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IPC-4553 Standard Only

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Document #:
Revision
A
Product Type
Released:  06/16/2009
Language
English
Current Revision
This specification sets requirements based on performance criteria for the use of Immersion Silver (IAg) as a surface finish for printed circuit boards. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) companies and original equipment manufacturers (OEM). IAg is a thin immersion deposit over copper. It is a multifunctional surface...

IPC-4553 - Revision A - Standard Only

印制板浸银规范

Document #:
Revision
A
Product Type
Released:  11/25/2013
Language
Chinese
Current Revision
简要介绍 英文) 本规范基于性能标准规定了使用浸银作为印制板表面处理的要求。本规范适用于化学药水供应商、印制板制造商、电子制造服务业(EMS)、原始设备制造商(OEM)。浸银是在铜面上沉积一层薄的银。它是一种多功能的表面处理,适用于焊接。也可应用在一些挤入式接触和表面接触。它适合打铝线。浸银保护下面的铜面免受氧化,以超过预期的保存期限。暴露在湿气和诸如硫和氯的空气污染物中,可能给沉积层的使用寿命带来负面影响。这个影响可能会从轻微的变色到焊盘完全的变黑。适当的包装是必需的。注意:本标准,同时建立了对应位置上的单点厚度范围及浸银厚度的上限。共36页。2009年5月发布。2013年4月翻译。

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