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Establishes the general requirements for documentation necessary to fully describe end product printed boards, regardless of raw material, special fabrication requirements, layer count or end product usage. Includes master drawing requirements, board definition and artwork/phototooling. 94 pages. Revised May 1995.

IPC-2222B used in conjunction with IPC-2221, establishes the specific requirements for the design of rigid organic printed boards and other forms of component mounting and interconnecting structures. The IPC-2222B standard applies to single-sided, double-sided, or multi-layered boards. Key concepts in IPC-2222B are rigid laminate properties, design requirements for printed board assembly and...

The IPC-7525C standard provides guidance for the design and fabrication of stencils for solder paste and surface-mount adhesive with much of the content based on the experience of stencil designers, fabricators, and users.

This document provides useful and practical information for developing thermal profiles to produce acceptable SnPb and Pb-free electronics assemblies using reflow, vapor phase, laser, selective and wave soldering equipment. The document also includes a troubleshooting guide for addressing common defects which can be attributed to profiling.

UPDATED! This standard describes a data format for transmitting bare board electrical test information in digital form, including data suitable for computer-aided repair. When used as a netlist input to test data processing, the receiver of IPC-D-356B data will determine test point assignments and positioning. Enhancements to the B Revision include updates to the concept of testable areas to...

IPC-2226A, Sectional Design Standards for High Density Interconnect (HDI) Printed Boards is used in conjunction with IPC-2221B. The IPC-2226A standard establishes requirements and considerations for the design of high density interconnect (HDI) printed boards and microvia technology. Revision A constitutes a substantial update to the document, with an all new color key for HDI constructions, new...

IPC-4562A standard covers metal unsupported foils and foils supported by carrier films suitable for subsequent use in printed boards. IPC-4562B addresses the requirements of metal foils used in printed wiring applications.

The IPC-1752B standard establishes the requirements for exhanging material and substance data between suppliers and their customers for electrical and electronics products and other produicts. IPC-1752B includes data fields to help supply chain members transfer materials data required for submission into the ECHA SCIP database.

Amendment 1 to IPC-1751A standard provides the principles and details for declarations necessary between members of a supply chain relationship. This standard is the first in a series of standards that permits segmentation of declaration details based on the subject and scope of the declaration as well as the manufacturing domain. This standard contains general information and is supplemented by...

This standard establishes the requirements for timely customer notification of changes to electronic products and associated processes.

This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. The goal of this notification standard is to better enable customers to manage and mitigate the disruption caused by the discontinuation of a product and to ensure continuity of supply. This standard establishes the requirements for timely customer notification of planned...

The IPC-1921A handbook provides problems, causes and possible corrective actions related to printed board manufacturing processes. Includes more than 200 photos and illustrations depicting common defects.

This standard provides and defines key characteristics and test methods for procuring printed electronics substrates. Includes six materials specification sheets.

The IPC-4591A standard establishes the classification system and the qualification and quality conformance requirements for functional conductive materials used in printed electronics applications. It provides companies that procure functional materials for printed electronics with the necessary technical structure to design and manufacture products meeting conformance to industry-determined...

The IPC-4412C covers the requirements for reinforcements woven from "E"glass yarn. These reinforcements are used in the production of prepregs, some of which are pressed into laminates. These prepregs and laminates are the base materials for rigid and mulitlayer printed boards. The IPC-4412C standard contains tables which describe each fabriic style in detail including the yarn used, the number of...

This document describes the design and assembly challenges and ways to address those challenges for implementing 3D component technology. Recognizing the effects of combining multiple uncased semiconductor die elements in a single-package format can impact individual component characteristics and can dictate suitable assembly methodology. The information contained in this standard focuses on...

The IPC-1401A standard specifies the requirements and best practice guidelines for an effective corporate social responsibility (CSR) management system to help an enterprise integrate CSR as a customer requirement into products and value chain activities, as well as to identify and manage CSR risks and opportunities through cooperation with customers and suppliers, to enhance the competitive...

The IPC-1755A standard establishes the requirements for exchanging data between suppliers and their customers in regard to the responsible resourcing of minerals. The IPC-1755As standard originally addressed conflict minerals within the scope of the Dodd-Frank Act in the US. IPC-1755A expands the scope of this document to address global responsible minerals sourcing.

IPC-4203B establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides, which are to be used as cover material and/or bondply for flexible printed circuitry, as well as supported or unsupported adhesive films to be used in the fabrication of flexible printed circuitry. IPC-4203B does not cover non...

IPC-7094A describes the design and assembly challenges for implementing flip chip technology in a direct chip attach (DCA) assembly. The effect of bare-die or die-size components in a flip chip format has an impact on component characteristics and dictates the appropriate assembly methodology. The IPC-7094A standard focuses on design, assembly methodology, critical inspection, repair and...

This is the document all process engineers must have! Useful for day-to-day problem solving, it contains case histories of problems and corrective action in the design, manufacture, assembly and testing of printed wiring products. Each section has been updated to reflect today's manufacturing challenges. Sections address documentation, phototooling, raw materials, mechanical operations, hole...

Provides requirements for dielectric adhesives to hold components in place from the mounting to the soldering process and identifies test methods to ensure their long term properties. 9 pages. Released December 2014.

Establishes nomenclature and requirements for solid carbide twist drills with four-faceted drill points used in the fabrication of printed boards. 9 pages. Revised April 1994.

This document is a general overview of computer aided design and its processes, techniques, considerations and problem areas with respect to printed circuit design. Describes the CAD design process from initial input package requirements to engineering change. 44 pages. Revised February 1988.

This specification establishes the qualification and performance requirements for encapsulated discrete wire interconnection boards with wires that terminate in plated holes. 62 pages. Revised May 1990.