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Surface mount pad cratering typically initiates prior to detection by existing electrical monitoring test methods. There are limited instrumentation techniques that are currently available that can identify non-electrical damage and its location to a high degree of accuracy. This guideline document establishes an acoustic emission (AE) method to evaluate the performance and reliability of surface...

While there are a variety of industry test vehicles for the examination of materials compatibility, most available test boards leave something to be desired as there is often a dramatic difference in materials between such test boards and produced assemblies. A test vehicle was needed which could be used for both ion chromatography and SIR testing that would be more representative of mainstream...

IPC-7801 provides process control for solder reflow ovens by baseline and periodic verifications of oven profiles using a standard methodology to demonstrate acceptable oven performance repeatability. Equipment calibration and maintenance guidelines are provided. This standard is intended to verify the operating parameters of the reflow oven. This standard is not intended for the assembly product...

Cleaning of stencils and misprinted PCBs has taken an increasingly important role in surface mount technology. Fine and ultra-fine pitch lands, together with other advanced packages, place new demands on stencil cleaning. Paste volume is a critical issue for fine, ultra-fine, chip-scale, BGA and flip-chip components. Insufficient solder due to clogging of stencil apertures is a primary cause of...

This standard describes the design and assembly challenges for implementing Bottom Termination surface mount Components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body. The BTCs in this document include all types and forms of bottom-only termination components intended for surface mounting. This includes such industry descriptive...

The IPC-7091 intends to provide useful and practical information to those who are designing, developing or using 3D-packaged semiconductor components or those who are considering 3D package implementation. The 3D semiconductor package may include multiple die elements—some homogeneous and some heterogeneous. The package may also include several discrete passive SMT devices, some of which are...

The successor to the IPC-SM-782A is here! The document covers land pattern design for all types of passive and active components, including resistors, capacitors, MELFs, SSOPs, TSSOPs, QFPs, BGAs, QFNs and SONs. The standard provides many brand new features, including an intelligent land pattern naming convention, zero component rotations for CAD systems, and a set of three separate land pattern...

This document describes the design and assembly challenges for implementing passive and active components, in either formed or placed methodology, into a printed board. It provides useful and practical information to decision makers of formed or placed, passive or active components and helps establish inspection techniques, testing processes, and reliability validations. Users will also learn...

IPC-2591 standard establishes the requirements for the omni-directional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. The IPC-2591 standard applies to communication between all executable processes in the manufacture of printed board assemblies, automated, semi-automated and manual, and is applicable to related mechanical assembly...

IPC-2591 version 1.1 provides updates to several CFX messages since the original IPC-2591 version release. IPC-2591 standard establishes the requirements for the omni-directional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. IPC-2591 standard applies to communication between all executable processes in the manufacture of printed...

The purpose of this standard is to provide requirements and best practices for EMS companies to ensure protection of intellectual property for their customers. By using this standard, EMS companies can provide their customers assurance that the intellectual property built into their circuit boards is protected. The document is also a companion to IPC-1071 for printed circuit board manufacturers...

Status of the technology discussion on the various methodologies for mounting and interconnecting active devices to a variety of substrate materials is summarized in this document. Reviews mounting techniques of tape automated bonding (TAB), chip on board (COB) and flip chip. Examinations of the most commonly used substrate options of laminate, ceramic and silicon are also reviewed. Editor: John...

The IPC-2231 standard provides guidelines for establishing a best practice methodology for use in developing a formal DFX (Design for Manufacturing, Fabrication, Assembly, Testability, Cost, Reliability, Environment, Reuse) process for layout of printed board assemblies that utilize surface mount and through hole devices.

IPC-1791 provides minimum requirements, policies and procedures for printed board design, fabricating and assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products. Demonstration of the ability to meet and maintain the requirements of IPC-1791 as trusted design, fabricator or assembly organization...

The IPC-WP-026 white paper explores blockchain as an emerging technology that has a core strength in providing an immutable, auditable, transparent and secure environment for data exchanges. These advantages make it a prime candidate for implementation in the electronics industry. The IPC-WP-026 white paper explores blockchain and its limitations and challenges. It also provides a few directions...

Manufacturers of high reliability electronics have been working for many years to mitigate the deleterious effects of tin whisker formation. One highly effective means to suppress the growth of tin whiskers is to replace the pure tin plating with reflowed tin-lead solder. One approach is to fully consume the tin plating by tin-lead solder during the SMT reflow process. This phenomenon of tin...

The lack of a uniform component traceability standard has caused an unnecessary consumption of resources (e.g., time, people, money, etc.) to track events or parts to their sources and to remedy any quality, reliability, etc., issues. Lack of a standard has also made it difficult to uniformly create and appropriately enforce the necessary contracts. This standard establishes minimum requirements...

IPC J-STD-001JS 航天和军事补充标准补充或取代了 IPC J-STD-001J 中针对焊接电气和电子组件的特定要求，这些组件必须能在航天和军事应用振动与热循环环境下运行。

The PERM Lead-Free Manhattan Project (LFMP) was established to identify the technology and knowledge gaps relevant to the implementation of commercially available Pb-free product in Aerospace & Defense Systems. These knowledge gaps threaten to affect the safety, performance and reliability of Aerospace & Defense systems, which cannot be compromised. Investment is required to close these knowledge...

This file shows significant changes in J-STD-001 from Revision D to Revision E.

The problem of counterfeit components continues to escalate. It is no longer limited to high value items like semiconductors. It can include connectors, resistors, passive components or anything that is in demand. What more could you be doing to ensure that the components you purchase are genuine? What can you do about component traceability? Jack Stradley, Manager, Business Development &...

This file shows significant changes in IPC-A-610 from Revision D to Revision E.

This standard helps companies achieve intended outcomes of a supply chain social responsibility management system, creating value for the company, its customers, its suppliers and other stakeholders. Users of this standard can expect the following outcomes: Enhancement of working conditions, environmental performance and ethics level of the supply chain Fulfillment of compliance obligations and...

The IPC Solder Products Value Council’s Technical Subcommittee Report “Take Action Limits (TAL) for SAC305 Lead Free Soldering Processes Utilizing Solder Baths/Pots” reports on research on take action limits of solder pot contamination for SAC305 lead-free solder. As opposed to one maximum contamination level, the IPC SPVC opted to identify three action levels: Normal operation defined as the...

Ce document essentiel pour l’industrie fournit des descriptions et des illustrations de la terminologie de l’industrie d’assemblage électronique afin d’aider les utilisateurs et leur clients à casser les barrières linguistiques. La révision M contient plus de 220 termes nouveaux ou révisés, incluant la nouvelle terminologie pour les procédés de tropicalisation, d’enrobage et d’encapsulation, la...