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Used in conjunction with IPC-2221A, IPC-2225 establishes the requirements and other considerations (thermal, electrical, electromechanical and mechanical) for the design of Single Chip Module (SCM-L), MCM or MCM-L assemblies. Key concepts include adhesive interconnection information, typical die attach materials, microvia material properties and relationships with DFM and DFE.

J-STD-075 picks up where J-STD-020 left off by providing test methods to classify worst-case thermal process limitations for electronic components. Classification is referenced to common industry wave and reflow solder profiles including lead-free processing. The classifications represent maximum process sensitivity levels and do not establish rework conditions or recommended processes for an...

Defines a machine readable input format for Computer Numerical Control (CNC) drilling and routing machine tools used by the printed wiring board industry. The format may be used to transfer drilling and routing information between printed board designers, manufacturers and users or as the output CNC standard from converters that expand higher level design input such as IPC-D-350 data. Provides a...

Covers classification and requirements for finished fabrics woven from quartz fiber yarns that are intended as a reinforcing material in laminated plastics for electrical and electronic use. 13 pages. Released February 1992.

This standard addresses semiconductor flip chip design requirements. Provides information for using standard semiconductor substrates, materials, assembly and test methods with established fabrication, bumping, test and handling practices. Electrical, thermal and mechanical chip design parameters and methodologies are covered in the standard, as well as the reliability aspects associated with...

This standard establishes construction detail requirements for bumps and other terminal structures used for Flip Chip Scale carriers. The specific standards for different terminations are appropriately matched to a particular interconnection process and include such diverse terminations as solder bumps, columns, non-melting stand-offs and conductive polymer deposits. The document articulates a set...

This document examines key issues in advanced packaging techniques. Provides information on what types of parts are available, the techniques and processes necessary for their proper use, possible advantages/disadvantages or problems, how to start implementation and where to find additional information. 138 pages. Released March 1988.

Covers the classification and requirements for finished fabrics woven from "S" glass, electrical grade glass fiber yarns intended as a reinforcing material in laminated plastics for electrical and electronic use. 12 pages. Released February 1992.

This specification covers qualification and performance requirements of rigid mass laminated panels for use in multilayer printed boards. Testing procedures and criteria are addressed. 21 pages. Released July 1994.

Provides information on multichip module technology, including parametric data, design and manufacturing information and a proposed categorization of various approaches to multichip interconnect substrate technologies based on dielectric family. 120 pages. Released August 1992.

Covers the materials, qualification, certification and performance requirements for multilayer polymer thick film (PTF) printed, extrusion deposited, or otherwise applied conductor, insulator and through-hole technology. This specification may also be used for procurement of single and double-sided boards. 59 pages. Released November 1989.

This document will provide insight into the theory behind tin whisker formation as it is known today and, based on this knowledge, potential mitigation practices that may delay the onset of, or prevent tin whisker formation. The potential effectiveness of various mitigation practices will also be briefly discussed. References behind each of the theories and mitigation practices are provided. It...

Provides information on design characteristics and the application of solderless surface mount connectors, including conductive adhesives to aid IC package and board interconnection. 34 pages. Released January 1994.

Contains backplane design information from the fabrication and assembly perspective. Includes sections on design and documentation; fabrication; assembly; repair; and inspection. 17 pages. Revised September 1982.

Describes the usage of libraries within the processing and generation of information files. The data contained within covers both the definition and usage of internal (existing within the information file) and external libraries. The libraries can be used to make generated data more compact and facilitate data exchange and archival. The subroutines within a library can be used one or more times...

Describes an intelligent, digital data transfer format for describing component mounting information. Supplements IPC-D-350 and is for designers and assemblers. Data included are pin location, component orientation, etc. This document is frozen; no future updates are planned. 33 pages. Released January 1995.

Describes the relationship between elements used in electromechanical design and packaging of printed boards. Includes descriptions for logical and physical elements necessary as input to a design system, as well as the network of interconnection description between the various electronic parts. Provides the capability of describing all elements in their final form upon design completion. The...

Describes an intelligent, digital format for transfer of drawings between printed wiring board designers, manufacturers and customers. Also conveys additional requirements, guidelines and examples necessary to provide the data structures and concepts for drawing description in digital form. Supplements ANSI/IPC-D-350. Pertains to four basic types of drawings: master drawings, schematics, assembly...

Guidelines for the assembly of components and mounting hardware to single- and double-sided flexible printed wiring. These guidelines describe the type of materials and processes that may be used to accomplish proper electronic assembly. 30 pages. Released February 1992.

This standard covers the requirements and considerations for the design of multilayer hybrid circuits based on industry manufacturing capabilities. 80 pages. Released December 1989.

Covers requirements and test methods for thermally conductive dielectric adhesives used to bond components in place. Permanent, removable and self-shimming adhesives are addressed. 18 pages. Released January 1995.

Defines guidelines for choosing sizes of printed wiring boards using standard fabrication panel sizes. 4 pages. Reaffirmed September 1991.

Covers finished fabrics woven from aramid yarns that are intended as reinforcing material in laminated plastics for electrical and electronic use. All fabrics covered by this specification are plain weave. 9 pages. Released June 1990.

This document addresses preconditioning of non-IC components used in electronic assembly. Will the components work with your process? The goal of these manufacturing process simulations is to ensure that the components chosen meet expected reliability requirements after exposure to factory processes. Developed for users and manufacturers, the procedure consists of a set of simulations for non-IC...

This document describes the manufacturing solder process limits that components subjected to IPC-9501, IPC-9504 and IPC/JEDEC J-STD-020 would survive. It does not include optimum conditions for assembly, but provides guidelines to ensure components are not damaged. This document applies to both surface-mount (SM) and through-hole (TH) components that are wave soldered, reflowed or hand soldered...

Mechanical bend and shock tests are routinely performed on SMT assemblies to ensure that they can sustain anticipated production, handling and end use conditions. The strains and strain rates applied to SMT assemblies during bend and shock testing can lead to a variety of failure modes in the vicinity of the solder joints. This document provides test methods to evaluate the susceptibility of...

Survey-based study presents data and analysis on the EMS industry, examining trends in sources of revenue, revenue per employee, services offered, markets served, manufacturing technology, capital investment, spending on equipment and materials and market size including forecasts and potential for market expansion. This study is based on data provided by a representative sample of 120 EMS...

Covers the information and data to be collected during the generation and use of phototools to improve artwork quality, thereby improving yields downstream. It also helps establish and maintain ISO 9000 certification and SPC by facilitating troubleshooting, standardizing the process for both experienced and inexperienced operators and by identifying process improvements for the ultimate...

Printed board flatness is largely affected by a change in intrinsic properties through exposure to variances in temperature. The worst case deviation of the printed board from flatness may be at room temperature, peak temperature during reflow, or at any temperature in between. Printed board flatness must therefore be characterized during the entire reflow thermal cycle, and not solely at room...

This document standardizes the performance parameters for air moving devices. The phrase "air moving device" (or "air mover") refers to equipment such as, fans, blowers and other forced air movement technologies. These air moving devices are used in the electronics industry for the cooling of heat-producing components, and range from small devices mounted directly to hot components such as...

Will the components work with your process? That determination is the goal of these manufacturing process simulations; to ensure that components chosen meet expected reliability requirements after exposure to factory processes. This document specifically addresses preconditioning of components. Developed for users and manufacturers, the procedure consists of a set of simulations for IC component...

The IPC/JEDEC-9301document is an effort to standardize and document some of the basic tenets of a typical Finite Element Analysis (FEA) model, as well as, to educate new designers (and in some cases even experienced designers) on the basic information and best practices that should be captured and provided to technical reviewers of the results of FEA data.

This document is a tool for a customer or supplier organization's internal audit group to assess a statistical process control (SPC) system against the requirements of IPC-9191. This document should be used by customers and suppliers of any size and for any commodity. This tool can be used to perform an assessment of the use of SPC at both organizational and process levels. The questions in this...

This publication is intended to characterize the frature strength of a component's board level-interconnect by providing a common method of establishing the fracture resistance to flexural loading that may occur during conventional non-cyclic board assembly and test operations. The document is applicable to surface mount components attached to printed wiring boards using conventional solder reflow...

The purpose of this specification is to define standard practices for handling various kinds of optical fiber and to define the specifications and guidelines to be used in the design of carriers for these fibers in component manufacturing. This document is identified in the overarching IPC-0040, Optoelectronic Assembly and Packaging Technology. This standard does not define a particular carrier...

The IPC-8921 standard provides and defines industry test methods and guidance for providing performance data on key characteristics and durability of woven and knitted e-textiles integrated with conductive fibers, conductive yarns and/or wires. The IPC-8921 standard also provides classifications for woven and knitted e-textiles, fibers, yarns and wires and includes 20 new terms and definitions for...

IPC-8701 presents acceptance guidelines for the solar panel in final module assembly. The intent of this standard is to cover crystalline solar modules.Some of the content may be applicable to other photovoltaic modules such as thin film. The standard reviews and includes acceptance guidelines for incoming and finished frames, frame assembly, sealant, tape, junction box assembly, and bus bar...

This redline provides a side-by-side comparison the changes from Revision C to Revision D of IPC-7711/21.

Encapsulation, for the purpose of IPC-7621 standard, is defined as a low pressure molded thermoplastic, e.g., polyamide, which is brought to a liquid state and injection molded and (rather quickly) returned to a temperature below its melting point., forming a durable yet pliable (rubbery-like) form. The desired performance characteristics of low pressure molding (LPM) encapsulation depend on the...

This standard establishes a Market Classification System and Level Classification System for printed electronics assemblies and provides a list of performance criteria and testing methods. It provides a standardized product category structure for designing and manufacturing printed electronics and assemblies which conform to industry-established performance metrics as determined by accepted...

Determines the nomenclature, definitions and requirements for materials made from nonwoven "E" glass fibers. IPC-4130 also includes specification sheets for selecting and purchasing these materials. 14 pages. Released September 1998. Equivalent to IEC Publicly Available Specification (PAS) 62212

Determines the nomenclature, chemical and physical requirements of paper made from cellulose fibers for PWB fabrication. IPC-4110 also includes specification sheets for selecting and purchasing these materials. 11 pages. Released August 1998.

This document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components. Applications include the following: flexible PWB-to-glass, flexible PWB-to-rigid PWB, flip chip-to-glass, flip chip-to-flexible PWB, flip chip-to-rigid PWB, and fine pitch SMD. The adhesive film may be supplied pre-attached to a flexible circuit or...

IPC-3406 offers guidelines for selecting electrically conductive adhesives for use in electronics manufacturing as solder alternatives. The process discussion attempts to stay within the bounds of the existing solder assembly infrastructure. Both major types of adhesives, isotropic (conducting equally in all directions) and anisotropic (unidirectional conductivity) are covered. Polymer adhesives...

This standard establishes the requirements for generation of electronic symbols used in the documentation of electronic diagrams that define the electrical interconnectivity of electronic products. The descriptions pertain to schematic symbols, logic symbols or Boolean truth tables required to define the circuit configuration. Where appropriate, the standard also includes methodology for defining...

Originally developed for J-STD-001B, it is also applicable to current assembly standards. Electronics manufacturers are faced with the difficult task of proving that a candidate manufacturing process can produce acceptable hardware, either to the customer of the product, or for internal quality control. Users have to determine many of the process qualification steps on their own. This document...

This standard addresses the industry need for exchange of information regarding the materials used to protect products during shipment between supply chain partners. This standard is one of several in the 175x series of standards that permits segmentation of declaration details based on the subject and scope of the declaration. This standard describes essential information exchange content with...

IPC-1756 establishes the requirements for exchanging manufacturing data between suppliers and customers for electrical and electronic products. IPC-1756 establishes 23 fields for declaration of manufacturing data supported by Scriba and other tools developed for use between users and suppliers. The type of manufacturing information includes sensitivity to moisture and high temperature, different...

IPC 1753 WAM1 Laboratory Declaration Standard will allow for the electronic exchange of laboratory chemical analysis reports between supply chain members. Companies are being asked to provide laboratory analytic data to show compliance with the RoHS Directive and other customer requirements, such as halogen-free. This standard will allow for the expedited exchange of the necessary laboratory...

This document describes a PWB fabrication data quality rating system used by fabricators to evaluate incoming data package integrity. Includes information on conformance to both fabricator and customer design rules and can be used by printed board designers as an output quality check. 16 pages. Released February 1999.