 month sales outlook...
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IPC-IPC Global Solder Statistical Program Subscription

IPC Global Solder Statistical Program Subscription

Document #:
IPC-I3-SOLDER
Revision
0
Product Type
Intelligence Subscription
Language
English
Current Revision
IPC conducts statistical programs for the EMS, PCB, and solder segments of the electronics manufacturing industry. IPC’s Global Solder Statistical Program aggregates industry data covering the volume of solder consumption by product type and by regional market, with quarterly growth rates and a lead-free breakdown, as well as percentages of lead-free solder using SAC alloys. Three-month and 12...
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IPC Quality Benchmarks for the Electronics Assembly Industry

IPC Quality Benchmarks for the Electronics Assembly Industry

Document #:
IPC-BMK
Revision
2022
Product Type
Industry Report
Released:  08/15/2022
Language
English
Current Revision
The 2022 Quality Benchmarks for the Electronics Assembly Industry is a biennial report released by IPC. The report represents the findings from an online quantitative survey fielded between the dates of September 28, 2001 – October 20, 2021. A total of 59 assembly companies completed the survey, representing both contract electronics manufacturing services (EMS) companies and original equipment...
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Coming Soon

IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards