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IPC-1791 - Amendment 1

Trusted Electronic Designer, Fabricator and Assembler Requirements

Document #:
IPC-1791
Revision
Original Version
Product Type
Amendment
Released:  04/11/2019
Language
English
The IPC-1791-Am1 provides revisions and clarifications for requirements pertaining to CAGE Code, citizenship, security, foreign person access, traceability records and NIST SP 800-171 compliance.

IPC-TR-583 - Study/Report

An In-Depth Look At Ionic Cleanliness Testing

Document #:
IPC-TR-583
Revision
Original Version
Product Type
Study/Technical Report
Released:  07/01/2002
Language
English
Current Revision
This original research was a cooperative effort between the EMPF and IPC, released as EMPF-RR-0013 in 1993 for better understanding of ionic cleanliness testing. The IPC Ionic Conductivity/Ion Chromatography Test Task Group has validated its continued importance and relevance to the cleaning community and IPC-TR-583 is the result. It includes how solvent temperature influences the final...
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IPC-A-24 - Gerber Files

Surface Insulation Resistance

Document #:
IPC-A-24
Revision
Original Version
Product Type
Gerber Files
Released:  02/01/1996
Language
English
Current Revision
This single-sided (4 up) pattern is used for evaluating the interaction of solder flux and solder paste residues on printed boards. This board was used in the Phase 3 portion of the test program evaluating alternative technologies used to eliminate CFCs in printed board assembly operations. The board contains four comb patterns with 0.4 mm lines and 0.5 mm spaces. A stencil pattern is also...
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IPC-A-610 - Revision E - Standard Only

Acceptanskrav för kretskort

Document #:
IPC-A-610
Revision
E
Product Type
Standard Only
Released:  04/13/2010
Language
Swedish
IEC är på väg att godkänna IPC-A-610 som den globala rekommenderade internationella standarden för elektroniktillverkning. IPC-A-610 är den mest använda standarden i världen för elektroniktillverkning. IPC-A-610E är ett måste för alla kvalitetssäkrings- och produktionsavdelningar och illustrerar industrigodkända acceptanskriterier genom fyrfärgsbilder och illustrationer. Områden inkluderar...
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IPC-TM-650 - Standard Only

Method Development Packet

Document #:
IPC-TM-650
Revision
Original Version
Product Type
Development Packet
Released:  06/06/2012
Language
English
Current Revision
This document has been created to help define criteria that will yield better test methods for use by the electronics and related industries. Key objectives to validating a new test method procedure are covered, including the usage of objective evidence to verify that the elements defined within a method fulfill the intended use and that the method yields repeatable and reproducible results when...
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IPC-A-43 - Gerber Files

Multi-Layer Flexible Circuits Test Pattern

Document #:
IPC-A-43
Revision
Original Version
Product Type
Gerber Files
Released:  02/01/1996
Language
English
Current Revision
Artwork required for certification to either MIL-P-50884, MIL-P-55110, also IPC-6011, IPC-6012 and IPC-6013. Includes Master Drawing #100043 (10 pcs. 30 x 46 cm 1:1). Available in Gerber format.
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IPC/DAC-2552 -Standard Only

通用电子元器件基于模型的定义

Document #:
IPC/DAC-2552
Revision
Original Version
Product Type
Standard Only
Released:  10/25/2024
Language
Chinese
Current Revision
本标准是由IPC与广东省数字化学会(DAC)联合开发和发布的国际标准,目的旨在解决业内各厂家提供的电子元器件几何模型及语义信息参差不齐,导致使用方需要重复建模处理且无法复用等问题。 定义如何将电子元器件的设计、仿真、制造等领域的属性关联到电子元器件的三维模型及对应的子部件上的数字化建模,通过规范各供应商按模型交付,工具间(CAD/CAE等)数据集成打通的方式,可实现高效
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IPC-A-610 - Revision G - Standard Only

Dopuszczalność Zespołów Elektronicznych

Document #:
IPC-A-610
Revision
G
Product Type
Standard Only
Released:  05/21/2019
Language
Polish
IPC-A-610 jest najpowszechniej na świecie używanym standardem dla pakietów elektronicznych. Uaktualniany przez uczestników z 17 krajów dostarczających wkładu i ekspertyz, niniejszy dokument dostarcza przemysłowi najnowszych kryteriów wraz z wieloma nowymi i ulepszonymi grafikami. Jest to nieoceniony dokument dla inspektorów, operatorów i innych zainteresowanych kryteriami dopuszczalności zespołów...
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IPC-1602 - Standard Only

印制板操作和储存标准

Document #:
IPC-1602
Revision
Original Version
Product Type
Standard Only
Released:  10/04/2023
Language
Chinese
Current Revision
IPC-1602 标准提供了保护印制板,避免其受到污染、物理损坏、可焊性降低和吸湿的要求。要考虑包装的材料类型和方法、生产环境、产品的操作和运输,以及为除水汽建立烘烤曲线。IPC-1602 提供了可在采购文件中列出的要求。IPC-1602 标准扩充了防潮袋 (MBB) 的覆盖范围、烘烤对印刷板可焊性的影响、ESD 问题、蚀刻的芯板和压合结构的的湿气关注、干燥剂材料和湿度指示卡(HIC),以及传递对包装和操作要求的范例。IPC-1602替代了原IPC-1601A即印制板操作和存储指南的许多建议性要求,而改为强制性要求
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IPC-1602 - Standard Only

プリント基板の取扱いと保管に関する規格

Document #:
IPC-1602
Revision
Original Version
Product Type
Standard Only
Released:  08/11/2023
Language
Japanese
Current Revision
規格書「IPC-1602」はプリント基板を汚染や物理的損傷、はんだ付性の低下や吸湿から保護することを目的とし、その要求事項を取りまとめたものである。梱包資材の種類や梱包方法、製品の製造環境、取扱いと輸送、また、水分除去を目的としたベーキングプロファイルの策定などに関し、懸念事項が示されている。今回のIPC-1602では、調達文書に記載可能な要求事項についても触れている。本規格書「IPC-1602」では、防湿袋(MBB)、プリント基板をベーキングすることによるはんだ付性への影響、ESD問題、エッチング後のコア材・複合材の湿気に関する懸念事項、乾燥剤とHICカード、梱包/取扱いに関する要求事項のフローダウン例など幅広い内容を網羅している。
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IPC-2221 Appendix A - Version 4

IPC-2221 Appendix A Version 4.0 April 2022

Document #:
IPC-2221
Revision
Original Version
Product Type
Appendix
Released:  07/26/2023
Language
English
Current Revision
Appendix A to IPC-2221 provides an overview of designs, limitations and intended uses for IPC-2221 test coupons used for conformance evaluations to IPC-601X printed board performance specifications.

IPC-4556 - Standard Only

印制板化学镍/钯/浸金(ENEPIG)规范

Document #:
IPC-4556
Revision
Original Version
Product Type
Standard Only
Released:  11/26/2018
Language
Chinese
Current Revision
本规范规定了使用化学镍/钯/浸金(ENEPIG)作为印制板表面处理的要求。本规范规定了ENEPIG应用于焊接、金属线键合和接触面涂覆层的沉积厚度规格。本规范适用于化学药水供应商、印制板制造商、电子制造服务业(EMS)和原始设备制造商(OEM)。ENEPIG是沉积在以铜为基底金属上的一个三层的表面处理。它是一种多功能的表面处理,适用于焊接和金、铝和铜金属线键合。它也适合作为软薄膜和钢凸圆接触的配合表面。其它应用包括使用低插入力(LIF)和零插入力(ZIF)板边连接器和压入式应用。化学钯层形成的扩散阻挡层,阻碍镍扩散到金表面。浸金防止钯层在加工前与污染物反应,否则可能会影响连接制程,如金属线键合和焊接。全文共82页,2013年发布。2018年10月翻译。
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IPC-4554 - Standard Only

印制板浸锡规范—含修订本1

Document #:
IPC-4554
Revision
Original Version
Product Type
Standard Only
Released:  01/01/2012
Language
Chinese
Current Revision
IPC-4554,印制板浸锡规范,包含在IPC-455X系列规范里。455X系列规范规定了取代印制板非共面处理(经常被称为锡-铅热风整平处理)的表面处理的要求。该规范是一个全彩色文档,适用于供应商或印制板制造商,电镀化学供应商,合同制造商或EMS工厂和原始设备制造商(OEM)。浸锡是一种通过化学置换反应,直接将金属沉积于印制板金属基材-铜表面的处理方式。浸锡主要作为可焊表面使用,目前也已使用在压入式连接及零插入力(ZIF)连接器的界面上。浸锡可以保护其下面的铜面在保存期限内不被氧化,符合IPC/ EIA J-STD-003规定的第3类涂覆层耐久性要求(贮存期大于6个月)。插入的修订本1是关于浸锡可焊性的更详细说明,使用锡铅和无铅焊料以及适当的助焊剂。
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IPC-582 - Study/Report

Cleaning & Cleanliness Test Program for Phase 3-Low Solids Fluxes & Pastes Processed in Ambiant Air

Document #:
IPC-TR-582
Revision
Original Version
Product Type
Study/Technical Report
Released:  10/02/2018
Language
English
Current Revision
This document details the test procedures, test results and team conclusions for the IPC Cleaning and Cleanliness Testing Program, Phase 3, Low Solids Flux in Ambient Air. This effort has been part of a multi-stage program to investigate material and process alternatives to the use of chlorofluorocarbons (CFCs) in electronics manufacturing. This Phase 3 effort has been dedicated to characterizing...

IPC-TR-585 - Study/Report

Time, Temperature and Humidity Stress of Final Board Finish Solderability

Document #:
IPC-TR-585
Revision
Original Version
Product Type
Study/Technical Report
Released:  05/01/2006
Language
English
Current Revision
This Technical Report details the investigations into identifying stress tests that distinguish between robust and non-robust surface finishes. A robust finish will pass a test for solderability whereas a non-robust finish will fail. The stress tests identified do not necessarily duplicate real world environment (fabrication of the bare printed board through assembly), but they must correlate to...
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IPC-2231 - Standard Only

卓越设计(DFX)指南

Document #:
IPC-2231
Revision
Original Version
Product Type
Standard Only
Released:  04/09/2020
Language
Chinese
Current Revision
本文件提供了制定最佳实践方法的指南,用于在开发正式DFX(面向可制造性、可制作性、可组装性、可测试性、成本、可靠性、环境、重用性设计)的过程中对采用表面贴装和通孔器件的印制板组件进行布局。

IPC-A-610 - Revision D - Standard Only

Acceptability of Electronic Assemblies

Document #:
IPC-A-610
Revision
D
Product Type
Standard Only
Released:  08/20/2008
Language
Czech
This is the Czech Language version of IPC-A-610D Lead free acceptance criteria and pictures now included! Reformatted-easier to find acceptance criteria! IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610D illustrates industry-accepted workmanship criteria for electronics assemblies through full-color...
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IPC-TR-587 - Standard Only

Conformal Coating Material and Application ‘‘State of the Industry’’ Assessment Report

Document #:
IPC-TR-587
Revision
Original Version
Product Type
Study/Technical Report
Released:  08/04/2020
Language
English
Current Revision
IPC-TR-587 technical report delivers results of a major study on conformal coating. In most manufacturing specifications, conformal coating thickness is defined as the thickness of the final polymer film on a flat, unencumbered surface of the assembly, however conformal coating thickness on other assembly and component surfaces is not characterized. IPC-TR-587 is a report outlining an IPC study of...
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IPC-A-610 - Revision E - Standard Only

电子组件的可接受性

Document #:
IPC-A-610
Revision
E
Product Type
Standard Only
Released:  04/13/2010
Language
Chinese
IEC正在签署将IPC-A-610作为全球首选的电子组装国际验收标准的文件。 IPC-A-610是全球应用最广泛的电子组装标准。作为所有质量保证和组装部门的必备文件,它通过彩色图片和示意图图示了业界公认的工艺要求。主要内容包括挠性电路的连接、母子板、部件叠装、无铅、通孔元器件朝向和焊接要求、SMT(新端子类型)和分立布线组件、机械组装、清洗、标记、涂覆层和层压板要求。 对于所有检验人员、操作人员和培训员,IPC-A-610是一个无价之宝。E版本共有809张关于可接受性要求的图片和示意图,其中165张为新增或修订的。最新版本的清晰性和准确度经过了认真地审查。本文件中的一些要求已与业界一致同意的其他文件的相关要求同步,可与材料和工艺标准IPC J-STD-001配套使用。 下载IPC-A-610E版本相对于D版本的主要修订变化文件,本文件为PDF文件(只有英文版)。

IPC-A-610 - Revision G - Standard Only

Abnahmekriterien für elektronische Baugruppen

Document #:
IPC-A-610
Revision
G
Product Type
Standard Only
Released:  05/24/2018
Language
German
IPC-A-610 ist die weltweit am meisten verwendete Abnahme-Richtlinie zur Elektronik-Montage. Aktualisiert durch das Fachwissen von Experten aus 17 Ländern, bietet dieses Dokument der Branche aktuellste Kriterien und neue bzw. aktualisierte Illustrationen. Es ist ein absolutes Muss für Prüfer, Montagemitarbeiter und Andere, die ein Interesse an Abnahmekriterien für elektronische Baugruppen haben...
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IPC-A-610 - Revision F - Standard Only

Abnahmekriterien für elektronische Baugruppen

Document #:
IPC-A-610
Revision
F
Product Type
Standard Only
Released:  07/13/2015
Language
German
IPC-A-610 ist die weltweit am meisten verwendete Richtlinie zur Elektronik-Montage. Die IPC-A-610F, ein Muss für alle Qualitätssicherungs- und Montageabteilungen, illustriert anerkannte Abnahmekriterien für die Verarbeitungsqualität elektronischer Baugruppen. Sie enthält detaillierte Angaben über sowohl zulässige Zustände als auch Fehlerzustände und wird durch farbige Bilder und Illustrationen...

IPC-A-610 - Revision E - Standard Only

Abnahmekriterien für elektronische Baugruppen

Document #:
IPC-A-610
Revision
E
Product Type
Standard Only
Released:  08/26/2010
Language
German
Die IPC-A-610 befindet sich im Anerkennungsverfahren durch die IEC (International Electrotechnical Commision) als weltweit bevorzugter und international anerkannter Standard für elektronische Baugruppen. IPC-A-610 ist der meist benutzte Standard für elektronische Baugruppen weltweit. IPC-A-610E zeigt die von der Industrie akzeptierten Kriterien für die Verarbeitungsgüte von elektronischen...
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IPC-A-610 - Revision D - Standard Only

Abnahmekriterien für elektronische Baugruppen

Document #:
IPC-A-610
Revision
D
Product Type
Standard Only
Released:  02/01/2005
Language
German
This is the German Language version of IPC-A-610D Lead free acceptance criteria and pictures now included! Reformatted-easier to find acceptance criteria! IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610D illustrates industry-accepted workmanship criteria for electronics assemblies through full-color...

IPC-A-610 - Revision G - Standard Only

Kritéria přijatelnosti elektronických sestav

Document #:
IPC-A-610
Revision
G
Product Type
Standard Only
Released:  01/24/2019
Language
Czech
IPC-A-610 je nejpoužívanější dokument pro provádění přejímek elektronických sestav. Aktualizován účastníky ze 17 zemí zajišťuje poznatky a expertizu. Tento dokument přináší průmyslu nejnovější kritéria spolu s mnoha novými a revidovanými ilustracemi Jde o nutno příručku pro kontrolory, operátory a další pracovníky, kterých se týkají kritéria přijatelnosti elektronických sestav. IPC-A-610 je...
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IPC-A-610 - Revision E - Standard Only

Kritéria přijatelnosti elektronických sestav

Document #:
IPC-A-610
Revision
E
Product Type
Standard Only
Released:  04/13/2010
Language
Czech
IEC pracuje na uznání standardu IPC-A-610 jako celosvětově doporučené normy pro přejímky elektronických sestav. IPC-A-610 je celosvětově nejpoužívanější standard pro montáž elektronických sestav. Je nezbytný pro zajištění kvality a montáže, IPC-A-610E názorně objasňuje kritéria přijatelnosti elektronických sestav prostřednictvím barevných fotografií a ilustrací. Témata zahrnují ohebná připojení...

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Coming Soon

IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-6905: Qualification and Performance Specification for Additively Manufactured Electronics (AME)

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC/JEDEC-9702A: Monotonic Bend Characterization of Board-Level Interconnects

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards

IPC-9716A: Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies

IPC-9711: Generic Requirements for Automated Inspection Process Control

IPC-HERMES-9852 Version 1.7: The Global Standard for Machine-to-Machine Communication in SMT Assembly

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