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IPC-8401 standard provides guidelines for In-Mold Electronics (IME) manufacturing processes, part structures, candidate materials, and production test methods. In-Mold Electronics integrates printed electronics and electrical components into injection molded plastics, creating a three-dimensional smart molded structure. IME technology uses mass production processes, materials, and components. IME...

The IPC-Hermes-9852 standard provides a state-of-the-art communication protocol for machine-to-machine communication for surface-mount technology. Used with IPC-2591, Connected Factory Exchange, IPC-HERMES-9852 can assist any electronics manufacturer, large or small, to align their companies with smart manufacturing and Industry 4.0. Version 1.6 includes updates to SendBoardInfo and capabilities...

IPC-6904 standard establishes and defines the qualification and performance requirements for printed electronics and their forms of component mounting and interconnecting structures on rigid substrates. The substrate can be conductive, semiconductive or nonconductive.

IPC-4413 standard covers finished fabrics woven from low Dk electrical grade glass fiber yarns that are intended as a reinforcing material in laminated plastics for electrical and electronic use. All fabrics covered by IPC-4413 standard are plain weave.

IPC-6012F Redline document shows the changes from IPC-6012E to IPC-6012F in a side-by-side comparison of the two documents. The IPC-6012F redline is available in both electronic and hardcopy format.

IPC-9716 provides requirements for automated optical inspection (AOI) systems to define, set up, establish, and apply process control for manufacturing printed board assemblies, including general and specific process and AOI system conditions. Requirements include inspection parameters, lighting conditions, calibration, detectability, resolution, threshold limits, program setups, measurement...

This standard establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. This standard applies to communication between all executable processes in the manufacture of printed board assemblies, automated, semiautomated and manual, and is applicable to related mechanical assembly and...

IPC-1792 standard establishes requirements for companies to provide assurance that their products have been manufactured in cybersecure environments, ensuring that there has been no risk of impact to the product due to any cybersecurity incident. IPC-1792 requirements specify actions that need to be taken if a cybersecurity incident is detected, identifying all possible affected products.

The IPC-5262 prescribes the minimum design, critical process and acceptance requirements for the application of polymeric materials to electrical/electronic components, modules, printed wiring assemblies and other elements thereof. The intent of IPC-5262 is to establish a baseline of requirements, procedures, practices and process attributes based on lessons learned and best practices that have...

Printed board quality encompasses many parameters, cleanliness being one important parameter. This document defines the recommended general requirements for the cleanliness of unpopulated (bare) single, double-sided and multilayer printed boards. Coverage is given to Ion Chromatography (IC) testing and Ionic cleanliness testing for process control. 6 pages. Released December 2009.

Printed board cleanliness has historically been an unknown factor in the quality assessment of unpopulated (bare) printed boards; this has often been attributed to a lack of understanding of materials and processes. This document addresses the various printed board fabrication processes and how each may impact, directly or indirectly, the final cleanliness of packaged bare printed boards and...

Every electronics manufacturer, whether an original equipment manufacturer (OEM) or electronics manufacturing services (EMS) company, must determine if the unpopulated printed boards entering the assembly process have an adequate level of cleanliness. The question of “how clean is clean enough?” is one that has no definitive answer, as there is no "golden number" for board cleanliness. The issue...

Tackling PCB cleanliness is a tough job; residues on printed circuit boards are directly related to the reliability of the produced hardware and can result in serious failures if not known or monitored. But how do you measure "cleanliness"? How clean is "clean"? The IPC-5701 provides guidance into how these issues should be approached and specified in purchasing documents, addressing levels of...

IPC-T-51 standard provides terms and definitions for the design and manufacture of printed electronics. IPC-T-51 standard enables common language and understanding for the worldwide printed electronics community.

This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies. 19 pages. Released November 2007.

The IPC-2551 standard is part of the IPC Factory of the Future standards establishing the IPC Digital Twin, which is comprised of the Digital Twin Product, Digital Twin Manufacturing and Digital Twin Lifecycle frameworks. Within the Digital Twin Architecture, the IPC-2551 standard stipulates and defines Digital Twin properties, types, complexities and readiness levels. The IPC Digital Twin...

The IPC-9257 standard assists in selecting the test equipment, test parameters, test data and fixturing required to perform electrical test(s) on flexible printed electronics. Electrical testing of flexible printed electronics ensures conformance to electrical design requirements specified in IPC-6902. The IPC-9257 standard defines different levels of testing available to achieve this purpose.

The IPC-6902 standard establishes and defines the qualification and performance requirements for printed electronics and the forms of component mounting and interconnecting structures on flexible substrates.

This standard is intended as a guideline in the proper preparation of a metallographic sample (microsection) of a printed board. The finished microsection is used for evaluating the quality of the laminate system and plated structures (e.g. PTHs and vias). Microsection sample preparation is regarded by many as a highly developed skill. The guidelines in this standard discuss the many variables and...

The European Union’s Restriction of Hazardous Substances (RoHS) legislation has had a profound impact on the electronics industry. One of the restricted substances, lead (Pb), is commonly used in alloys with tin for component finishes, printed board finishes and solders. Pb-free materials directly affect product performance, reliability and service life in many ways. There have been numerous...

This standard, developed jointly by IPC and the Electronic Industries Association (EIA) establishes the construction detail requirements for balls and other terminal structures on Ball Grid Array (BGA) packages. It also establishes a set of designations and expectations for product performance. A large variety of terminal structures are recognized for a wide range of applications ranging from...

Why waste time looking for answers? This handy, easy-to-use troubleshooting guide lists all types of processing problems and solutions for surface mount assembly. Covers bridging, skips, misalignment, placement and more. 38 pages. Released July 1993.

IPC-4121 provides industry-approved guidelines for selecting core constructions for multilayer printed wiring boards (PWBs). The specification sheets in the document categorize the different core constructions by laminate type and nominal thickness. The constructions are rated for characteristics such as dielectric constant (DK), dimensional stability (DS), flatness, smoothness and drillability...

Establishes the specific requirements for organic mounting structures used to interconnect chip components, which in combination form the completed functional organic single-chip module (SCM-L) or organic multichip module (MCM-L) assembly. Includes the quality and reliability assurance requirements that must be met for their acquisition. For use with IPC-6011. 25 pages. Released February 1998.

IPC-1753 Laboratory Declaration Standard will allow for the electronic exchange of laboratory chemical analysis reports between supply chain members. Companies are being asked to provide laboratory analytic data to show compliance with the RoHS Directive and other customer requirements, such as halogen-free. This standard will allow for the expedited exchange of the necessary laboratory...