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IPC-HDBK-005 Handbook

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IPC-HDBK-005 - Handbook

Guide to Solder Paste Assessment

Document #:
IPC-HDBK-005
Revision
Original Version
Product Type
Handbook
Released:  01/01/2006
Language
English
Current Revision
This handbook is a companion to the solder paste standard J-STD-005 and should be considered to be a guide to help assess the applicability of a solder paste for its use in surface mount technology (SMT) processes. This document also suggests some test methods that can help with designing and testing solder pastes. It is intended for use by both vendors and users of solder paste. This document has...
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IPC-HDBK-005 - Handbook

焊膏评估指南

Document #:
IPC-HDBK-005
Revision
Original Version
Product Type
Handbook
Released:  04/24/2019
Language
Chinese
Current Revision
本手册是焊膏标准J-STD-005的配套文件，应该视为帮助评估焊膏在表面贴装（SMT）工艺中使用的适用性指南。本文件还提出了一些可有助于设计和测试焊膏的测试方法。它旨在供焊膏供应商和用户使用。本文件作为指南而编写，以评估用于特定工艺的焊膏的适用性，给出了当前可用的不同材料、环境和工艺变量的大量组合。
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