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IPC-A-600M is the definitive illustrated guide to printed board acceptability! This four-color document provides photographs and illustrations of the target, acceptable and nonconforming conditions that are either internally or externally observable on bare printed boards. Make sure your operators, inspectors, and engineers have the most current industry consensus information. With dozens of new...

IPC-6012F, covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical...

This standard provides minimum requirements, policies and procedures for printed board design, fabrication, assembly, and cable and wire harness assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products. These trusted sources shall ensure quality, supply chain risk management (SCRM), security and chain...

The IPC-7711/21 guide provides procedures for rework, repair and modification of printed board assemblies, including tools and materials, common procedures, coating removal and graphics to assist the user.

IPC-6013E standard covers qualification and performance requirements for flexible printed boards designed to IPC-2221 and IPC-2223. The flexible printed board may be single-sided, double-sided, multilayer or rigid-flex multilayer. All of these constructions may include stiffeners, PTHs, microvias, and blind/buried vias. The IPC-6013E standard incorporates new and updated requirements for final...

The IPC-6018D standard covers qualification and performance of high frequency (microwave) boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as...

IPC-1791D standard provides minimum requirements, policies and procedures for printed board design, fabrication, assembly, and cable and wire harness assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products. These trusted sources shall ensure quality, supply chain risk management (SCRM), security and...

This document bears two reference numbers, and may be obtained from IPC or the IEC. IPC-D-350D and IEC 1182-1 are identical in technical content. The IEC version of this document also contains a French translation. The IEC is responsible for the accuracy of that translation.Specifies record formats used to describe printed board products with detail sufficient for tooling, manufacturing and...

The industry's sole standard on the handling, packaging and storage of printed boards. The requirements in this document are intended to protect printed boards from contamination, physical damage, solderability degradation, ESD and moisture uptake. Consideration is given to packaging material types and methods, production environment, handling and transport of product, and establishing baking...

IPC-2231A provides guidelines for establishing a best practice methodology for use in developing a formal DFX (Design for Manufacturing, Fabrication, Assembly, Testability, Cost, Reliability, Environment, Reuse) process for layout of printed boards.

Developed by the OEM council of the IPC, the MQP sets the standard for assessing PWB manufacturer capabilities and allows PCB manufacturers to more easily satisfy customer requirements. This document eases auditing processes and reduces the frequency of audits, thereby decreasing paperwork and enhancing manufacturer effectiveness. Revision A consists of a single, easy to use electronic file...

The IPC-7093B guideline provides essential design and assembly guidance for implementing bottom termination components (BTCs). Specifically, IPC-7093B provides guidelines on critical design, materials, assembly, inspection, repair, quality, and reliability issues associated with BTCs.

This specification establishes the generic requirements for printed boards associated with the IPC-601X series of performance specifications and their quality and reliability assurance requirements. The intent of this specification is to allow the printed board user and supplier flexibility to develop optimum procedures for the procurement and manufacture of printed boards. For use with IPC-6012...

Developed by the OEM council of the IPC, IPC-1720A categorizes electronic assembly manufacturer capabilities and supplies the OEM customer with detailed, substantive information. This program simplifies auditing processes and reduces the frequency of audits, thereby decreasing paperwork and improving efficiency. Company and Site Description, Site Capability Snap Shot, Equipment Profile (Pre-site...

IPC-9252 defines levels of appropriate testing and assists in the selection of the test analyzer, test parameters, test data and fixturing required to perform electrical test(s) on unpopulated printed boards and innerlayers. Revision B provides new requirements for resistive and indirect continuity and isolating testing, test record marking and traceability and an updated sample electrical test...

The IPC-1921A handbook provides problems, causes and possible corrective actions related to printed board manufacturing processes. Includes more than 200 photos and illustrations depicting common defects.

This document describes the design and assembly challenges and ways to address those challenges for implementing 3D component technology. Recognizing the effects of combining multiple uncased semiconductor die elements in a single-package format can impact individual component characteristics and can dictate suitable assembly methodology. The information contained in this standard focuses on...

The IPC-6017A standard defines the electrical, mechanical, and environmental requirements specific to embedded passive and active circuitry in printed boards. These requirements are in addition to the applicable requirements of other performance specification(s) (e.g., J-STD-001).

This is the document all process engineers must have! Useful for day-to-day problem solving, it contains case histories of problems and corrective action in the design, manufacture, assembly and testing of printed wiring products. Each section has been updated to reflect today's manufacturing challenges. Sections address documentation, phototooling, raw materials, mechanical operations, hole...

This document provides the designer/user with guideline information related to the use of pressure sensitive adhesives (PSAs) for fabrication and assembly of flexible, rigid or rigid-flex printed boards, membrane switches and component attachments. It also provides information on adhesive types available, their inherent strengths, weaknesses, limitations and correct processes needed for creating...

Establishes nomenclature and requirements for solid carbide twist drills with four-faceted drill points used in the fabrication of printed boards. 9 pages. Revised April 1994.

This specification establishes the qualification and performance requirements for encapsulated discrete wire interconnection boards with wires that terminate in plated holes. 62 pages. Revised May 1990.

This guideline describes flexibility and stretchability testing to evaluate printable electronics for stretchable and wearable applications. 26 pages. Released March 2017

IPC-6012E-AM1 is an Amendent to the IPC-6012E that clarifes the distinction between receding and dewetting solder in reflowed SPb or HASL coatings. The Amendment also provides amended criteria for minimum external conductor thickness of the finished printed board and new acceptance criteria for the minimum thickness of internal plated layers

IPC-6013D-AM1 is an amendment makes changes to the existing acceptance criteria for copper wrap plating measurements as defined by IPC-6013D. IPC-6013D-AM1 is an amendment which implements a dual criterion for Class 3 copper wrap plating, based on design effectivity (before and after July 01, 2018), so as not to impose onto legacy designs any additional qualification activity associated with...