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IPC-A-610 este cel mai folosit standard din lume în industria electronică de asamblare. Actualizat prin participarea a 17 țări, oferind informații și expertiză, acest document aduce cele mai recente criterii în industrie cu numeroase graficii noi și revizuite. Acesta este un standard de nelipsit pentru toți inspectorii, operatorii și toți ceilalți interesați de criteriile de acceptare ale...

IPC-A-610, tüm dünyada elektronik üretimde yaygın olarak kullanılan bir standarttır. Tüm üretim ve kalite güvence departmanları için zorunlu olan IPC-A-610F, elektronik üretim için endüstri tarafından kabul gören işçilik kriterlerine ait kabul edilebilir ve kusur koşullarını yansıtan çok renkli fotoğraflar ve çizimlere sahiptir. Bu revizyon kaplı delik-içi dolgusu ve BGA boşluk kriterlerinin...

IEC, IPC-A-610'un elektronik üretimde tüm dünyada tercih edilen uluslararası kabul standardı olması için bir doğrulama sürecindedir. IPC-A-610, dünyada en çok kullanılan elektronik üretim standardıdır. Tüm üretim ve kalite güvence departmanları için zorunlu olan IPC-A-610E, elektronik üretim için endüstri tarafından kabul gören işçilik kriterlerine ait çok renkli fotoğraflar ve çizimlere sahiptir...

PC-A-610 เป็นเอกสารการยอมรับงานประกอบอิเล็กทรอนิกส์ที่ใช้กันแพร่หลายมากที่สุด มีความทันสมัย โดยได้รับการสนับสนุนข้อมูลและความเชี่ยวชาญจากผู้มีส่วนร่วม 17 ประเทศ เอกสารนี้นำเสนอเกณฑ์ข้อกำหนดล่าสุดพร้อมด้วยรูปภาพกราฟิกใหม่ๆ และที่ได้รับการแก้ไขเพื่อให้สอดคล้องกับอุตสาหกรรม มาตรฐานนี่เป็นสิ่งจำเป็นสำหรับผู้ตรวจสอบ พนักงานผู้ประกอบงาน...

IPC-A-610 เป็นมาตรฐานที่ได้มีการนำไปใช้กันอย่างแพร่หลายทั่วโลกในการประกอบงานอิเล็กทรอนิกส์ เป็นสิ่งที่ต้องมีสำหรับการประกันคุณภาพ และหน่วยงานการผลิต, IPC-A-610F แสดงให้เห็นถึงเกณฑ์ฝีมือที่ยอมรับได้ของงานประกอบอิเล็กทรอนิกส์ผ่านข้อความอย่างละเอียดที่สะท้อนถึงสภาวะที่สามารถยอมรับได้และสภาวะข้อบกพร่อง สนับสนุนด้วยภาพถ่ายและภาพประกอบสีอย่างเต็มรูปแบบ ในการปรับปรุงฉบับใหม่นี้...

The A-53-Gerber is a single-sided test board having six SIR test patterns which were designed for surface insulation testing. The test patterns consist of two comb patterns with 500µm (0.0197”) lines/spaces, two comb patterns with 318µm (0.0125”) lines/spaces and two comb patterns with 200µm (0.0079) lines/spaces. The contact fingers of the board are normally gold plated for compatibility with...

IPC-A-610 là bộ tiêu chuẩn cho các lắp ráp điện tử được sử dụng rộng rãi nhất trên thế giới. Là một bắt buộc cho các bộ phận đảm bảo chất lượng sản phẩm và lắp ráp sản phẩm, IPC-A-610E minh họa các tiêu chuẩn công nghiệp chấp nhận sản phẩm cho các lắp ráp điện tử bằng các hình ảnh minh họa màu sắc. Phiên bản này bao gồm hai kiểu bản cực SMT, cũng như những thay đổi ở các tiêu chuẩn chấp nhận cho...

IEC đang trong tiến trình chứng thực IPC-A-610 như là một Bộ Tiêu Chuẩn Chấp Nhận cho các lắp ráp điện tử Quốc tế. IPC-A-610 là bộ tiêu chuẩn cho các lắp ráp điện tử được sử dụng rộng rãi nhất trên thế giới. Là một bắt buộc cho các bộ phận đảm bảo chất lượng sản phẩm và lắp ráp sản phẩm, IPC-A-610E minh họa các tiêu chuẩn công nghệ chấp nhận sản phẩm cho các lắp ráp điện tử bằng các hình ảnh minh...

В настоящее время МЭК находится в процессе рекомендации IPC-A-610 в качестве всемирно одобренного международного стандарта по приемке электронных сборок. IPC-A-610 является наиболее широко известным в мире стандартом электронной сборки. Обязательный для отделов сборки и обеспечения качества, документ IPC-A-610E иллюстрирует критерии качества изготовления, принятые в промышленности, посредством...

This is the Russian Language version of IPC-A-610D Now DoD Adopted! Download the adoption notice through this link. This is a .pdf file Lead free acceptance criteria and pictures now included! Reformatted-easier to find acceptance criteria! IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610D illustrates...

This is the Vietnamese Language version of IPC-A-610D Lead free acceptance criteria and pictures now included! Reformatted-easier to find acceptance criteria! IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610D illustrates industry-accepted workmanship criteria for electronics assemblies through full...

IPC-A-610是一份使用非常廣泛的電子裝配驗收文件。標準委員會的成員來自17個國家，他們提供數據和專業知識來完成升版工作，這份文件帶來了最新的標準，以及許多新的修訂的行業圖片。 這是一份檢查員，操作者和其他感興趣人員必須具備的電子組件接收標準的文件. IPC-A-610是和J-STD-001協同開發的，並在本修訂版中首次使用了IPC/WHMA-A-620.2017年11月翻譯。

The Cleanliness and Residue Evaluation Test Board is designed to give the manufacturing process professional a tool to help assess the impact of cleanliness and residues on bare boards and finished assemblies, as well as a tool to assess the impact of changing manufacturing parameters on cleanliness. This artwork package provides .pdf master drawings and Gerber files necessary for fabricating the...

Organizația C.E.I. este în curs de a aproba IPC-A-610 ca un standard internațional acceptat, cu preferabilitate globală pentru asamblare, în industria electronică. Dintre standardele folosite în industria de asamblare aplicații electronice, IPC-A-610 are cea mai mare răspândire în lume. Ca o necesitate absolută pentru toate departamentele în asigurarea calității și în liniile de asamblare, IPC-A...

Free Review German Language Edition Now updated to Revision F of the latest IPC-A-610 industry standard for the Acceptability of Electronic Assemblies, this Training & Reference Guide illustrates critical acceptance criteria for the evaluation of surface mount solder connections. At only 44 pages and a compact 5.5 x 8.5 inch (14 x 21.5 cm) size, these convenient spiral-bound manuals make it easy...

Based on data from 118 electronics assembly companies and PCB fabricators worldwide, this report presents data on the current state (2016) of PCB fabrication and assembly, and the industry’s predictions for the data by 2021. The data are segmented by five applications: automotive, defense and aerospace, high-end systems, industrial and medical electronics. Topics covered include board properties...

These procedures are additions to the IPC-7711B/7721B. Section 2: 3.11.1; 5.7.6; 5.8.1.1; 5.8.1.2; 5.8.1.3; Section 3: 4.7.4; 4.7.5; all released November 2011. Section 2: 5.5.7 released February 2013. The pages herein are authorized for download, reproduction, and printing for insertion into the IPC- 7711B/7721B. These procedures are not intended for previous versions of IPC-7711/7721

Esta guía proporciona procedimientos de retrabajo, reparación y modificación de ensambles de tablero impreso. Incluídos en esta revisión son los procedimientos previamente lanzados como páginas con cambios, una información general actualizada y sección de procedimientos comunes, nuevos procedimientos de BGAs utilizando sistemas enfocados de reflujo de infrarrojos con precalentadores y...

Dieser Leitfaden enthält Verfahren für die Nacharbeit, Reparatur und Änderung von Leiterplatten-Baugruppen. In diese Ausgabe wurden die Verfahren integriert, die in die vorherige Ausgabe als Änderungsseiten aufgenommen wurden. Der Abschnitt Allgemeine Angaben und häufig angewendete Verfahren wurde aktualisiert. Neue Verfahren für BGAs wurden aufgenommen, die fokussierte IR-Reflow-Systeme mit...

本指南提供了印刷電路板組件的返工，維修和修改程序。 本次修訂包括以前作為修訂本發布的程序，基本信息和通用程序部分的更新，使用具有預熱功能的聚焦紅外返工系統的BGA新程序，和所有其他程序的一般更新。許多規程包含彩色插圖。全文超過300頁。於2017年1月正式發布。2017年5月翻譯。

Ce guide fournit des procédures de reprise, réparation et modification d’assemblages de circuits imprimés. Cette révision inclut les changements de pages des procédures publiées précédemment, une mise à jour de la section information générale et procédures communes, de nouvelles procédures pour les BGAs utilisant des Systèmes de Refusion par IR focalisés avec préchauffe intégrale et des mises à...

This is the Spanish language translation of IPC-7711B/7721B IPC-7711B/7721B Rework, Modification and Repair of Electronic Assemblies has received a complete procedure by procedure update to assure applicability to both lead free and traditional SnPb soldered assemblies. This single volume includes all previously published changes and several new procedures for BGAs (including reballing) and flex...

本指南提供了印刷电路板组件的返工，维修和修改程序。 本次修订包括以前作为修订本发布的程序，基本信息和通用程序部分的更新，使用具有预热功能的聚焦红外返工系统的BGA新程序，和所有其他程序的一般更新。许多规程包含彩色插图。全文超过300页。于2017年1月正式发布。2017年5月翻译。

This is the Polish language version of IPC-7711/21A. IPC-7711A, Rework of Electronic Assemblies (with Change 1) and IPC-7721A, Repair and Modification of Printed Boards and Electronic Assemblies (with Changes 1 and 2) now includes additional support for BGAs and flex-print repair. IPC-7711A includes procedural requirements, tools, materials and methods to be used in removing and replacing...

本手册包括了维修和返工电子组件及印制板所需的一切。《IPC-7711/7721B电子组件的返工、修改和维修》收录了一整套经修订的程序，以确保其即适用于无铅电子组件，又适用于传统的有铅电子组件。B版包括了之前发布的修订变化及几项新的BGA维修及返工程序（包括重新植球）及挠性印制电路的维修。第一部分--通用程序也进行了更新，更易使用，并对所有的程序提供了重要的基本信息和指南。第一部分包括了返工、维修和修改的通用程序。第二部分是IPC-7711B，其中的程序包括拆除和替换表面贴装元器件及通孔元器件时所采用的工具、材料及方法。第三部分是IPC-7721B，其中包括修改组件和维修层压板、导体时所采用的程序。本手册采用活页夹装订，易于更新。用户可将公司内部的特殊程序插入其中，或拆下某一项具体工作所需的单页放在工作台面上，保持工作区域整洁。B版本所做的一些修订可从IPC网站（www.ipc.org...