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The IPC-9202A, Material and Process Characterization/Qualification Test Protocol that records changes in Surface Insulation Resistance (SIR) on a representative sample of a printed circuit assembly (PCA). It quantifies any deleterious effects that might arise from solder flux or other process residues left on external surfaces after soldering, which can cause unwanted electro-chemical reactions...

The IPC-1401A standard specifies the requirements and best practice guidelines for an effective corporate social responsibility (CSR) management system to help an enterprise integrate CSR as a customer requirement into products and value chain activities, as well as to identify and manage CSR risks and opportunities through cooperation with customers and suppliers, to enhance the competitive...

The IPC-9709A standard guideline document establishes an Acoustic Emission (AE) method to enhance evaluation of the performance and reliability of surface mount attachments of electronic assemblies during mechanical loading.

The IPC-6017A standard defines the electrical, mechanical, and environmental requirements specific to embedded passive and active circuitry in printed boards. These requirements are in addition to the applicable requirements of other performance specification(s) (e.g., J-STD-001).

This is the document all process engineers must have! Useful for day-to-day problem solving, it contains case histories of problems and corrective action in the design, manufacture, assembly and testing of printed wiring products. Each section has been updated to reflect today's manufacturing challenges. Sections address documentation, phototooling, raw materials, mechanical operations, hole...

Provides requirements for dielectric adhesives to hold components in place from the mounting to the soldering process and identifies test methods to ensure their long term properties. 9 pages. Released December 2014.

This document provides the designer/user with guideline information related to the use of pressure sensitive adhesives (PSAs) for fabrication and assembly of flexible, rigid or rigid-flex printed boards, membrane switches and component attachments. It also provides information on adhesive types available, their inherent strengths, weaknesses, limitations and correct processes needed for creating...

Establishes nomenclature and requirements for solid carbide twist drills with four-faceted drill points used in the fabrication of printed boards. 9 pages. Revised April 1994.

This specification establishes the qualification and performance requirements for encapsulated discrete wire interconnection boards with wires that terminate in plated holes. 62 pages. Revised May 1990.

Now updated to align with IPC-7912A for end item DPMO, this document defines consistent methodologies for computation of in-process defects per million opportunities (DPMO) metrics for any evaluation stage in the assembly process. It is intended for use in measuring in-process assembly steps rather than end product determination. Calculation of completed item DPMO is addressed in IPC-7912A. A...

This guideline describes flexibility and stretchability testing to evaluate printable electronics for stretchable and wearable applications. 26 pages. Released March 2017

The IPC-6903A standard provides 62 additional terms and definitions for the design and manufacture of printed electronics. The IPC-6903A standard creates a common language and understanding for the worldwide printed electronics community.

IPC-6012E-AM1 is an Amendent to the IPC-6012E that clarifes the distinction between receding and dewetting solder in reflowed SPb or HASL coatings. The Amendment also provides amended criteria for minimum external conductor thickness of the finished printed board and new acceptance criteria for the minimum thickness of internal plated layers

IPC-6013D-AM1 is an amendment makes changes to the existing acceptance criteria for copper wrap plating measurements as defined by IPC-6013D. IPC-6013D-AM1 is an amendment which implements a dual criterion for Class 3 copper wrap plating, based on design effectivity (before and after July 01, 2018), so as not to impose onto legacy designs any additional qualification activity associated with...

The IPC-J-STD-006C-AM1 amendment provides better detail of a solder alloy's maximum allowed deviation about the nominal level of the element's mass than was provided in past alloy standards. The IPC-J-STD-006C-AM1 amendment provided information on negative effects of adding rare earth elements to specific, heavy tin-containing, lead-free solder alloys and propensity of tin whisker formation...

Amendment 1 to IPC-7711/21C, the document provides procedures for removal and installation of D-Pak components

IPC J-STD-001JS Space and Military Addendum supplements or replaces specifically identified requirements of IPC J-STD-001J requirements for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space and military applications.

IPC J-STD-001JA/IPC-A-610JA is the automotive addendum to J-STD-001J and IPC-A-610J. It provides criteria to ensure the reliability of soldered automotive electrical and electronic assemblies in the field under harsh environments and considers automated high-volume production. IPC J-STD-001JA/IPC-A-610JA addendum is not a standalone document, and it must be used in conjunction with J-STD-001J and...

The IPC-A-610HC Telecom Addendum to IPC-A-610H Acceptability of Electronic Assemblies provides specific requirements for telecommunications products when it is specifically required by procurement documentation. Information in this document either supplements or replaces specifically identified requirements of IPC-A-610 Revision H by providing additional requirements to ensure that electrical and...

IPC-T-50N document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing English as a second language could understand the subtleties of the meaning. IPC-T-50N contains over 550 new or revised terms, including new terminology for via structures, surface mount device...

The IPC-A-600K is the definitive illustrated guide to printed board acceptability! The IPC-A-600K is a four-color document providing photographs and illustrations of the target, acceptable and nonconforming conditions that are either internally or externally observable on bare printed boards. Make sure your operators, inspectors, and engineers have the most current industry consensus information...

IPC/WHMA-A-620E-S space addendum provides additional requirements to IPC/WHMA-A-620E standard to ensure the reliability of cable and wire harness assemblies that must survive the vibration and thermal excursions encountered getting to and operating in the military and space environments. IPC/WHMA-A-620E-S cannot be used as a standalone document. It must be used with the base standard IPC/WHMA-A...

The IPC-6012EM Addendum, when required by procurement documentation/drawings, supplements or replaces specifically identified requirements of IPC-6012E, for rigid printed boards that must meet requirements to high reliability medical device applications. IPC-6012EM is the only global industry-consensus standard for Medical Applications to Qualification and Performance Specifications for Rigid...

The IPC-6012FS space addendum provides exceptions to IPC Performance Class 3 requirements of the IPC-6012F for use in space and military avionics product. Exceptions include changes to acceptance criteria and/or sample size and test frequency for production lot acceptance testing. The IPC-6012FS covers requirements for rigid printed boards to survive vibration, extreme thermal cycling and ground...

The IPC-6012FA Addendum, when required by procurement documentation/drawings, supplements or replaces specifically identified requirements of IPC-6012 revision F, for rigid printed boards that must survive the vibration and thermal cycling environments of electronic interconnects within the automotive industry.