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IPC-J-STD-005 Standard with amendment(s)

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IPC-J-STD-005 - Standard with Amendment 1

Requirements for Soldering Pastes

Document #:
IPC-J-STD-005
Revision
Original Version
Product Type
Standard with amendment(s)
Released:  06/27/2008
Language
Chinese
This is the Chinese language version of J-STD-005. DOD Adopted 1995Lists requirements for qualification and characterization of solder paste. Test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder pastes are included. Supersedes QQ-S-571. Developed by IPC and EIA. 24 pages. Released January 1995.
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