Menu
Close
Contact Us

Industry Intelligence

Your results

Document #

Language

Products

no-image-available

IPC-MIL - Roadmap

PWB Technology Roadmap

Document #:
IPC-MIL
Revision
Original Version
Product Type
Roadmap
Released:  01/18/2012
Language
English
Current Revision
"PWB Technology Roadmap" was presented by Lance Auer, product development engineering, Raytheon Missile Systems Division, at the IPC Conference for the PCB Industry: Critical Issues for the Military Market in Washington D.C., in December 2011.The author explores the developing challenges of PCB design. Design types, digital, power and high speed RF circuits present conflicting requirements of more...
no-image-available

IPC-Roadmap-15 - Roadmap

IPC International Technology Roadmap for Electronic Interconnections-2015

Document #:
IPC-Roadmap-15
Revision
Original Version
Product Type
Roadmap
Released:  02/20/2015
Language
English
Current Revision
The IPC 2015 International Technology Roadmap provides vision and direction for product and process development and the services required to satisfy current and future needs of companies that design, build, buy or specify electronic equipment and materials. The IPC Roadmap is an invaluable resource for any person or company in or having interest in the global electronics supply chain. It is an...
no-image-available

IPC-PCB Technology Trends 2016

IPC-PCB Technology Trends 2016

Document #:
IPC-TT
Revision
2016
Product Type
Industry Report
Released:  05/04/2017
Language
English
Current Revision
Based on data from 118 electronics assembly companies and PCB fabricators worldwide, this report presents data on the current state (2016) of PCB fabrication and assembly, and the industry’s predictions for the data by 2021. The data are segmented by five applications: automotive, defense and aerospace, high-end systems, industrial and medical electronics. Topics covered include board properties...
no-image-available

IPC-PCB Prototype Trends North America 2017

IPC-Trends in the North American Market for PCB Prototypes

Document #:
IPC-PCBPROTOTYPE
Revision
2017
Product Type
Industry Report
Released:  10/16/2017
Language
English
Current Revision
This report shows trends in PCB prototype sales and growth based on data from IPC's North American PCB Statistical Program covering 2014 through mid-2017. Data on prototype sales percentages by month compared to regular-production PCB sales, and estimates of North American prototype market sizes, are reported for all PCBs as well as for rigid PCBs and flexible circuits separately. The vertical...
no-image-available

IPC-World PCB 2016

World PCB Production Report for the Year 2016

Document #:
IPC-WPCB
Revision
2016
Product Type
Industry Report
Released:  09/12/2017
Language
English
This annual IPC report offers consensus estimates of PCB (bare board) production value by country and by product type, and commentary on global and regional PCB industry trends, developed by a team of the industry's leading analysts. It also contains historical data on regional PCB production trends. This year's report includes a special report on trends in high-speed data communications and its...
no-image-available

IPC-Benchmark Study 2017

Study of Quality Benchmarks for Electronics Assembly 2017 - Single User Download

Document #:
IPC-BMK
Revision
2017
Product Type
Industry Report
Released:  10/03/2017
Language
English
This survey-based study covers production data, assembly attributes, yields, defect rates (DPMO), test and inspection methods used, customer returns, supplier performance, customer satisfaction and certification data. Electronics assembly companies can use this report to compare their performance to industry averages. The survey sample includes 89 contract electronics manufacturers and OEMs in...
no-image-available

IPC-PCB Technology Trends 2023

IPC-PCB Technology Trends 2023

Document #:
IPC-TT
Revision
2023
Product Type
Industry Report
Released:  09/28/2023
Language
English
PCB Technology Trends 2023 is based on data from 60 respondents (26 electronics OEMs, 16 PCB fabricators, 12 EMS companies and 6 "other" industry segment participants) worldwide. PCB Technology Trends 2022 presents data on the current state of PCB fabrication and OEM's PCB requirements and their use of emerging technologies. Predictions from both industry segments indicate how these measurements...
1-7 of 7

Coming Soon

IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards