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Products

IPC-7530 - Standard Only

Útmutató tömegforrasztási (reflow és hullám) folyamatok hőmérsékleti profiljának kialakításához

Document #:
IPC-7530
Revision
Original Version
Product Type
Standard Only
Released:  04/19/2014
Language
Hungarian
Current Revision
MEGHATÁROZÁS> angolul MEGHATÁROZÁS angolul A tömegforrasztás során alapvető fontosságú, hogy mindegyik forraszkötés elérje a minimális forrasztási hőmérsékletet ezzel biztosítható, hogy a forraszanyag és az összeforrasztandó fémfelületek között diffúziós kötés jöjjön létre. A diffúziós kötésnek mindkét forrasztandó fémfelület és a forraszanyag között létre kell jönnie. Ehhez a minimális...

IPC-7801 - Standard Only

再流焊炉工艺控制标准

Document #:
IPC-7801
Revision
Original Version
Product Type
Standard Only
Released:  02/22/2018
Language
Chinese
Current Revision
描述 中文描述 IPC-7801为焊料再流焊炉提供了工艺控制,通过基线和采用一个标准方法获得曲线的周期性验来证明可接受的重复性能,提供了设备的校准和维护指南,本标准的目的是验证再流焊炉的运行参数,不适用于组装产品的温度曲线和工艺参数。 本标准不提供气相工艺的指导。全文18页。于2015年正式发布。2017年8月翻译。

IPC-7093 - Standard Only

底部端子元器件(BTC)设计和组装工艺的实施

Document #:
IPC-7093
Revision
Original Version
Product Type
Standard Only
Released:  03/28/2011
Language
Chinese
Current Revision
本标准描述了采用底部端子表面贴装元器件(BTC)在设计和组装方面的挑战,BTC元器件外部连接由构成元器件整体一部分的金属端子组成。本文件中BTC包括了仅有底部端子并要实施表面贴装的所有类型元器件。包括QFN、 DFN、 SON、 LGA、MLP 和MLF等业界描述性术语。这里所含信息的焦点放在BTCs元器件的关键设计、组装、检验、维修以及和BTC相关的可靠性问题上。 这份文件的目标读者是与电子设计、组装、检验和维修等过程有关的经理、设计和工艺工程师、操作员和技术员。本文件的目的是给正考虑采用锡/铅、无铅、粘合剂或其它形式互连工艺来组装BTC类元器件的那些公司提供实际而有用的资讯。虽然本文件不是包含一切的秘方,但它识别了影响进行稳健和可靠组装的许多特性,可给正面临组装制程问题的元器件供应商提供指导性的信息。全文共68页。2011年3月发布。2014年5月翻译。

IPC-1601 - Standard Only

Handhabung und Lagerung von Leiterplatten

Document #:
IPC-1601
Revision
Original Version
Product Type
Standard Only
Released:  08/30/2010
Language
German
Current Revision
BeschreibunginEnglisch Der einzige Industrie-Standard für das Handling, die Verpackung und Lagerung von Leiterplatten. Die Anwendung dieser Richtlinie soll Leiterplatten schützen vor Verunreinigung, mechanischer Beschädigung, Verschlechterung der Lötbarkeit und Feuchteaufnahme. Berücksichtigt werden Verpackungsmaterialien- und methoden, Produktionsumgebung, Handling und Transport der Produkte...
no-image-available

IPC-1782 - Standard Only

电子产品的制造和供应链可追溯性标准

Document #:
IPC-1782
Revision
Original Version
Product Type
Standard Only
Released:  04/12/2019
Language
Chinese
Current Revision
缺乏统一的元器件可追溯性标准已经导致不必要的资源消耗(例如时间、人力、金钱等)来跟踪事件或部件的来源,并补救相关质量、可靠性等问题。标准缺失也导致难以一致地创建和适当地执行必要的合同。 本标准建立了制造商和供应链可追溯性的最低要求,此要求是基于供需双方协商确定(AABUS)的感知风险。本标准适用于所有产品,制程,组件,部件,元器件,所使用的设备以及由供需双方在印制电路板组件制造以及机械组装中定义的其他项目。
no-image-available

IPC-PCB Technology Trends 2016

IPC-PCB Technology Trends 2016

Document #:
IPC-TT
Revision
2016
Product Type
Industry Report
Released:  05/04/2017
Language
English
Current Revision
Based on data from 118 electronics assembly companies and PCB fabricators worldwide, this report presents data on the current state (2016) of PCB fabrication and assembly, and the industry’s predictions for the data by 2021. The data are segmented by five applications: automotive, defense and aerospace, high-end systems, industrial and medical electronics. Topics covered include board properties...
no-image-available

IPC-9121 - Amendment 1

印制板制造工艺问题解答 修订本1

Document #:
IPC-9121
Revision
Original Version
Product Type
Amendment
Released:  10/08/2020
Language
Chinese
Current Revision
本手册可供任何生产制造或采购印制板的人员作为基本资源。数百张真实的全彩色照片聚焦了650多个印刷电路板工艺缺陷,每个缺陷都有其分析原因和纠正措施。IPC-9121是取代1997年12月发布 的IPC-PE-740A中的PCB部分。2016年3月发布9121英文母标准,2018年年4月发布修订本1,修订本1于2020年4月翻译。详情参见目录。
no-image-available

IPC-HDBK-4691 - Handbook

电子组件操作用粘合剂粘接手册

Document #:
IPC-HDBK-4691
Revision
Original Version
Product Type
Handbook
Released:  01/14/2021
Language
Chinese
Current Revision
本手册的目的是帮助那些必须选择粘合剂粘接或从事粘合剂粘接操作的个人,还为仅涉及电子组装的粘合剂粘接的设计、选型和使用提供指导。
IPC-HDBK-620D CN Cover Image

IPC-HDBK-620 - Handbook

IPC-D-620和IPC/WHMA-A-620操作手册与指南

Document #:
IPC-HDBK-620
Revision
Original Version
Product Type
Handbook
Released:  10/28/2021
Language
Chinese
Current Revision
IPC-HDBK-620 是 IPC-D-620“线缆及线束的设计和关键工艺要求”和 IPC/WHMA-A-620“线缆及线束组件的要求与验收”的配套参考文件和为这些标准中的要求提供支持信息和技术原理。 强烈建议任何想要了解要求背后的“方式”和“原因”的人都强烈推荐本指南文件,并且是从事线缆和线束工艺的工艺和制造工程师的必备文件。
no-image-available

IPC-WP-024 - White Paper

IPC 智能织物结构的可靠性和可洗性白皮书——为市场做好准备

Document #:
IPC-WP-024
Revision
Original Version
Product Type
White Paper
Released:  04/16/2019
Language
Chinese
Current Revision
IPC-WP-024是一份白皮书,讨论了多次洗涤循环后智能织物(电子织物结构)可靠性相关的问题,并强调了工业和研究实验室必须做出的努力。以使电子织物结构更加坚固,能够像市场上的日常织物(例如,内衣、服装、家用织物和技术织物)一样被清洁或洗涤。 研究人员在商用洗衣机和家用洗衣机洗涤剂多次洗涤循环后,为电子织物提供实验室测试的初始可靠性结论。

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Coming Soon

IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-6905: Qualification and Performance Specification for Additively Manufactured Electronics (AME)

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC/JEDEC-9702A: Monotonic Bend Characterization of Board-Level Interconnects

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards

IPC-9716A: Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies

IPC-9711: Generic Requirements for Automated Inspection Process Control

IPC-HERMES-9852 Version 1.7: The Global Standard for Machine-to-Machine Communication in SMT Assembly

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