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The IPC-WP-026 white paper explores blockchain as an emerging technology that has a core strength in providing an immutable, auditable, transparent and secure environment for data exchanges. These advantages make it a prime candidate for implementation in the electronics industry. The IPC-WP-026 white paper explores blockchain and its limitations and challenges. It also provides a few directions...

Manufacturers of high reliability electronics have been working for many years to mitigate the deleterious effects of tin whisker formation. One highly effective means to suppress the growth of tin whiskers is to replace the pure tin plating with reflowed tin-lead solder. One approach is to fully consume the tin plating by tin-lead solder during the SMT reflow process. This phenomenon of tin...

"Embedded Capacitor Technology; Status, Opportunity and Challenges" was presented by John Andresakis, vice president of strategic technology, Oak-Mitsui at the IPC Conference for the PCB Industry: Critical Issues for the Military Market, Washington D.C., in December 2011.The author explains how the use of this technology improves the performance, reliability and assembly cost of printed boards and...

IPC-WP-023 is an IPC Technology Solutions White Paper addressing reliability issues associated with stacked microvias. There is evidence that staggering vias can result in a more robust structure; however, staggering microvias is only a temporary solution to accommodate complex designs with microvias built with weak interface structures IPC-WP-023 white paper provides an investigation of these...

This technical report provides full detail of the round robin study charged with assessing the use of Interconnect Stress Test (IST) as a test for incoming inspection in lieu of Thermal Stress in the detection of innerlayer separations in plated-through holes. Includes background on the Post Separation Task Group, test results, round robin test plan, conclusions and test methods used. 51 pages...

Approximately 200,000 plated through-holes, covering primarily electroplated but also electroless technology, were exposed to several different thermal cycles. A number of PTH diameters, board constructions and plating thicknesses were evaluated. 80 pages. Released September 1988.

An IPC Blue Ribbon Committee originally published this study. It provides extensive background and test results resolving methods to identify visible conditions such as measles in PWBs and that measles do not impact reliability. 81 Pages. Released November 1973.

This document, co-developed by the IPC, EIA and ASTM, represents a comprehensive report on fine pitch technology with an emphasis on tape-automated bonding and design rules. Subjects include land pattern design, types of encapsulation, TAB tape format, assembly techniques and the advantages and disadvantages of FPT. 54 pages. Released by the Surface Mount Council January 1989.