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IPC Quality Benchmarks for the Electronics Assembly Industry

IPC Quality Benchmarks for the Electronics Assembly Industry

Document #:
IPC-BMK
Revision
2022
Product Type
Industry Report
Released:  08/15/2022
Language
English
Current Revision
The 2022 Quality Benchmarks for the Electronics Assembly Industry is a biennial report released by IPC. The report represents the findings from an online quantitative survey fielded between the dates of September 28, 2001 – October 20, 2021. A total of 59 assembly companies completed the survey, representing both contract electronics manufacturing services (EMS) companies and original equipment...
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IPC Study of Quality Benchmarks for Electronics Assembly 2019

IPC-Study of Quality Benchmarks for Electronics Assembly 2019

Document #:
IPC-BMK
Revision
2019
Product Type
Industry Report
Released:  07/31/2019
Language
English
Study of Quality Benchmarks for Electronics Assembly 2019 is a global survey-based study covering production data, yields, defect rates (DPMO), cost of rework and scrap, customer acceptance of reworked boards, test and inspection methods used, customer returns, supplier performance, customer satisfaction and certification data. Companies that assemble printed boards and other electronic products...
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IPC-Benchmark Study 2017

Study of Quality Benchmarks for Electronics Assembly 2017 - Single User Download

Document #:
IPC-BMK
Revision
2017
Product Type
Industry Report
Released:  10/03/2017
Language
English
This survey-based study covers production data, assembly attributes, yields, defect rates (DPMO), test and inspection methods used, customer returns, supplier performance, customer satisfaction and certification data. Electronics assembly companies can use this report to compare their performance to industry averages. The survey sample includes 89 contract electronics manufacturers and OEMs in...
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Coming Soon

IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards