The IPC APEX EXPO 2025 Technical Conference Proceedings represent the latest research and developments in printed board materials, design, manufacture and assembly as well as technical papers on Factory of the Future.
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The 2019 IPC APEX EXPO technical conference is one of the most outstanding in the electronics industry. Proceedings from this technical conference include: 98 presentations from 34 sessions, 20 poster papers and 5 buzz session presentations on Automation in Electronics Manufacturing, Adhesives, Advanced Technology, Area Array/Flip Chip/0201 Metric, Assembly and Rework Processes, BGA/CSP Packaging...
The IPC APEX EXPO 2023 Technical Conference Proceedings represent the latest research and developments in printed board materials, design, manufacture and assembly, as well as technical papers on Factory of the Future.
The IPC APEX EXPO 2022 Technical Conference Proceedings represent the latest research and developments in printed board materials, design, manufacture and assembly, as well as technical papers on Factory of the Future.
The IPC APEX EXPO 2024 Technical Conference Proceedings represent the latest research and developments in printed board materials, design, manufacture and assembly as well as technical papers on Factory of the Future.
The IPC APEX EXPO 2021 Technical Conference Proceedings represent the latest research and developments in printed board materials, design, manufacture and assembly, as well as technical papers on Factory of the Future.
The 2020 IPC APEX EXPO technical conference is one of the most outstanding in the electronics industry. Proceedings from this technical conference include: 78 presentations from 29 sessions, 24 poster abstracts and 19 sessions @ the intersections. Advanced Technology, Area Array/Flip Chip/0201, Assembly Processes, BGA Packaging, Black Pad, Business & Supply Chain Issues Counterfeit Electronics...
The 2018 IPC APEX EXPO technical conference is one of the most outstanding in the electronics industry. Proceedings from the technical conference include: 70 presentations from 28 sessions, 24 poster papers and 5 buzz session presentations. Advanced Technology, Area Array/Flip Chip/0201, Assembly Processes, BGA Packaging, Black Pad, Business & Supply Chain Issues Counterfeit Electronics, Design...
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IPC-9242: Guidelines for Microsection Evaluation
IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures
IPC-7527A: Requirements for Solder Paste Application
IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards
IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards
IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard
IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797
IPC-WP-011: Guidance for Strain Gage Limits for Assemblies
J-STD-048A: Notification Standard for Product Discontinuance
IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits
IPC-1401B: Corporate Social Responsibility Management System Standard
IPC -1751B: Generic Requirements for Declaration Process Management
IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards