Skip to main content
  • My Location
    • Global Home Page
    • China Mainland
    • Europe
    • India & Southeast Asia
    • Japan
    • México
    • Republic of Korea
    • Taiwan
    • U.S. & Canada
  • Cert Portal (CQI)
  • Store
  • Membership
    • Membership Home Page
    • Membership Benefits
    • Get Started with Your Membership
    • Member Directory
    • Online Membership Application
    • Renew Membership Online
    • Membership Pricing
Cart

Hello, Sign In
My Account

  • Sign in
  • Don't have an account yet? Start here.
  • My Profile
  • View Orders
  • My Dashboard
  • My Electronics U
  • Help
electronics.org
Menu
Main navigation
  • Featured Standards
    • IPC-A-610
    • IPC-J-STD-001
    • IPC/WHMA-A-620
    • IPC-2591
    • IPC-1791
    • IPC-6012
    • IPC-6018
    • IPC-7711/21
  • Product Types
    • Certification
      • CQI
    • Handbooks & Guides
      • Desk Reference Manual
      • Handbook
      • Reference Materials
      • Training & Reference Guide
    • Illustrations/Art
      • Illustrations/Art
    • Industry Intelligence
      • Industry Report
      • Intelligence Subscription
      • Roadmap
    • Standards
      • Addendum
      • Addendum with amendment(s)
      • Amendment
      • Appendix
      • Development Packet
      • Errata
      • Handbook
      • Redline Standard
      • Schema
      • Standard Only
      • Standard with amendment(s)
      • Test Data Tables
      • Update
    • Technical Presentations
      • Conference Presentation/Proceedings
    • Technical Reports & White Papers
      • Industry Report
      • Study/Technical Report
      • White Paper
    • Test Board Schematics & Tools
      • Gerber Coupon Generator Subscription
      • Gerber Files
  • Topics
    • Advanced Packaging
    • Automotive Electronics
    • Conformal Coating
    • e-Textiles
    • Environmental Regulations
    • Factory of the Future
    • IPC CFX
    • PCB Design
Close
Main navigation
  • Featured Standards
    • IPC-A-610
    • IPC-J-STD-001
    • IPC/WHMA-A-620
    • IPC-2591
    • IPC-1791
    • IPC-6012
    • IPC-6018
    • IPC-7711/21
  • Product Types
    • Certification
      • CQI
    • Handbooks & Guides
      • Desk Reference Manual
      • Handbook
      • Reference Materials
      • Training & Reference Guide
    • Illustrations/Art
      • Illustrations/Art
    • Industry Intelligence
      • Industry Report
      • Intelligence Subscription
      • Roadmap
    • Standards
      • Addendum
      • Addendum with amendment(s)
      • Amendment
      • Appendix
      • Development Packet
      • Errata
      • Handbook
      • Redline Standard
      • Schema
      • Standard Only
      • Standard with amendment(s)
      • Test Data Tables
      • Update
    • Technical Presentations
      • Conference Presentation/Proceedings
    • Technical Reports & White Papers
      • Industry Report
      • Study/Technical Report
      • White Paper
    • Test Board Schematics & Tools
      • Gerber Coupon Generator Subscription
      • Gerber Files
  • Topics
    • Advanced Packaging
    • Automotive Electronics
    • Conformal Coating
    • e-Textiles
    • Environmental Regulations
    • Factory of the Future
    • IPC CFX
    • PCB Design
Contact Us

Search results

Breadcrumb

  1. Global Home
  2. Store
  3. Search results

Your results

  • 9
  • (-) Automotive
  • (-) Printed Boards
  • Clear filters
  • Current Revision Only

  • Standards (9)
    • Addendum (8)
    • Addendum with amendment(s) (1)

  • (-) Automotive (9)
  • Medical (3)
  • Space and Military (15)

  • (-) Printed Boards (9)
  • Soldering (12)

  • Board Fab (9)
  • Test (8)

Products

no-image-available

IPC-6012 - Revision F - Addendum - Automotive

Automotive Applications Addendum to IPC-6012F Qualification and Performance Specification for Rigid Printed Boards

Document #:
IPC-6012
Revision
F
Product Type
Addendum
Released:  12/01/2025
Language
English
Current Revision
The IPC-6012FA Addendum, when required by procurement documentation/drawings, supplements or replaces specifically identified requirements of IPC-6012 revision F, for rigid printed boards that must survive the vibration and thermal cycling environments of electronic interconnects within the automotive industry.
IPC-6012EA Cover Image

IPC-6012 - Revision E - Addendum - Automotive

Automotive Applications Addendum to IPC-6012E Qualification and Performance Specification for Rigid Printed Boards

Document #:
IPC-6012
Revision
E
Product Type
Addendum
Released:  11/30/2021
Language
English
Current Revision
The IPC-6012EA Addendum, when required by procurement documentation/drawings, supplements or replaces specifically identified requirements of IPC-6012 revision E, for rigid printed boards that must survive the vibration and thermal cycling environments of electronic interconnects within the automotive industry. The addendum includes updated requirements for lifted lands, pattern feature accuracy...
no-image-available

IPC-6012 - Revision D - Addendum with Amendment 1 - Automotive

Automotive Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards

Document #:
IPC-6012
Revision
D
Product Type
Addendum with amendment(s)
Released:  12/01/2018
Language
English
The IPC-6012DA-WAM1 Addendum, when required by procurement documentation/drawings, supplements or replaces specifically identified requirements of IPC-6012D, Revision D, for rigid printed boards that must survive the vibration and thermal cycling environments of electronic interconnects within the automotive industry. The amendment changes to this document includes updated requirements for lifted...

IPC-6012 - Revision D - Addendum - Automotive

Automotive Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards

Document #:
IPC-6012
Revision
D
Product Type
Addendum
Released:  04/01/2016
Language
English
This Addendum, when required by procurement documentation/drawings, supplements or replaces specifically identified requirements of IPC-6012D, Revision D, for rigid printed boards that must survive the vibration and thermal cycling environments of electronic interconnects within the automotive industry.
no-image-available

IPC-6012 - Revision E - Addendum - Automotive

リジッドプリント板の認定および性能仕様車載用途向け追加規格

Document #:
IPC-6012
Revision
E
Product Type
Addendum
Released:  06/14/2022
Language
Japanese
Current Revision
購入仕様書/図面でIPC-6012EA追加規格の適用を要求される場合、本追加規格は、振動および熱サイクル環境に耐えることが求められるリジッドプリント板に対し、IPC-6012E-リビジョンEに記載する具体的な特定要件を補完する、もしくは置き換えるものである。今回の本文書の改訂では、次の要求事項への更新が行われた:ランド浮き、パターン形状精度、絶縁体除去(例:ウィッキング)、ソルダマスク厚さ、清浄度、適合性と信頼性試験。
no-image-available

IPC-6012 - Revision E - Addendum - Automotive

刚性印制板的鉴定及性能规范汽车应用补充标准

Document #:
IPC-6012
Revision
E
Product Type
Addendum
Released:  06/14/2022
Language
Chinese
Current Revision
IPC-6012EA 附录在采购文件/图纸要求时,补充或替代 IPC-6012E 修订版 E 的明确要求,适用于必须经受住汽车行业电子互连的振动和热循环环境的刚性印制板。 本文档的修订更改包括对提升焊盘、图案特征精度、电介质去除(例如芯吸)、阻焊层厚度、清洁度和适用性以及可靠性测试参数的更新要求。

IPC-6012 - Revision D - Addendum - Automotive

刚性印制板的鉴定及性能规范汽车要求附件

Document #:
IPC-6012
Revision
D
Product Type
Addendum
Released:  11/18/2016
Language
Chinese
Current Revision
简要介绍 (英文) 当采购文件/图纸有要求时,本附件补充或替代IPC-6012D中的特殊鉴定要求,以确保汽车行业的印制板的可靠性可以经受住振动和热循环环境下的电气连接。2016年4月发布。2016年8月翻译

IPC-6012 - Revision D - Addendum - Automotive

Ergänzung für Anwendungen der Automobilbranche zu IPC-6012D-DE Qualifikation und Leistungsspezifikation für starre Leiterplatten

Document #:
IPC-6012
Revision
D
Product Type
Addendum
Released:  01/26/2017
Language
German
Current Revision
Diese Ergänzung modifiziert oder ersetzt, falls in der Beschaffungsdokumentation oder den Zeichnungen gefordert, spezielle Anforderungen von IPC-6012D-DE für starre Leiterplatten, die Vibrationen und thermische Zyklen in den Umgebungsbedingungen für elektronische Verbindungen in der Automobilbranche überstehen müssen. Erschienen im April 2016. Übersetzt im September 2016.
no-image-available

IPC-6012 - Revision D - Addendum - Automotive

リジッドプリント板の認定および性能仕様車載用途向け追加規格

Document #:
IPC-6012
Revision
D
Product Type
Addendum
Released:  05/31/2019
Language
Japanese
本追加規格は、車載製品に使用するためのIPC-6012Dのクラス3要件に対する例外を規定している。
1-9 of 9

Coming Soon

IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-6905: Qualification and Performance Specification for Additively Manufactured Electronics (AME)

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC/JEDEC-9702A: Monotonic Bend Characterization of Board-Level Interconnects

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards

IPC-9716A: Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies

IPC-9711: Generic Requirements for Automated Inspection Process Control

IPC-HERMES-9852 Version 1.7: The Global Standard for Machine-to-Machine Communication in SMT Assembly

Receive Email Updates from Global Electronics Association

electronics.org

Global Electronics Association
3000 Lakeside Drive, 105 N 
Bannockburn, IL 60015 
PH + 1 847-615-7100 
8:00 a.m. to 5:00 p.m. CST

EMAIL: contact@electronics.org

 

Contact Us

Footer Navigation
  • WHMA
  • Electronics Foundation
  • I-Connect007
Footer Secondary Navigation
  • About Us
  • Blog
  • FAQ
  • Careers
  • USPAE
© 2026 Legal Name: IPC International Inc, DBA Global Electronics Association
Footer Bottom Navigation
  • Cookie
  • Disclosure / Legal
  • Privacy Policy
  • Return Policy
  • LinkedIn
  • YouTube
  • Instagram
  • Facebook
  • Flickr