Products

IPC-7912 - Revision A - Standard Only

End-Item DPMO for Printed Circuit Board Assemblies

Document #:
IPC-7912
Revision
A
Product Type
Standard Only
Released:  01/01/2004
Language
English
Finally - an end to the confusion when calculating defect opportunities for benchmarking! For customers and manufacturers, it seems like every company has a unique way of calculating defects and then reporting on quality. In a complex electronics assembly operation, is it best to calculate using the number of components? The number of leads? What about solder joints? How can companies calculate...
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IPC-A-620 - Revision B - Standard Only

Requirements and Acceptance for Cable and Wire Harness Assemblies

Document #:
IPC/WHMA-A-620
Revision
B
Product Type
Standard Only
Released:  10/30/2012
Language
English
Amendment 1 to IPC/WHMA-A-620B This amendment provides resolution to some internal conflicts, aligns common criteria to other IPC standards, and corrects some editorial errors. This amendment is only to be used in conjunction with IPC/WHMA-A-620 Revision B, October 2012. Follow your company policy and procedures to make pen and ink changes or notations to the published IPC/WHMA-A-620 Revision B...
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IPC-T-50- Revision N - Standard Only

电子电路互连与封装术语及定义

Document #:
IPC-T-50
Revision
N
Product Type
Standard Only
Released:  01/13/2023
Language
Chinese
Current Revision
IPC-T-50N-CN文件旨在为电子行业中常用的词汇和术语提供其定义。本文件所规定的定义充分详细地阐明了术语，以便以英语为第二语言的读者能够理解含义的细微之处。IPC-T-50N-CN包含550多个新的或修订的术语，包括通孔结构、表面贴装器件类型、焊料凸点、焊料合金、焊接、退润湿、电路板制造工艺和测试的新术语。
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IPC-J-STD-006 - Revision B - Standard with Amendments 1 & 2

Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications

Document #:
IPC-J-STD-006
Revision
B
Product Type
Standard with amendment(s)
Released:  10/22/2009
Language
English
This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon and powder solders for electronic soldering applications; and for ‘‘special’’ electronic grade solders. This is a quality control standard and is not intended to relate directly to the material’s performance in the manufacturing process. Solders for...
IPC-1791C Cover Image

IPC-1791 - Revision C - Standard Only

Trusted Electronic Designer, Fabricator and Assembler Requirements

Document #:
IPC-1791
Revision
C
Product Type
Standard Only
Released:  03/22/2023
Language
English
IPC-1791C provides minimum requirements, policies and procedures for printed board design, fabrication, assembly, and cable and wire harness assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products. These trusted sources shall ensure quality, supply chain risk management (SCRM), security and chain of...
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IPC/JEDEC-J-STD-609 - Revision B - Standard Only

Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes

Document #:
IPC/JEDEC-J-STD-609
Revision
B
Product Type
Standard Only
Released:  11/01/2016
Language
English
This standard provides a marking and labeling system that aids in assembly, rework, repair and recycling and provides for the identification of: those assemblies that are assembled with lead-containing or lead-free solder; components that have lead-containing or lead-free second level interconnect terminal finishes and materials; the maximum component temperature not to be exceeded during assembly...
IPC-J-STD-004C Cover Image

IPC-J-STD-004 - Revision C - Standard Only

Requirements for Soldering Fluxes

Document #:
IPC-J-STD-004
Revision
C
Product Type
Standard Only
Released:  02/28/2022
Language
English
The IPC J-STD-004C standard prescribes general requirements for the classification and characterization of fluxes for high quality solder interconnections. The IPC J-004C standard may be used for quality control and procurement purposes.
IPC-1791B Cover Image

IPC-1791 - Revision B - Standard Only

Trusted Electronic Designer, Fabricator and Assembler Requirements

Document #:
IPC-1791
Revision
B
Product Type
Standard Only
Released:  09/15/2021
Language
English
IPC-1791B standard provides minimum requirements, policies and procedures for printed board design, fabrication, and assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products. IPC-1791B expands the standard’s requirements to account for trusted sources of cable and wire harness assemblies.
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IPC-1791 - Revision A - Standard Only

Trusted Electronic Designer, Fabricator and Assembler Requirements

Document #:
IPC-1791
Revision
A
Product Type
Standard Only
Released:  02/20/2020
Language
English
IPC-1791A standard provides minimum requirements, policies and procedures for printed board design, fabrication and assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products. Revision A of IPC-1791 standard includes the requirements added for CAGE Code, citizenship, security, foreign person access...

IPC-7095 - Revision C - Standard Only

Design and Assembly Process Implementation for BGAs

Document #:
IPC-7095
Revision
C
Product Type
Standard Only
Released:  01/28/2013
Language
English
Implementing ball grid array (BGA) and fine-pitch ball grid array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7095C delivers useful and practical information to anyone currently using BGAs or FBGAs. Many issues have become especially important due to the change in the alloys of the ball, the ball shape, and the attachment procedures...

IPC-9701 - Revision A - Standard Only

Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

Document #:
IPC-9701
Revision
A
Product Type
Standard Only
Released:  02/01/2006
Language
English
Provides specific test methods to evaluate the performance and reliability of surface mount solder attachments of electronic assemblies. Establishes levels of performance and reliability of the solder attachments of surface mount devices to rigid, flexible and rigid-flex circuit structures. When used with IPC-SM-785, it provides an understanding of the physics of SMT solder joint failure and an...

IPC-1782 - Revision A - Standard Only

Standard for Manufacturing and Supply Chain Traceability of Electronic Products

Document #:
IPC-1782
Revision
A
Product Type
Standard Only
Released:  01/13/2021
Language
English
The IPC-1782A standard establishes minimum requirements for manufacturing and supply chain traceability based on perceived risk. IPC-1782A applies to all products, processes, assemblies, parts, components, equipment and other items used in the manufacture of printed board assemblies and in mechanical assembly.

IPC-J-STD-005 - Revision A - Standard Only

Requirements for Soldering Pastes

Document #:
IPC-J-STD-005
Revision
A
Product Type
Standard Only
Released:  02/14/2012
Language
English
This standard lists requirements for qualification and characterization of solder paste. It references test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder pastes. Additional support is provided in IPC-HDBK-005, Guide to Solder Paste Assessment (not included with purchase of this standard). Supersedes J-STD-005.

IPC-9201 - Revision A - Standard Only

Surface Insulation Resistance Handbook

Document #:
IPC-9201
Revision
A
Product Type
Standard Only
Released:  09/19/2007
Language
English
Surface Insulation Resistance (SIR) testing is a tool used not only for characterization testing of production processes such as solder masks, soldering flux, and conformal coatings, but also for examining the electrochemical reactions at each stage of the electronic assembly production process. This handbook covers the terminology, theories, test procedures and test vehicles of SIR testing...

IPC-J-STD-004 - Revision B - Standard with Amendment 1

Requirements for Soldering Fluxes

Document #:
IPC-J-STD-004
Revision
B
Product Type
Standard Only
Released:  02/28/2012
Language
English
This standard prescribes general requirements for the classification and characterization of fluxes for high quality solder interconnections. This standard may be used for quality control and procurement purposes. The purpose of this standard is to classify and characterize tin/lead and lead-free soldering flux materials for use in electronic metallurgical interconnections for printed circuit...

IPC-9850 - Revision A - Standard Only

Surface Mount Placement Equipment Characterization

Document #:
IPC-9850
Revision
A
Product Type
Standard Only
Released:  12/21/2011
Language
English
This standard establishes the parameters, procedures and methodologies used to measure and report pick and place machine accuracy as a relationship to placement speed for a range of SMT component sizes and configurations. Purchase of this standard includes support documentation, report forms and the test material drawings in DWG format.

IPC-7530 - Revision A - Standard Only

Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

Document #:
IPC-7530
Revision
A
Product Type
Standard Only
Released:  04/28/2017
Language
English
This standard provides useful and practical information for developing thermal profiles to produce acceptable SnPb and Pb-free electronics assemblies. This revision expands the focus of the original standard from reflow profiling to include profiling for vapor phase, laser, selective soldering and wave soldering. The revision also includes a full-color troubleshooting guide for addressing common...

IPC-7525 - Revision B - Standard Only

Stencil Design Guidelines

Document #:
IPC-7525
Revision
B
Product Type
Standard Only
Released:  10/24/2011
Language
English
This document provides guidelines for the design and fabrication of stencils for solder paste and surface mount adhesive with discussion on through-hole and mixed technology. This includes differences for tin lead and lead-free solder paste, overprint, two-print and step stencil designs. A sample order form and user inspection checklist are also included.

IPC-7095 - Revision B - Standard Only

Design and Assembly Process Implementation for BGAs

Document #:
IPC-7095
Revision
B
Product Type
Standard Only
Released:  04/02/2008
Language
English
Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7095B delivers useful and practical information to anyone currently using BGAs or considering a conversion to area array packaging formats. This has become especially important due to the change in the alloys being used, both...

IPC-J-STD-004 - Revision A - Standard Only

SUPERSEDED BY J-STD-004B

Document #:
IPC-J-STD-004
Revision
A
Product Type
Standard Only
Released:  01/01/2004
Language
English
DoD Adopted 1995 Revision A covers requirements for qualification and classification of rosin, resin, organic and inorganic fluxes according to the activity level and halide content of the fluxes. It includes solder fluxes, flux-containing materials and low residue fluxes for no-clean processes. Associated test methods may have been updated and are available online for free download. Supersedes QQ...

IPC-J-STD-003 - Revision C - Standard with Amendment 1

Solderability Tests for Printed Boards

Document #:
IPC-J-STD-003
Revision
C
Product Type
Standard with amendment(s)
Released:  09/30/2014
Language
English
J-STD-003C prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and plated-through holes utilizing either tin-lead or lead-free solders. This standard is intended for use by both vendor and user. The objective of the solderability test methods described in this standard is to determine the ability of...
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IPC-J-STD-003 - Revision B - Standard Only

Solderability Tests for Printed Boards

Document #:
IPC-J-STD-003
Revision
B
Product Type
Standard Only
Released:  03/01/2007
Language
English
This standard prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and plated-through holes utilizing either tin/lead or lead-free solders. This standard is intended for use by both vendor and user. The objective of the solderability test methods described in this standard is to determine the ability of...

IPC-T-50 - Revision K - Standard Only

Begriffe und Definitionen für Leiterplatten und elektronische Baugruppen

Document #:
IPC-T-50
Revision
K
Product Type
Standard Only
Released:  02/03/2015
Language
German
Current Revision
Das unentbehrliche Nachschlagewerk für alle Verantwortlichen entlang der Wertschöpfungskette von elektronischen Produkten. Die Revision K enthält auf mehr als 120 Seiten, mehr als 220 neue und überarbeitete Begriffe und bildliche Darstellungen. Beispiele: Access Hole, Accelerated Equivalent Soak, Capture Land, Micro Via Technology, Plating Thief, Etchback, Resin Recession, Tape Automated Bonding...
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J-STD-003C-English

J-STD-003C: Solderability Tests for Printed Boards

Document #:
IPC-J-STD-003
Revision
C
Product Type
Standard Only
Released:  04/01/2014
Released:  02/15/2026
Language
English
J-STD-003C prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands and plated-through holes utilizing either tin-lead or lead-free solders. This standard is intended for use by both vendor and user. The objective of the solderability test methods described in this standard is to determine the ability of...

IPC-7711/21 - Revision B - Standard Only

Rework, Modification and Repair of Electronic Assemblies

Document #:
IPC-7711/21
Revision
B
Product Type
Standard Only
Released:  11/30/2007
Language
English
This guide includes everything needed for repair and rework of electronic assemblies and printed circuit boards. IPC-7711B/7721B Rework, Modification and Repair of Electronic Assemblies has received a complete procedure by procedure update to assure applicability to both lead free and traditional SnPb soldered assemblies. This single volume includes all previously published changes and several new...
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IPC-7095 - Revision A - Standard Only

Design and Assembly Process Implementation for BGAs

Document #:
IPC-7095
Revision
A
Product Type
Standard Only
Released:  10/01/2004
Language
English
Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. Revision A of this document delivers useful and practical information to anyone who is currently using BGAs or is considering a conversion to area array packaging formats. In addition to providing guidelines for BGA inspection...

IPC-7351 - Revision A - Standard Only

SUPERSEDED BY 7351B

Document #:
IPC-7351
Revision
A
Product Type
Standard Only
Released:  02/01/2007
Language
English
NEW! IPC-7351A includes both the standard and an IPC-7351A land pattern calculator on CD-ROM for accessing component and land pattern dimensional data.The calculator includes the document’s mathematical algorithms so users can build a land pattern for a corresponding surface mount part quickly and accurately.The tool also allows for modification of dimensional attributes of IPC-approved land...
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IPC-2581 - Revision B - Standard Only

Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

Document #:
IPC-2581
Revision
B
Product Type
Standard Only
Released:  09/01/2013
Language
English
This standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements. This format may be used for transmitting information between a printed board designer and a manufacturing or assembly facility. The data is most useful...
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IPC/JEDEC-J-STD-609 - Revision A - Standard Only

IPC/JEDEC J-STD-609A Errata Information

Document #:
IPC/JEDEC-J-STD-609
Revision
A
Product Type
Standard Only
Released:  06/01/2012
Language
English
This is a list of reported errata to the printed copies of IPC/JEDEC J-STD-609A. Pen and ink changes should be made in accordance with your company's document control policies.
IPC-A610H Spanish Cover Image

IPC-A-610 - Revision H - Standard Only

Aceptabilidad de Ensambles Electrónicos

Document #:
IPC-A-610
Revision
H
Product Type
Standard Only
Released:  08/11/2021
Language
Spanish
Current Revision
IPC-A-610H es la norma de aceptación de ensambles electrónicos más utilizada en la industria electrónica. La norma IPC-A-610H incluye una actualización general del documento, introduce varios nuevos tipos de componentes de montaje en superficie y elimina las condiciones ideales. Participantes de 29 países proporcionaron su apoyo y conocimientos especializados para traer este documento a la...
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IPC-J-STD-001 - Revision H - Standard Only

Requisitos para Ensambles Eléctricos y Electrónicos Soldados

Document #:
IPC-J-STD-001
Revision
H
Product Type
Standard Only
Released:  05/13/2021
Language
Spanish
Current Revision
IPC-J-STD-001H es reconocido mundialmente por sus criterios sobre procesos y materiales de soldadura. Actualizado con participantes de 27 países que proporcionan información y experiencia, la norma IPC-J-STD-001H trae los últimos criterios a la industria, incluyendo pautas sobre el uso de rayos X para inspeccionar condiciones de soldadura en orificios con soporte que no son visibles bajo ningún...
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IPC-J-STD-001 - Revision J - Standard Only

Các Yêu Cầu đối với Các Cụm Lắp Ráp Điện và Điện Tử Được Hàn

Document #:
IPC-J-STD-001
Revision
J
Product Type
Standard Only
Released:  04/10/2025
Language
Vietnamese
Current Revision
J-STD-001J được công nhận trên toàn cầu về các tiêu chuẩn liên quan đến vật liệu và quy trình hàn . Được cập nhật với sự tham gia của các thành viên từ 27 quốc gia cung cấp thông tin đầu vào và chuyên môn. J-STD-001J là tài liệu bắt buộc dành cho những người trong ngành điện tử quan tâm đến quy trình và tiêu chuẩn chấp nhận đối với các cụm lắp ráp điện và điện tử. J-STD-001 được phát triển kết hợp...
IPC-A-610H Danish Cover

IPC-A-610 - Revision H - Standard Only

Godkendelseskrav for elektronikprodukter

Document #:
IPC-A-610
Revision
H
Product Type
Standard Only
Released:  07/27/2021
Language
Danish
Current Revision
IPC-A-610H er den mest udbredte godkendelsesstandard for elektronikprodukter i elektronikindustrien. IPC-A-610H standarden inkluderer en generel opdatering af dokumentet, introducere flere nye overflademonterede komponenttyper og fjerner ”Ønskelig” tilstand. Deltagere fra 29 lande leverede deres input og ekspertise til at bringe dette dokument til elektronikindustrien. Dette er en ”skal have”...
IPC-A-610H RO Cover Image

IPC-A-610 - Revision H - Standard Only

Acceptabilitatea Ansamblurilor Electronice

Document #:
IPC-A-610
Revision
H
Product Type
Standard Only
Released:  04/12/2022
Language
Romanian
Current Revision
IPC-A-610H este cel mai folosit standard de acceptabilitate pentru asamblare electronice din industria electronică. Standardul IPC-A-610H include o actualizare generală a documentului, introduce mai multe tipuri noi de componente cu montare pe suprafață și elimină condițiile Obiectiv. Participanții din 29 de țări și-au adus contribuția și expertiza lor pentru a da acest document industriei...
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IPC-J-STD-001 - Revision J - Standard Only

Requisitos para Ensambles Eléctricos y Electrónicos Soldados

Document #:
IPC-J-STD-001
Revision
J
Product Type
Standard Only
Released:  01/08/2026
Language
Spanish
Current Revision
La norma J-STD-001J es reconocida mundialmente por sus criterios relacionados con los procesos y materiales de soldadura. Se ha actualizado gracias a las contribuciones y la experiencia de participantes de 27 países. La norma J-STD-001J es esencial para todos los profesionales de la industria electrónica interesados en los criterios de proceso y aceptación para ensambles eléctricos y electrónicos...

IPC-J-STD-001 - Revision G - Addendum with Amendment 1 - Space and Military

Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G. Requirements for Soldered Electrical and Electronic Assemblies

Document #:
IPC-J-STD-001
Revision
G
Product Type
Addendum with amendment(s)
Released:  03/16/2020
Language
English
The IPC J-STD-001GS AM 1 amendment to the IPC J-STD-001GS space addendum supplements or replaces specifically identified requirements of IPC J-STD-001G for the cleaning requirements for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space and military applications.
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IPC-J-STD-001 - Revision J - Standard Only

Exigences des Assemblages Électriques et Électroniques Brasés

Document #:
IPC-J-STD-001
Revision
J
Product Type
Standard Only
Released:  01/05/2026
Language
French
Current Revision
La norme J-STD-001J est reconnue mondialement pour ses critères relatifs aux procédés et matériaux de soudage. Elle a été mise à jour grâce aux contributions et à l'expertise de participants issus de 27 pays. La norme J-STD-001J est indispensable pour tous les professionnels de l'industrie électronique intéressés par les critères de processus et d'acceptation des assemblages électriques et...
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IPC-J-STD-001 - Revision H - Standard Only

Anforderungen an gelötete elektrische und elektronische Baugruppen

Document #:
IPC-J-STD-001
Revision
H
Product Type
Standard Only
Released:  03/08/2021
Language
German
Current Revision
IPC-J-STD-001H-DE ist weltweit anerkannt für seine Kriterien zu Lötprozessen und -materialien. Die Richtlinie IPC-J-STD-001H-DE wurde unter Mitwirkung von Teilnehmern aus 27 Ländern aktualisiert, die ihre Beiträge und ihr Fachwissen zur Verfügung gestellt haben. Sie enthält die neuesten Kriterien für die Branche, einschließlich einer Anleitung für die Verwendung von Röntgensystemen zur Inspektion...
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IPC-A-610 - Revision H - Standard Only

Kritéria přijatelnosti elektronických sestav

Document #:
IPC-A-610
Revision
H
Product Type
Standard Only
Released:  04/12/2022
Language
Czech
Current Revision
IPC-A-610H je nejpoužívanější standard pro provádění přejímek elektronických sestav. Standard IPC-A-610H obsahuje obecnou aktualizaci dokumentu, představuje několik nových typů komponent pro povrchovou montáž, a odstraňuje cílové podmínky. Účastníci z 29 zemí poskytli své příspěvky a odborné znalosti, aby tento dokument přinesli elektronickému průmyslu.

Jde o nepostradatelnou příručku pro...

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IPC-J-STD-001 - Revision H - Standard Only

Krav til loddede elektriske og elektroniske produkter

Document #:
IPC-J-STD-001
Revision
H
Product Type
Standard Only
Released:  05/04/2022
Language
Danish
Current Revision
IPC-J-STD-001H anerkendes globalt for sine kriterier for loddeprocesser og materialer. Opdateret med input og ekspertise leveret af deltagere fra 27 lande, IPC-J-STD-001H standarden indeholder de nyeste kriterier til industrien, inklusiv vejledning om anvendelse af røntgen til inspektion af hulmonterede lodninger, som ikke er synlige på anden måde.IPC-J-STD-001H er et must for folk i...
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IPC-J-STD-001 - Revision J - Standard Only

솔더링된 전기 및 전자 조립품 요구조건

Document #:
IPC-J-STD-001
Revision
J
Product Type
Standard Only
Released:  09/30/2025
Language
Korean
Current Revision
J-STD-001J는 솔더링 공정과 재료에 대한 기준으로 세계적인 인정을 받는다. 정보와 전문지식을 제공하는 27개국의 참여자가 갱신 작업을 진행했다. J-STD-001J는 전기 및 전자 조립품 공정과 허용기준에 관심 있는 전자 산업 종사자가 반드시 소지해야 하는 것이다. J-STD-001은 IPC-A-610과 호환하도록 개발되었으며 요구조건에 대한 추가 정보와 설명을 원하는 사람은 IPC-HDBK-001을 확인할 수 있다. J-STD-001J를 구입한다면 IPC-A-610J도 구입하는 것이 바람직하다. 이 두 표준서를 함께 사용하면 전기 및 전자 조립품 제조 공정과 육안 검사 허용기준을 확인할 수 있다.
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IPC-9707 - Amendment 1

Spherical Bend Test Method for Characterization of Board Level Interconnects

Document #:
IPC/JEDEC-9707
Revision
Original Version
Product Type
Amendment
Released:  05/01/2018
Language
English
Current Revision
IPC/JEDEC-9707-AM1 is an amendment which clarifies that the standard is only applicable to transient bending during short-term test operations. The standard specifies a common method of establishing strain limits of board-level device interconnects under spherical transient bending conditions, the worst-case flexure condition that can occur during conventional printed board/system assembly...
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IPC-A-610 - Revision H - Standard Only

电子组件的可接受性

Document #:
IPC-A-610
Revision
H
Product Type
Standard Only
Released:  04/21/2021
Language
Chinese
Current Revision
IPC-A-610H是电子行业广泛采用的电子组件验收标准。IPC-A-610H标准中包含了本文件的一般更新内容，介绍了一些新型表面贴装元器件，同时删除了目标条件。 本文件在电子行业成功问世离不开来自29个国家/地区的参与者，这些参与者在本文件编制期间投入了大量的精力并贡献了宝贵的专业知识。 该标准是检查人员、操作人员及其他与电子组件验收要求相关的人员必须掌握的技术标准。 与IPC-A-610一起制定的标准还有J-STD-001和IPC/WHMA-A-620。
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IPC-J-STD-001 - Revision J - Standard Only

ข้อกำหนดสำหรับงานบัดกรีชิ้นส่วนทางไฟฟ้าและงานประกอบอิเล็กทรอนิกส์

Document #:
IPC-J-STD-001
Revision
J
Product Type
Standard Only
Released:  04/29/2025
Language
Thai
Current Revision
J-STD-001J ได้รับการยอมรับทั่วโลกในด้านเกณฑ์สำหรับกระบวนการบัดกรีและวัสดุ มีผู้เข้าร่วมจาก 27 ประเทศที่ให้ข้อมูลและความเชี่ยวชาญ J-STD-001J เป็นสิ่งที่ต้องมีสำหรับผู้ที่อยู่ในอุตสาหกรรมอิเล็กทรอนิกส์ที่สนใจในกระบวนการและเกณฑ์การยอมรับสำหรับการประกอบชิ้นส่วนไฟฟ้าและอิเล็กทรอนิกส์ J-STD-001 ได้รับการพัฒนาควบคู่ไปกับ IPC-A-610 และได้รับการสนับสนุนโดย IPC-HDBK-001...
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IPC - J-STD-001 - Revision J - Standard Only

焊接的電氣和電子組件要求

Document #:
IPC-J-STD-001
Revision
J
Product Type
Standard Only
Released:  01/27/2025
Language
Chinese (Zhōngwén)
Current Revision
J-STD-001J 是全球公認的焊接工藝和材料標準。根據來自27個國家的參與者提供的意見和專業知識進行更新。 J-STD-001J 是電子行業中對電氣和電子元件的工藝和驗收標準感興趣的人員的必備工具。J-STD-001 是與 IPC-A-610 協同開發的，並得到 IPC-HDBK-001 的支援，供那些需要更多資訊和要求解釋的人使用。如果您購買了 J-STD-001J，還應該購買和使用 IPC-A-610J，因為它們可以一起使用，為電氣和電子元件的製造提供工藝和外觀驗收標準。
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IPC-J-STD-001 - Revision J - Standard Only

はんだ付される電気および電子組立品に関する要求事項

Document #:
IPC-J-STD-001
Revision
J
Product Type
Standard Only
Released:  12/17/2024
Language
Japanese
Current Revision
J-STD-001Jは、電気および電子組立品の工程と受入基準に関心のあるエレクトロニクス業界関係者にとって必携の書である。 J-STD-001はIPC-A-610と共に開発されたものであり、要求事項に関する追加情報や説明についてはIPC-HDBK-001で補足されている。IPC-A-610Jでは電気および電子組立品の工程と外観の合格基準が提供されているため、J-STD-001Jを購入する際にはIPC-A-610Jも併せて購入することをお勧めする。
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IPC-J-STD-001 - Revision J - Standard Only

焊接的电气和电子组件要求

Document #:
IPC-J-STD-001
Revision
J
Product Type
Standard Only
Released:  01/10/2025
Language
Chinese
Current Revision
J-STD-001J 是全球公认的焊接工艺和材料标准。根据来自27个国家的参与者提供的意见和专业知识进行更新。 J-STD-001J 是电子行业中对电气和电子组件的工艺和验收标准感兴趣的人员的必备工具。J-STD-001 是与 IPC-A-610 协同开发的，并得到 IPC-HDBK-001 的支持，供那些需要更多信息和要求解释的人使用。如果您购买了 J-STD-001J，还应该购买和使用 IPC-A-610J，因为它们可以一起使用，为电气和电子组件的制造提供工艺和外观验收标准。
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IPC-A-610 - Revision H - Standard Only

Acceptatie van geassembleerde printplaten

Document #:
IPC-A-610
Revision
H
Product Type
Standard Only
Released:  05/04/2022
Language
Dutch
Current Revision
IPC-A-610 is het meest gebruikte acceptatiedocument voor elektronica-assemblage. Bijgewerkt met deelnemers uit 17 landen die input en expertise leveren, brengt dit document de nieuwste criteria samen met veel nieuwe en herziene grafische afbeeldingen uit de industrie. Dit is een must-have voor inspecteurs, operators en anderen die geïnteresseerd zijn in de acceptatiecriteria voor elektronische...
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IPC-J-STD-001 - Revision H - Standard Only

Lehimli Elektrikli ve Elektronik Takımların Gereklilikleri

Document #:
IPC-J-STD-001
Revision
H
Product Type
Standard Only
Released:  05/31/2022
Language
Turkish
Current Revision
IPC-J-STD-001H, lehimleme prosesleri ve malzemeleri konusundaki kriterleri ile dünya çapında tanınmaktadır. 27 ülkeden girdi ve uzmanlık sağlayan katılımcılarla güncellenen IPC-J-STD-001H standardı, başka hiçbir şekilde görülemeyen delik-içi lehim koşullarının denetlenmesi için x-ışını kullanımına ilişkin rehberlik te dahil olmak üzere sektöre en son kriterleri getirmektedir. IPC-J-STD-001H...
J-STD-001H Vietnamese Cover Image

IPC-J-STD-001 - Revision H - Standard Only

Các Yêu Cầu Cho Các Sản Phẩm Điện và Điện Tử Hàn Lắp Ráp

Document #:
IPC-J-STD-001
Revision
H
Product Type
Standard Only
Released:  01/10/2022
Language
Vietnamese
Current Revision
IPC-J-STD-001H Được công nhận trên toàn cầu về tiêu chuẩn cho các quy trình hàn và các nguyên vật liệu. Được cập nhật với những người tham gia từ 27 quốc gia cung cấp đầu vào và ý kiến chuyên môn, tiêu chuẩn IPC-J-STD-001H mang đến các tiêu chuẩn mới nhất cho ngành công nghiệp cùng với hướng dẫn sử dụng tia X để kiểm tra các tình trạng mối hàn xuyên lỗ mà không thể kiểm tra được bằng các phương...
IPC-A-610H Korean Cover Image

IPC-A-610 - Revision H - Standard Only

전자 어셈블리의 허용 가능성

Document #:
IPC-A-610
Revision
H
Product Type
Standard Only
Released:  01/10/2022
Language
Korean
Current Revision
IPC-A-610H는 전자 산업에서 가장 널리 사용되는 전자 어셈블리 허용 표준이다. IPC-A-610H 표준은 문서에 대한 일반 업데이트를 포함하며, 몇 가지 새로운 표면 실장 소자 유형을 도입하고 대상 조건을 제거한다. 29개국에서 온 참가자들은 이 문서를 전자 산업에 가져오기 위해 그들의 조언과 전문지식을 제공했다. 이는 전자 어셈블리의 허용 기준에 관심이 있는 검사자, 작업자 및 기타 사용자에게 반드시 필요한 사항이다. IPC-A-610은 J-STD-001 및 IPC/WHMA-A-620과 함께 개발되었다.
IPC-A-610H Hungarian cover image

IPC-A-610 - Revision H - Standard Only

Elektronikai szerelvények elfogadhatósága

Document #:
IPC-A-610
Revision
H
Product Type
Standard Only
Released:  04/12/2022
Language
Hungarian
Current Revision
Az IPC-A-610 a világon legszélesebb körben használt elektronikai szerelvényekkel foglalkozó szabvány. Az IPC-A-610H szabvány jó néhány dokumentum általános frissítését tartalmazza, számos új felületszerelt alkatrésztípus követelményeivel kiegészült és megszüntetésre került a cél állapot kritérium. A szabvány 29 országból beérkező újabb észrevételek, szakvélemények alapján biztosítja az...
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IPC-J-STD-001 - Revision H - Standard Only

焊接的电气和电子组件要求

Document #:
IPC-J-STD-001
Revision
H
Product Type
Standard Only
Released:  03/12/2021
Language
Chinese
Current Revision
IPC-J-STD-001H是全球公认的焊接工艺和材料标准。 此次更新由27个国家/地区参与者参与编制，这些参与者在本文件更新期间投入了大量的精力并贡献了宝贵的专业知识。IPC-J-STD-001H标准是业内最新标准，包含了有关使用X射线方法检查其他方法难以检测的通孔焊料状况的指导信息。 IPC-J-STD-001H是关注电子行业电气和电子组件工艺和验收标准的人员必须掌握的技术标准。 J-STD-001是与IPC-A-610一起制定的标准，由IPC-HDBK-001提供支持，其中包含了一些额外信息和要求释义。如果您已购买了IPC-J-STD-001H，您还需要购买并使用IPC-A-610H，二种标准需要配合使用。
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IPC-A-610 - Revision H - Standard Only

Tiêu Chuẩn Chấp Nhận Các Sản Phẩm Lắp Ráp Điện Tử

Document #:
IPC-A-610
Revision
H
Product Type
Standard Only
Released:  09/16/2021
Language
Vietnamese
Current Revision
IPC-A-610 là tiêu chuẩn chấp nhận sản phẩm lắp ráp điện tử được sử dụng rộng rãi nhất trong ngành công nghiệp điện tử. Tiêu chuẩn IPC-A-610H bao gồm một cập nhận tổng quát, giới thiệu một số loại linh kiện SMT mới và loại bổ tình trạng mục tiêu. Những người tham gia từ 29 quốc gia cung cấp đầu vào và ý kiến chuyên môn để mang đến tài liệu này cho ngành công nghiệp điện tử. Đây là bộ tiêu chuẩn...
IPC-A-610H Thai Cover Image

IPC-A-610 - Standard Only

การยอมรับได้ของงานประกอบอิเล็กทรอนิกส์

Document #:
IPC-A-610
Revision
H
Product Type
Standard Only
Released:  03/01/2022
Language
Thai
Current Revision
IPC-A-610H เป็นมาตรฐานการยอมรับการประกอบอุปกรณ์อิเล็กทรอนิกส์ที่ใช้กันอย่างแพร่หลายมากที่สุดในอุตสาหกรรมอิเล็กทรอนิกส์ มาตรฐาน IPC-A-610H มีการอัพเดตทั่วไปในเอกสาร, แนะนำตัวอุปกรณ์ที่ติดตั้งบนพื้นผิวประเภทใหม่ๆ หลายประเภท และลบสภาวะเป้าหมายออกไป ผู้เข้าร่วมจาก 29 ประเทศได้ให้ข้อมูลและความเชี่ยวชาญเพื่อนำเอกสารนี้ไปสู่อุตสาหกรรมอิเล็กทรอนิกส์ นี่เป็นสิ่งที่ต้องมีสำหรับผู้ตรวจสอบ ผู้ปฏิบัติงาน...
J-STD-001H-TH Cover Images

IPC-J-STD-001 - Standard Only

ข้อกำหนดสำหรับงานบัดกรีทางไฟฟ้าและงานประกอบอิเล็กทรอนิกส์

Document #:
IPC-J-STD-001
Revision
H
Product Type
Standard Only
Released:  03/01/2022
Language
Thai
Current Revision
IPC-J-STD-001H เป็นที่ยอมรับทั่วโลกในด้านเกณฑ์กระบวนการและวัสดุในการบัดกรี อัปเดตด้วยผู้เข้าร่วมจาก 27 ประเทศที่ให้ข้อมูลและความเชี่ยวชาญ มาตรฐาน IPC-J-STD-001H นำเกณฑ์ล่าสุดมาสู่อุตสาหกรรม รวมถึงคำแนะนำเกี่ยวกับการใช้เอ็กซ์เรย์เพื่อตรวจสอบสภาพการบัดกรีผ่านรูที่มองไม่เห็นโดยวิธีอื่น IPC-J-STD-001H...

IPC-J-STD-001 - Revision F - Addendum with Amendment 1 - Space and Military

Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies

Document #:
IPC-J-STD-001
Revision
F
Product Type
Addendum with amendment(s)
Released:  02/01/2017
Language
English
This addendum supplements J-STD-001F for soldered assemblies that must survive the vibration and thermal cyclic environments associated with space hardware. It is to be used with J-STD-001FS WAM 1.
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IPC-J-STD-001 - Revision F - Amendment 1

Requirements for Soldered Electrical and Electronic Assemblies

Document #:
IPC-J-STD-001
Revision
F
Product Type
Amendment
Released:  11/01/2015
Language
English
This is an amendment to IPC J-STD-001F, a recognized industry-consensus standard covering materials and processes. Changes include, but are not limited to, a revision to plated-through hole, PTH, minimum fill requirements and BGA voiding criteria, new graphics for several surface mount component types, revised staking criteria, and recognition of the paragraphs addressed in J-STD-001FS, Space...
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IPC-A-610 - Revision F - Amendment 1

Acceptability of Electronic Assemblies

Document #:
IPC-A-610
Revision
F
Product Type
Amendment
Released:  12/14/2015
Language
English
This amendment cannot be used without a copy of IPC-A-610F. See Related items. This is an amendment to IPC-A-610F, a recognized industry-consensus standard covering acceptability requirements for electronic assemblies. Changes include, but are not limited to, a revision to plated-through hole, PTH, minimum fill requirements, BGA voiding criteria for noncollapsing balls, and staking criteria.
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IPC-1072 - Amendment 1

Intellectual Property Protection in Electronic Assembly Manufacturing

Document #:
IPC-1072
Revision
Original Version
Product Type
Amendment
Released:  03/07/2017
Language
English
Current Revision
This amendment to IPC-1072 updates the document to align its requirements with the requirements in its counterpart standard IPC-1071 for PCB shops. 5 Pages. Released March 2017 This amendment cannot be used without a copy of IPC-1072 (December 2015). To purchase the original document please see Related Products and choose 1072(D)1
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IPC/WHMA-A-620 - Revision E - Standard Only

Requisitos y aceptación para ensambles con cables compuestos y mazos/ arneses de cables

Document #:
IPC/WHMA-A-620
Revision
E
Product Type
Standard Only
Released:  05/02/2025
Language
Spanish
Current Revision
El IPC/WHMA-A-620E es el único estándar consensuado por el sector sobre Requisitos y aceptabilidad de ensambles de cables y mazos de cables. El estándar IPC/WHMA-A-620E describe los materiales, métodos, pruebas y criterios de aceptabilidad para la producción de interconexiones crimpadas, mecánicamente aseguradas o soldadas y las actividades de ensamble relacionadas que estén asociadas con...
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IPC/WHMA-A-620 - Revision E - Standard Only

Anforderungen und Abnahmekriterien für Kabel- und Kabelbaum-Baugruppen

Document #:
IPC/WHMA-A-620
Revision
E
Product Type
Standard Only
Released:  03/05/2025
Language
German
Current Revision
IPC/WHMA-A-620E ist die einzige, im Branchenkonsens entwickelte Richtlinie für Anforderungen und Abnahmekriterien für Kabel- und Kabelbaum-Baugruppen. IPC/WHMA-A-620E beschreibt Materialien, Methoden, Tests und Abnahmekriterien für die Herstellung gecrimpter, mechanisch gesicherter oder gelöteter Verbindungen und die zu den Kabel- und Kabelbaum-Baugruppen zugehörigen Montageaktivitäten. IPC/WHMA-A...
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IPC-7711/21 - Revision D - Standard Only

Reprise, Modification et Réparation des Assemblages Electroniques

Document #:
IPC-7711/21
Revision
D
Product Type
Standard Only
Released:  06/27/2025
Language
French
Current Revision
Le guide IPC-7711/21 fournit des procédures de reprise, réparation et modification des assemblages de circuits imprimées, y compris des outils et des matériaux, des procédures courantes, le retrait du revêtement et des graphiques pour aider l'utilisateur.
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IPC-7711/21 - Revision D - Standard Only

Retrabajo, Modificacion y Reparacion de Ensambles Electronicos

Document #:
IPC-7711/21
Revision
D
Product Type
Standard Only
Released:  01/05/2026
Language
Spanish
Current Revision
La guía IPC-7711/21 proporciona procedimientos para reelaborar, reparar y modificar conjuntos de placas de circuitos impresos, incluidas herramientas y materiales, procedimientos comunes, eliminación de revestimiento y gráficos para ayudar al usuario.

IPC/JEDEC-J-STD-033 - Revision D - Standard Only

Manejo, embalaje, transporte y uso de componentes sensibles a la humedad/reflujo y/o al proceso

Document #:
IPC/JEDEC-J-STD-033
Revision
D
Product Type
Standard Only
Released:  02/18/2019
Language
Spanish
Current Revision
El IPC/JEDEC J-STD-033D proporciona a los fabricantes de dispositivos de montaje superficial y a los usuarios con métodos estandarizados para la manejo, embalaje, transporte y uso de componentes sensibles a la humedad/reflujo. Estos métodos ayudan a evitar daños por la absorción de humedad y por la exposición a las temperaturas de la soldadura por reflujo que pueden tener como resultado una...
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IPC/WHMA-A-620 - Revision E - Standard Only

Exigences et acceptabilité des assemblages de câbles et de faisceaux de fils

Document #:
IPC/WHMA-A-620
Revision
E
Product Type
Standard Only
Released:  04/29/2025
Language
French
Current Revision
IPC/WHMA-A-620E est la seule norme consensuelle de l’industrie pour les exigences et l’acceptation des assemblages de câbles et de faisceaux de fils. IPC/WHMA-A-620E décrit les matériaux, les méthodes, les tests et les critères d’acceptation pour la production d’ensembles interconnectés brasés, sertis et mécaniquement sécurisés, ainsi que les activités d’assemblage qui y sont associées pour...
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IPC/WHMA-A-620 - Revision E - Standard Only

Yêu Cầu và Tiêu Chuẩn Chấp Nhận cho Các Bộ Dây Điện và Cáp Điện

Document #:
IPC/WHMA-A-620
Revision
E
Product Type
Standard Only
Released:  10/09/2023
Language
Vietnamese
Current Revision
IPC/WHMA-A-620E là tiêu chuẩn duy nhất trong ngành được đồng thuận về Yêu Cầu và Tiêu Chuẩn Chấp Nhận cho Các Bộ Dây Điện và Cáp Điện. IPC/WHMA-A-620E mô tả các nguyên vật liệu, phương pháp, cách kiểm tra và tiêu chuẩn chấp nhận để sản xuất các liên kết bấm, cố định cơ học, hoặc hàn, cũng như các hoạt động lắp ráp có liên quan liên quan đến các bộ dây điện và cáp điện. IPC/WHMA-A-620E được phát...

IPC-A-610 - Revision G - Standard Only

Критерии приемки электронных сборок

Document #:
IPC-A-610
Revision
G
Product Type
Standard Only
Released:  04/09/2020
Language
Russian
Current Revision
Описание на русском IPC-A-610 – наиболее широко используемый в мире стандарт по приемке электронных сборок. Этот документ, в усовершенствование которого внесли свой вклад участники из 17 стран, поделившись информацией и своими знаниями и опытом, предоставляет отрасли новейшие критерии наряду со множеством новых и обновленных иллюстраций. Этот документ – то, что обязательно нужно иметь контролерам...

IPC/WHMA-A-620 - Revision D - Standard Only

Godkendelseskrav for kabler og for produkter med wire harness

Document #:
IPC/WHMA-A-620
Revision
D
Product Type
Standard Only
Released:  11/20/2020
Language
Danish
Current Revision
IPC/WHMA-A-620D er den eneste industriudviklede standard for ” Godkendelseskrav for kabler og for produkter med wire harness”. IPC/WHMA-A-620D beskriver materialer, metoder, test og godkendelseskriterier for fremstilling af crimpede samlinger, mekanisk sikrede og loddede forbindelser samt de tilhørende monteringsprocesser som er forbundet med kabel og harness produkter. IPC/WHMA-A-620D blev...

IPC-J-STD-001 - Revision G - Standard Only

Wymagania dla lutowanych zespołów elektrycznych i elektronicznych

Document #:
IPC-J-STD-001
Revision
G
Product Type
Standard Only
Released:  02/18/2019
Language
Polish
Current Revision
J-STD-001 jest uznawany globalnie za swoje kryteria dla procesów lutowania i materiałów lutowniczych. Uaktualniony przez uczestników z 18 krajów, dostarczających danych wejściowych i wiedzy specjalistycznej, niniejszy dokument dostarcza przemysłowi najnowszych kryteriów wraz z nowymi grafikami dla łatwości użycia i zrozumienia. Dokument ten musi mieć każdy w przemyśle elektronicznym, kto jest...
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IPC-7711/21 - Revision D - Standard Only

Nacharbeit, Änderung und Reparatur Elektronischer Baugruppen

Document #:
IPC-7711/21
Revision
D
Product Type
Standard Only
Released:  06/27/2025
Language
German
Current Revision
Der Leitfaden IPC-7711/21 enthält Verfahren für die Nacharbeit, Reparatur und Änderung von Leiterplatten-Baugruppen, einschließlich Werkzeugen und Materialien, häufig angewendete Verfahren, Entfernung der Beschichtung und Grafiken zur Unterstützung des Benutzers.
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IPC/WHMA-A-620 - Revision B - Amendment 1

Requirements and Acceptance for Cable and Wire Harness Assemblies

Document #:
IPC/WHMA-A-620
Revision
B
Product Type
Amendment
Released:  08/01/2013
Language
English
This amendment provides resolution to some internal conflicts, aligns common criteria to other IPC standards, and corrects some editorial errors. This amendment is only to be used in conjunction with IPC/WHMA-A-620 Revision B, October 2012. Follow your company policy and procedures to make pen and ink changes or notations to the published IPC/WHMA-A-620 Revision B. When there are changes to a...
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IPC-PTH2 - Revision G - Illustrations/Art

Through Hole Solder Joint Evaluation Wall Poster - Class 2

Document #:
IPC-PTH2
Revision
G
Product Type
Illustrations/Art
Language
English
Current Revision
Free Review This updated full-color, 18 x 24-inch wall poster visually defines minimum/maximum Class 2 through hole solder joint acceptability requirements from Revision G of the IPC-A-610 industry standard, Acceptability of Electronic Assemblies. Containing high-quality computer graphics, this poster depicts complex through hole solder joint requirements so clearly, that all operators and...
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IPC-PTH3 - Revision G - Illustrations/Art

Through Hole Solder Joint Evaluation Wall Poster - Class 3

Document #:
IPC-PTH3
Revision
G
Product Type
Illustrations/Art
Language
English
Current Revision
View Poster This updated full-color, 18 x 24-inch wall poster visually defines minimum/maximum Class 3 through hole solder joint acceptability requirements from Revision G of the IPC-A-610 industry standard, Acceptability of Electronic Assemblies. Containing high-quality computer graphics, this poster depicts complex through hole solder joint requirements so clearly, that all operators and...
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