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IPC 4552B Cover

IPC-4552 - Revision B - Standard Only

Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards

Document #:
IPC-4552
Revision
B
Product Type
Standard Only
Released:  07/27/2021
Language
English
Current Revision
IPC-4552B standard sets the requirements for Electroless Nickel / Immersion Gold (ENIG) deposit thickness for applications including soldering, wire bonding, and as a contact finish. IPC-4552B standard is used to specify acceptance criteria to meet performance standards for IPC-6010 family of documents including IPC-6012, IPC-6013 and IPC-6018. The ENIG deposit specified using this document will...
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IPC-4552 - Revision B - Standard Only

プリント基板用無電解ニッケル/置換金(ENIG)めっきの性能仕様

Document #:
IPC-4552
Revision
B
Product Type
Standard Only
Released:  01/05/2026
Language
Japanese
Current Revision
この性能仕様書は、はんだ付、ワイヤーボンディングおよび接点の仕上げ等の用途における無電解ニッケル/置換金(ENIG)めっきの析出厚さに関する要件を定めるものである。 本規格書では、IPC-6010文書群(IPC-6012、IPC-6013、IPC-6018等)に記載する性能基準に適合するための、基板の受入れ/許容基準について規定する。 本書で指定するENIGの析出物は、IPC-J-STD-003のプリント基板のはんだ付性仕様に規定される最上位のコーティング耐久性等級に適合するものである。
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IPC-4552B-Chinese - Standard Only

印制板化学镀镍/ 浸金（ENIG）镀覆性能规范

Document #:
IPC-4552
Revision
B
Product Type
Standard Only
Released:  10/17/2022
Language
Chinese
Current Revision
本性能规范为化学镀镍 / 浸金（ENIG）在包括焊接、金属线键合和作为一种接触表面的应用设置了相应的沉积厚度要求。适用于化学药水供应商、印制板制造商、电子制造服务业（EMS）和原始设备制造商（OEM）。本标准可用于除了那些符合 IPC-6010 系列（IPC-6012、IPC-6013 和 IPC-6018）标准性能要求外的指定的验收标准。使用本规范规定的化学镀镍 / 浸金（ENIG）沉积层也满足 J-STD-003 印制电路板的可焊性规范中涂层耐久性的最高等级要求。
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