IPC-6011A Redline document shows the changes from IPC-6011 to IPC-6011A in a side-by-side comparison of the two documents. The IPC-6011A Redline is available in electronic format only.
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IPC-T-50N-CN文件旨在为电子行业中常用的词汇和术语提供其定义。本文件所规定的定义充分详细地阐明了术语，以便以英语为第二语言的读者能够理解含义的细微之处。IPC-T-50N-CN包含550多个新的或修订的术语，包括通孔结构、表面贴装器件类型、焊料凸点、焊料合金、焊接、退润湿、电路板制造工艺和测试的新术语。
关于印制板可接受性的权威图解指南！本四色文件提供了裸印制板内部或外部可观察到的目标、可接受和不符合条件的照片和示意图。确保您的操作人员、检验员和工程师掌握最新的行业共识信息。版本M新增或修订了数十张照片和示意图，新增和扩展了有关印制板边缘电镀、印制板阶梯槽、边缘毛刺、退润湿、导体厚度、环宽（重合度）、内部铜渗透和镀层空洞等主题的内容。本文件与 IPC-6012F 和 IPC-6013E 中表述的可接受性要求同步。取代 IPC-A-600K。
ภาพประกอบใช้เป็นคู่มือเพื่อแสดงการยอมรับได้ของบอร์ดพิมพ์! เอกสารสี่สีนี้ได้ให้ภาพถ่ายและภาพประกอบที่แสดงถึงสภาวะเป้าหมาย ยอมรับได้ และ ไม่สอดคล้องตามข้อกำหนด ซึ่งสามารถสังเกตเห็นได้ทั้งจากภายในหรือภายนอกบนบอร์ดพิมพ์เปล่า ตรวจสอบให้แน่ใจว่าผู้ปฏิบัติงาน ผู้ตรวจสอบ และวิศวกรของคุณมีข้อมูลที่เป็นเอกฉันทามติของอุตสาหกรรมที่เป็นปัจจุบันที่สุด ด้วยรูปถ่ายและภาพประกอบใหม่หรือที่มีการแก้ไขจำนวนมาก...
Những hướng dẫn được minh họa có tính định nghĩa cho khả năng chấp nhận đối với bảng mạch in! Tài liệu 4 màu này cung cấp các bức ảnh và các hình minh họa cho các tình trạng mục tiêu, chấp nhận và không phù hợp đối với các tình trạng quan sát được bên trong và bên ngoài bảng mạch in chưa lắp ráp. Hãy đảm bảo công nhân, người kiểm tra và các kỹ sư của bạn có được những thông tin đồng thuận mới nhất...
IPC-1791C provides minimum requirements, policies and procedures for printed board design, fabrication, assembly, and cable and wire harness assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products. These trusted sources shall ensure quality, supply chain risk management (SCRM), security and chain of...
IPC-A-600K是印制板可接受性的权威图示说明！IPC-A-600K是一份四色文档，提供了目标的照片和插图，可以在裸露的印刷电路板上内部或外部观察到的可接受和不符合的条件。确保您的操作员，检查员和工程师具有最新的行业共识信息。IPC-A-600K提供了数十种新的或经过修订的照片和插图，涵盖了诸如开裂，背钻结构，边缘连接器连接盘，铜包裹板，镀层空隙和微小异常，微孔目标连接盘穿刺，内层分离和镀层悬垂。该文档与IPC-6012E和IPC-6013D中表达的可接受性要求保持同步。取代IPC-A-600J。
IPC-1791B standard provides minimum requirements, policies and procedures for printed board design, fabrication, and assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products. IPC-1791B expands the standard’s requirements to account for trusted sources of cable and wire harness assemblies.
IPC-A-600K是印刷電路板可接受性的權威圖示說明！IPC-A-600K是一份四色文檔，提供了目標的照片和插圖，可以在裸露的印刷電路板上內部或外部觀察到的可接受和不符合的條件。確保您的操作員，檢查員和工程師具有最新的行業共識資訊。IPC-A-600K提供了數十種新的或經過修訂的照片和插圖，涵蓋了諸如開裂，背鑽結構，邊緣連接器連接盤，銅包裹板，鍍層空隙和微小異常，微孔目標連接盤穿刺，內層分離和鍍層懸垂。該文檔與IPC-6012E和IPC-6013D中表達的可接受性要求保持同步。取代IPC-A-600J。
El IPC-A-600K es la guía ilustrada definitiva de admisibilidad de las placas impresas. El IPC-A-600K es un documento a cuatro colores donde se recogen fotografías e ilustraciones de las condiciones objetivo, aceptables y no conformes que son observables de forma interna o externa en placas impresas vacías. Verifique que sus operadores, inspectores e ingenieros dispongan de la más actualizada...
IPC-1791A standard provides minimum requirements, policies and procedures for printed board design, fabrication and assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products. Revision A of IPC-1791 standard includes the requirements added for CAGE Code, citizenship, security, foreign person access...
Implementing ball grid array (BGA) and fine-pitch ball grid array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7095C delivers useful and practical information to anyone currently using BGAs or FBGAs. Many issues have become especially important due to the change in the alloys of the ball, the ball shape, and the attachment procedures...
The IPC-1782A standard establishes minimum requirements for manufacturing and supply chain traceability based on perceived risk. IPC-1782A applies to all products, processes, assemblies, parts, components, equipment and other items used in the manufacture of printed board assemblies and in mechanical assembly.
This document provides guidelines for generating good quality holes in printed circuit boards (PCBs) made from a wide variety of materials. It addresses the following topics: Drill Bits, Tooling, Drilling Stacked Materials, Drilling Machines, Drilling Operation, Drilled Hole Quality and Trouble Shooting. 12 pages. Released March 2007.
This standard provides useful and practical information for developing thermal profiles to produce acceptable SnPb and Pb-free electronics assemblies. This revision expands the focus of the original standard from reflow profiling to include profiling for vapor phase, laser, selective soldering and wave soldering. The revision also includes a full-color troubleshooting guide for addressing common...
Dual-language (Spanish/English) DVD -- Introduces industry specifications J-STD-001 & IPC-A-610 and explains the concept of process indicators. Includes an animated examination of the invisible problems that can be created during rework to explain why it's so important to avoid unnecessary rework. Reviews each of the tools and materials for plated-through hole (PTH) rework (including low-residue...
Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7095B delivers useful and practical information to anyone currently using BGAs or considering a conversion to area array packaging formats. This has become especially important due to the change in the alloys being used, both...
This document contains a wide variety of photographic illustrations of various anomalies and characteristics of printed boards for identification of anomalies that are sometimes seen during inspection and evaluation processes. The handbook has been divided into fourteen distinct sections covering topics such as solder resist, plated-through holes, conductor characteristics and surface plating to...
Das unentbehrliche Nachschlagewerk für alle Verantwortlichen entlang der Wertschöpfungskette von elektronischen Produkten. Die Revision K enthält auf mehr als 120 Seiten, mehr als 220 neue und überarbeitete Begriffe und bildliche Darstellungen. Beispiele: Access Hole, Accelerated Equivalent Soak, Capture Land, Micro Via Technology, Plating Thief, Etchback, Resin Recession, Tape Automated Bonding...
This guide includes everything needed for repair and rework of electronic assemblies and printed circuit boards. IPC-7711B/7721B Rework, Modification and Repair of Electronic Assemblies has received a complete procedure by procedure update to assure applicability to both lead free and traditional SnPb soldered assemblies. This single volume includes all previously published changes and several new...
Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. Revision A of this document delivers useful and practical information to anyone who is currently using BGAs or is considering a conversion to area array packaging formats. In addition to providing guidelines for BGA inspection...
This specification covers qualification and performance of high frequency (microwave) boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as...
Covers qualification and performance requirements for flexible printed boards designed to IPC-2221 and IPC-2223. The flexible printed board may be single-sided, double-sided, multilayer or rigid-flex multilayer. All of these constructions may include stiffeners, PTHs, microvias, and blind/buried vias. Revision C incorporates new and updated requirements for final finishes, surface and hole plating...
IPC-1602A Redline document shows the changes from IPC-1602 to IPC-1602A in a side-by-side comparison of the two documents. This is only available in digital format.
關於印製板可接受性的權威圖解指南！本四色檔提供了裸印製板內部或外部可觀察到的目標、可接受和不符合條件的照片和示意圖。確保您的操作人員、檢驗員和工程師掌握最新的行業共識資訊。版本M新增或修訂了數十張照片和示意圖，新增和擴展了有關印製板邊緣電鍍、印製板階梯槽、邊緣毛刺、退潤濕、導體厚度、環寬（重合度）、內部銅滲透和鍍層空洞等主題的內容。本檔與 IPC-6012F 和 IPC-6013E 中表述的可接受性要求同步。取代 IPC-A-600K。