Products

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IPC-1791 - Revision E - Standard Only

Trusted Electronic Designer, Fabricator and Assembler Requirements

Document #:
IPC-1791
Revision
E
Product Type
Standard Only
Released:  01/29/2026
Language
English
Current Revision
This standard provides minimum requirements, policies and procedures for printed board design, fabrication, assembly, and cable and wire harness assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products. These trusted sources shall ensure quality, supply chain risk management (SCRM), security and chain...
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IPC-7711/21 - Revision D - Standard Only

Rework, Modification and Repair of Electronic Assemblies

Document #:
IPC-7711/21
Revision
D
Product Type
Standard Only
Released:  02/06/2024
Language
English
Current Revision
The IPC-7711/21 guide provides procedures for rework, repair and modification of printed board assemblies, including tools and materials, common procedures, coating removal and graphics to assist the user.
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IPC-2223 - Revision E - Standard Only

Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

Document #:
IPC-2223
Revision
E
Product Type
Standard Only
Released:  01/24/2020
Language
English
Current Revision
IPC-2223E used in conjunction with IPC-2221, IPC-2223 establishes the specific requirements for the design of flexible printed boards and forms of component mounting and interconnecting structures. The flexible materials used in the structures are comprised of insulating films, reinforced and/or non-reinforced dielectric in combination with metallic materials. IPC-2223E provides new design...
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IPC/WHMA-A-620 - Revision F - Standard Only

Requirements and Acceptance for Cable and Wire Harness Assemblies

Document #:
IPC/WHMA-A-620
Revision
F
Product Type
Standard Only
Released:  12/01/2025
Language
English
Current Revision
IPC/WHMA-A-620 is the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies. IPC/WHMA-A-620F describes materials, methods, tests and acceptance criteria for producing crimped, mechanically secured and soldered interconnections and the related assembly activities associated with cable and harness assemblies.
IPC-7095E - Cover Image

IPC-7095 - Revision E - Standard Only

Design and Assembly Process Guidance for Ball Grid Arrays (BGAs)

Document #:
IPC-7095
Revision
E
Product Type
Standard Only
Released:  10/17/2024
Language
English
Current Revision
The IPC-7095E describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages. IPC-7095E provides the useful and practical information to those who use or are considering using BGAs. IPC-7095E provides descriptions on how to...

IPC-7095 - Revision D - Standard with Amendment 1

Design and Assembly Process Implementation for BGAs

Document #:
IPC-7095
Revision
D
Product Type
Standard with amendment(s)
Released:  07/09/2019
Language
English
Current Revision
The IPC-7095D-AM1 standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages. IPC-7095D-AM1 provides the useful and practical information to those who use or are considering using BGAs. IPC-7095D-AM1 provides...
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IPC-1791 - Revision D - Standard Only

Trusted Electronic Designer, Fabricator and Assembler Requirements

Document #:
IPC-1791
Revision
D
Product Type
Standard Only
Released:  11/01/2023
Language
English
Current Revision
IPC-1791D standard provides minimum requirements, policies and procedures for printed board design, fabrication, assembly, and cable and wire harness assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products. These trusted sources shall ensure quality, supply chain risk management (SCRM), security and...
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IPC-D-350 - Revision D - Standard Only

Printed Board Description in Digital Form

Document #:
IPC-D-350
Revision
D
Product Type
Standard Only
Released:  07/01/1992
Language
English
Current Revision
This document bears two reference numbers, and may be obtained from IPC or the IEC. IPC-D-350D and IEC 1182-1 are identical in technical content. The IEC version of this document also contains a French translation. The IEC is responsible for the accuracy of that translation.Specifies record formats used to describe printed board products with detail sufficient for tooling, manufacturing and...
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IPC-1602 - Revision A - Standard Only

Standard for Printed Board Handling and Storage

Document #:
IPC-1602
Revision
A
Product Type
Standard Only
Released:  12/17/2024
Language
English
Current Revision
The industry's sole standard on the handling, packaging and storage of printed boards. The requirements in this document are intended to protect printed boards from contamination, physical damage, solderability degradation, ESD and moisture uptake. Consideration is given to packaging material types and methods, production environment, handling and transport of product, and establishing baking...

IPC-7351 - Revision B - Standard Only

Generic Requirements for Surface Mount Design and Land Pattern Standard

Document #:
IPC-7351
Revision
B
Product Type
Standard Only
Released:  07/01/2010
Language
English
Current Revision
This popular document covers land pattern design for all types of passive and active components, including resistors, capacitors, MELFs, SOPs, QFPs, BGAs, QFNs and SONs. The standard provides printed board designers with an intelligent land pattern naming convention, zero component rotations for CAD systems and three separate land pattern geometries for each component that allow the user to select...
IPC-2231A Cover Image

IPC-2231 - Revision A - Standard Only

DFX Guidelines

Document #:
IPC-2231
Revision
A
Product Type
Standard Only
Released:  10/27/2021
Language
English
Current Revision
IPC-2231A provides guidelines for establishing a best practice methodology for use in developing a formal DFX (Design for Manufacturing, Fabrication, Assembly, Testability, Cost, Reliability, Environment, Reuse) process for layout of printed boards.
IPC-2221C Cover Image

IPC-2221 - Revision C - Standard Only

Generic Standard on Printed Board Design

Document #:
IPC-2221
Revision
C
Product Type
Standard Only
Released:  12/14/2023
Language
English
Current Revision
IPC-2221C is the foundation design standard for all documents in the IPC-2220 series. It establishes the generic requirements for the design of printed boards and other forms of component mounting or interconnecting structures, whether single-sided, double-sided or multilayer. Among the many updates to Revision C are new guidance and requirements on material and copper foil selection...
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IPC-1782 - Revision B - Standard Only

Standard for Manufacturing and Supply Chain Traceability of Electronic Products

Document #:
IPC-1782
Revision
B
Product Type
Standard Only
Released:  10/20/2023
Language
English
Current Revision
IPC-1782B establishes minimum requirements for manufacturing and supply chain traceability based on perceived risk. IPC-1782B applies to all products, processes, assemblies, parts, components, equipment used and other items as defined by users and suppliers in the manufacture of printed board assemblies, as well as mechanical assembly and printed board fabrication. IPC-1782B is applicable both for...
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IPC-7093 - Revision B - Standard Only

Design and Assembly Process Guidance for Bottom Termination Components (BTCs)

Document #:
IPC-7093
Revision
B
Product Type
Standard Only
Released:  02/05/2026
Language
English
Current Revision
The IPC-7093B guideline provides essential design and assembly guidance for implementing bottom termination components (BTCs). Specifically, IPC-7093B provides guidelines on critical design, materials, assembly, inspection, repair, quality, and reliability issues associated with BTCs.

IPC-2581 - Revision C - Standard Only

Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

Document #:
IPC-2581
Revision
C
Product Type
Standard Only
Released:  11/20/2020
Language
English
Current Revision
The IPC-2581C standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements. This format may be used for transmitting information between a printed board designer and a manufacturing or assembly facility. The data is most...
IPC-D-620A Cover Image

IPC-D-620 - Revision A - Standard Only

Design and Critical Process Requirements for Cable and Wiring Harnesses

Document #:
IPC-D-620
Revision
A
Product Type
Standard Only
Released:  02/28/2022
Language
English
Current Revision
The IPC-D-620A standard provides design and critical process requirements for cable and wire harness assemblies as well as military/space applications. IPC-D-620A is the design requirements companion to IPC/WHMA-A-620, "Requirements and Acceptance for Cable and Wire Harness Assemblies," and its associated Space Addendum. Three white papers are included to provide guidance on key topics discussed...
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IPC-D-325 - Revision A - Standard Only

Documentation Requirements for Printed Boards

Document #:
IPC-D-325
Revision
A
Product Type
Standard Only
Released:  05/01/1995
Language
English
Current Revision
Establishes the general requirements for documentation necessary to fully describe end product printed boards, regardless of raw material, special fabrication requirements, layer count or end product usage. Includes master drawing requirements, board definition and artwork/phototooling. 94 pages. Revised May 1995.

IPC-2222 - Revision B - Standard Only

Sectional Design Standard for Rigid Organic Printed Boards

Document #:
IPC-2222
Revision
B
Product Type
Standard Only
Released:  10/07/2020
Language
English
Current Revision
IPC-2222B used in conjunction with IPC-2221, establishes the specific requirements for the design of rigid organic printed boards and other forms of component mounting and interconnecting structures. The IPC-2222B standard applies to single-sided, double-sided, or multi-layered boards. Key concepts in IPC-2222B are rigid laminate properties, design requirements for printed board assembly and...
IPC-7525C Cover Image

IPC-7525 - Revision C - Standard Only

Stencil Design Guidelines

Document #:
IPC-7525
Revision
C
Product Type
Standard Only
Released:  02/28/2022
Language
English
Current Revision
The IPC-7525C standard provides guidance for the design and fabrication of stencils for solder paste and surface-mount adhesive with much of the content based on the experience of stencil designers, fabricators, and users.
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IPC-7530 - Revision B - Standard Only

Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)

Document #:
IPC-7530
Revision
B
Product Type
Standard Only
Released:  03/13/2025
Language
English
Current Revision
This document provides useful and practical information for developing thermal profiles to produce acceptable SnPb and Pb-free electronics assemblies using reflow, vapor phase, laser, selective and wave soldering equipment. The document also includes a troubleshooting guide for addressing common defects which can be attributed to profiling.

IPC-D-356 - Revision B - Standard Only

Bare Substrate Electrical Test Data Format

Document #:
IPC-D-356
Revision
B
Product Type
Standard Only
Released:  10/01/2002
Language
English
Current Revision
UPDATED! This standard describes a data format for transmitting bare board electrical test information in digital form, including data suitable for computer-aided repair. When used as a netlist input to test data processing, the receiver of IPC-D-356B data will determine test point assignments and positioning. Enhancements to the B Revision include updates to the concept of testable areas to...

IPC-2226 - Revision A - Standard Only

Sectional Design Standard for High Density Interconnect (HDI) Printed Boards

Document #:
IPC-2226
Revision
A
Product Type
Standard Only
Released:  10/12/2017
Language
English
Current Revision
IPC-2226A, Sectional Design Standards for High Density Interconnect (HDI) Printed Boards is used in conjunction with IPC-2221B. The IPC-2226A standard establishes requirements and considerations for the design of high density interconnect (HDI) printed boards and microvia technology. Revision A constitutes a substantial update to the document, with an all new color key for HDI constructions, new...
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IPC-J-STD-048 - Revision A - Standard Only

Notification Standard for Product Discontinuance

Document #:
IPC-J-STD-048
Revision
A
Product Type
Standard Only
Released:  01/22/2026
Language
English
Current Revision
This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. The goal of this notification standard is to better enable customers to manage and mitigate the disruption caused by the discontinuation of a product and to ensure continuity of supply. This standard establishes the requirements for timely customer notification of planned...
IPC-9121A Cover Image

IPC-9121 - Revision A - Standard Only

Troubleshooting for Printed Board Fabrication Processes

Document #:
IPC-9121
Revision
A
Product Type
Standard Only
Released:  04/14/2022
Language
English
Current Revision
The IPC-1921A handbook provides problems, causes and possible corrective actions related to printed board manufacturing processes. Includes more than 200 photos and illustrations depicting common defects.
IPC-7091A Cover Image

IPC-7091A - Revision A - Standard Only

Design and Assembly Process Implementation of 3D Components

Document #:
IPC-7091
Revision
A
Product Type
Standard Only
Released:  01/13/2023
Language
English
Current Revision
This document describes the design and assembly challenges and ways to address those challenges for implementing 3D component technology. Recognizing the effects of combining multiple uncased semiconductor die elements in a single-package format can impact individual component characteristics and can dictate suitable assembly methodology. The information contained in this standard focuses on...
IPC-1401A Cover Image

IPC-1401 - Revision A - Standard Only

Corporate Social Responsibility Management System Standard

Document #:
IPC-1401
Revision
A
Product Type
Standard Only
Released:  11/29/2021
Language
English
Current Revision
The IPC-1401A standard specifies the requirements and best practice guidelines for an effective corporate social responsibility (CSR) management system to help an enterprise integrate CSR as a customer requirement into products and value chain activities, as well as to identify and manage CSR risks and opportunities through cooperation with customers and suppliers, to enhance the competitive...

IPC-7094 - Revision A - Standard Only

Design and Assembly Process Implementation for Flip Chip and Die-Size Components

Document #:
IPC-7094
Revision
A
Product Type
Standard Only
Released:  02/14/2018
Language
English
Current Revision
IPC-7094A describes the design and assembly challenges for implementing flip chip technology in a direct chip attach (DCA) assembly. The effect of bare-die or die-size components in a flip chip format has an impact on component characteristics and dictates the appropriate assembly methodology. The IPC-7094A standard focuses on design, assembly methodology, critical inspection, repair and...
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IPC-PE-740 - Revision A - Standard Only

Troubleshooting for Printed Board Manufacture and Assembly

Document #:
IPC-PE-740
Revision
A
Product Type
Standard Only
Released:  12/01/1997
Language
English
Current Revision
This is the document all process engineers must have! Useful for day-to-day problem solving, it contains case histories of problems and corrective action in the design, manufacture, assembly and testing of printed wiring products. Each section has been updated to reflect today's manufacturing challenges. Sections address documentation, phototooling, raw materials, mechanical operations, hole...
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IPC-D-390 - Revision A - Standard Only

Automated Design Guidelines

Document #:
IPC-D-390
Revision
A
Product Type
Standard Only
Released:  02/01/1988
Language
English
Current Revision
This document is a general overview of computer aided design and its processes, techniques, considerations and problem areas with respect to printed circuit design. Describes the CAD design process from initial input package requirements to engineering change. 44 pages. Revised February 1988.

IPC-D-310 - Revision C - Standard Only

Guidelines for Phototool Generation and Measurement Techniques

Document #:
IPC-D-310
Revision
C
Product Type
Standard Only
Released:  06/01/1991
Language
English
Current Revision
This document provides manufacturing and design considerations, input data requirements, test coupons, process control, tape and preform artwork, cut and strip artwork, vector photoplotting, rasterplotting, direct imaging, measurement and quality assurance. 68 pages. Revised June 1991.
IPC-A-610HC Cover Image

IPC-A-610 - Revision H - Addendum - Telecom

Telecom Addendum to IPC-A-610 Revision H Acceptability of Electronic Assemblies

Document #:
IPC-A-610
Revision
H
Product Type
Addendum
Released:  04/27/2023
Language
English
Current Revision
The IPC-A-610HC Telecom Addendum to IPC-A-610H Acceptability of Electronic Assemblies provides specific requirements for telecommunications products when it is specifically required by procurement documentation. Information in this document either supplements or replaces specifically identified requirements of IPC-A-610 Revision H by providing additional requirements to ensure that electrical and...
IPC-T-50N Cover Image

IPC-T-50 - Revision N - Standard Only

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

Document #:
IPC-T-50
Revision
N
Product Type
Standard Only
Released:  11/30/2021
Language
English
IPC-T-50N document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing English as a second language could understand the subtleties of the meaning. IPC-T-50N contains over 550 new or revised terms, including new terminology for via structures, surface mount device...
IPC-A-620E Space Cover Image

IPC/WHMA-A-620 - Revision E - Addendum - Space and Military

Space and Military Applications Electronic Hardware Addendum to IPC/WHMA-A-620

Document #:
IPC/WHMA-A-620
Revision
E
Product Type
Addendum
Released:  11/28/2023
Language
English
Current Revision
IPC/WHMA-A-620E-S space addendum provides additional requirements to IPC/WHMA-A-620E standard to ensure the reliability of cable and wire harness assemblies that must survive the vibration and thermal excursions encountered getting to and operating in the military and space environments. IPC/WHMA-A-620E-S cannot be used as a standalone document. It must be used with the base standard IPC/WHMA-A...
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IPC-A-610 - Revision G - Addendum - Rail Transit

Rail Transit Addendum to IPC-A-610G Acceptability of Electronic Assemblies

Document #:
IPC-A-610
Revision
G
Product Type
Addendum
Released:  05/31/2022
Language
English
Current Revision
IPC-A-610G-R rail transit addendum provides additional requirements to IPC-A-610G base standard, specifying a standardized set of acceptance criteria unique to electronic assemblies used in the rigorous micro-environment under high mechanical and environmental stresses associated with high railway equipment, to ensure industry-specific high reliability and environmental adaptability of electronic...

IPC-T-50 - Revision M - Standard Only

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

Document #:
IPC-T-50
Revision
M
Product Type
Standard Only
Released:  05/26/2015
Language
English
This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision M contains over 220 new or revised terms, including new terminology for conformal coatings, potting and encapsulation processes, stencil design, statistical process control, and flexible printed board...

IPC-T-50 - Revision K - Standard Only

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

Document #:
IPC-T-50
Revision
K
Product Type
Standard Only
Released:  07/17/2013
Language
English
This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision K contains more than 220 new or revised terms, including new terminology for thermal properties, etchback, assembly processing, hole drilling, and microvia technology. Also includes commonly used industry...
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IPC-HDBK-001 - Revision H - Handbook

Handbook and Guide to Supplement J-STD-001

Document #:
IPC-HDBK-001
Revision
H
Product Type
Handbook
Released:  03/08/2021
Language
English
Current Revision
The IPC-HDBK-001H is a companion document to J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies providing guidance and supporting information for the requirements found in the standard. IPC-HDBK-001H is structured to map paragraph-to-paragraph with the standard, it includes the "how-to" and "why" behind many of the criteria in an easy-to-use reference handbook.
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IPC-QRG-SMT - Training & Reference Guide

Surface Mount Solder Joint Evaluation Training & Reference Guide

Document #:
IPC-QRG-SMT
Revision
J
Product Type
Training & Reference Guide
Released:  04/22/2025
Language
English
Current Revision
This practical, easy-to-use guide illustrates surface mount solder connections included in the IPC-A-610 Acceptability of Electronic Assemblies standard. While not a replacement for the complete IPC-A-610H standard, this durable reference tool is a valuable instructional resource and job aid for accurate, on-the-job inspections across all three product classes. The guide features clear, color...

IPC-A-610 - Revision H - Standard Only

Acceptability of Electronic Assemblies

Document #:
IPC-A-610
Revision
H
Product Type
Standard Only
Released:  10/07/2020
Language
English
IPC-A-610H is the most widely used electronics assembly acceptance standard in the electronics industry. IPC-A-610H standard includes a general update to the document, introduces several new surface mount component types and removes target conditions. Participants from 29 countries provided their input and expertise to bring this document to the electronics industry. This is a must-have for...
IPC-A-610J - Cover Image

IPC-A-610 - Revision J - Redline Standard

Acceptability for Electronic Assemblies

Document #:
IPC-A-610
Revision
J
Product Type
Redline Standard
Released:  04/11/2024
Language
English
Current Revision
IPC-A-610H to IPC-A-610J redline document shows the changes from IPC-A-610H to IPC-A-610J in a side-by-side comparison of the two documents. The IPC-A-610J redline is only available in electronic format, it is not available in hardcopy. As a comparison document it does not replace the standard.
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IPC/WHMA-A-620 - Revision C - Addendum - Rail Transit

Rail Transit Addendum to IPC/WHMA-A-620C

Document #:
IPC/WHMA-A-620
Revision
C
Product Type
Addendum
Released:  05/31/2022
Language
English
Current Revision
IPC/WHMA-A-620C-R rail transit addendum provides additional requirements to IPC/WHMA-A-620C standard, describing materials, methods, tests, and acceptance criteria for producing crimped, mechanically secured, and soldered interconnections. It also provides the related assembly activities associated with cable and harness assemblies in rail transit industry, to ensure the high reliability and...
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IPC-A-610 - Revision H - Redline Standard

Acceptability of Electronic Assemblies - Redline

Document #:
IPC-A-610
Revision
H
Product Type
Redline Standard
Released:  10/07/2020
Language
English
Current Revision
IPC-A-610H Redline document shows the changes from IPC-A-610G to IPC-A-610H in a side-by-side comparison of the two documents. The IPC-A-610H redline is only available in electronic format, it is not available in hardcopy
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IPC-T-50 - Revision J - Standard Only

SUPERSEDED BY T-50K

Document #:
IPC-T-50
Revision
J
Product Type
Standard Only
Released:  10/18/2011
Language
English
This essential industry standard provides descriptions and illustrations of electronics interconnect industry terminology to help users and their customers break down language barriers. Revision J contains nearly 400 new or revised terms, including new terminology for chip scale and area array packaging, cable and wire harness technology, assembly processing, moisture sensitive components, and...

IPC-8497 - Standard Only

Cleaning Methods and Contamination Assessment for Optical Assembly

Document #:
IPC-8497
Revision
Original Version
Product Type
Standard Only
Released:  12/01/2005
Language
English
Current Revision
This standard describes the methods of inspecting and cleaning all optical interfaces so that interconnectivity integrity of the optical signal is maintained. The information provided focuses on techniques and methods to accomplish maximum quality of the interface and describes methods of contamination prevention. The target audience for this standard are Manufacturing Operators, Manufacturing...
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IPC/WHMA-A-620 - Revision F- Redline Standard

IPC/WHMA-A-620E to IPC/WHMA-620F Redline Comparison

Document #:
IPC/WHMA-A-620
Revision
F
Product Type
Redline Standard
Released:  01/05/2026
Language
English
Current Revision
IPC/WHMA-A-620F-RL is a redline document showing the difference from IPC/WHMA-A-620E to IPC/WHMA-A-620F. IPC/WHMA-A-620F-RL provides a side-by-side comparison of the two documents and includes the figures and tables. The document shows deleted/changed/moved text in the IPC/WHMA-A-620E pages and new/revised/moved text in the IPC/WHMA-A-620F pages. This is a visual tool showing the changes as a...

IPC-A-610 - Revision G - Standard Only

Acceptability of Electronic Assemblies

Document #:
IPC-A-610
Revision
G
Product Type
Standard Only
Released:  10/31/2017
Language
English
IPC-A-610 is the most widely used electronics assembly acceptance document. Updated with participants from 17 countries providing input and expertise, this document brings the latest criteria along with many new and revised graphics to the industry. This is a must-have for inspectors, operators and others with an interest in the acceptance criteria for electronic assemblies. IPC-A-610 is developed...
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IPC-A-610 - Revision F - Standard with Amendment 1

Acceptability of Electronic Assemblies

Document #:
IPC-A-610
Revision
F
Product Type
Standard with amendment(s)
Released:  05/09/2016
Language
English
IPC-A-610F with Amendment 1 incorporates the requirements of IPC-A-610F and IPC-A-610F Amendment 1 into one document. Criteria are presented in a seamless IPC-A-610 format, and there are no redline marks. This document is the equivalent to using IPC-A-610F and IPC-A-610F Amendment 1. IPC brings this version to industry to minimize confusion for those using both documents and those wishing to...
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IPC-T-50 - Revision P - Standard Only

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

Document #:
IPC-T-50
Revision
P
Product Type
Standard Only
Released:  11/25/2025
Language
English
Current Revision
This document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing English as a second language could understand the subtleties of the meaning. Revision P contains over 120 new or revised terms, including new terminology for back-drill structures, cable and wire...
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IPC-9271 - Standard Only

Guidelines for In System Programming

Document #:
IPC-9271
Revision
Original Version
Product Type
Standard Only
Released:  09/30/2025
Language
English
Current Revision
The IPC-9271 standard provides guidelines for device-level In-System Programming (ISP) as part of electronics assembly process. The standard addresses PCB design for ISP, fundamental characteristics when selecting an ISP programmer and the integration of the programmer in the production environment, including: fixtures, software, mechanical and process integration methodologies to increase...
IPC-WHMA-A-620E Cover Image

IPC/WHMA-A-620 - Revision E - Standard Only

Requirements and Acceptance for Cable and Wire Harness Assemblies

Document #:
IPC/WHMA-A-620
Revision
E
Product Type
Standard Only
Released:  10/19/2022
Language
English
IPC/WHMA-A-620E is the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies. IPC/WHMA-A-620E describes materials, methods, tests and acceptance criteria for producing crimped, mechanically secured and soldered interconnections and the related assembly activities associated with cable and harness assemblies. IPC/WHMA-A-620E was developed by IPC and...

IPC-D-279 - Standard Only

Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies

Document #:
IPC-D-279
Revision
Original Version
Product Type
Standard Only
Released:  07/01/1996
Language
English
Current Revision
Establishes design concepts, guidelines and procedures for reliable printed wiring assemblies. Focuses on SMT or mixed technology PWAs, specifically addressing the interconnect structure and the solder joint itself. Discusses substrates, components, attachment materials, coatings and assembly processes and testing considerations. In addition, this document contains detailed appendices covering...

IPC-2251 - Standard Only

Design Guide for the Packaging of High Speed Electronic Circuit

Document #:
IPC-2251
Revision
Original Version
Product Type
Standard Only
Released:  11/01/2003
Language
English
Current Revision
This guideline addresses the major factors influencing the design of high-speed circuitry. Considerations include electrical noise, electromagnetic interference, signal propagation time, impedance, thermo-mechanical environmental protection, and heat dissipation. Supersedes IPC-D-317A. Key improvements over the IPC-D-317A document include updated impedance models for embedded microstrip, centered...
IPC-2228 Cover Image

IPC-2228-English - Standard Only

Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards

Document #:
IPC-2228
Revision
Original Version
Product Type
Standard Only
Released:  10/17/2022
Language
English
Current Revision
The IPC-2228 standard establishes the specific requirements for the design of rigid, flexible and rigid-flexible printed boards utilizing radio frequency (RF) and/or Microwave circuity and/or high frequency laminates where RF transmission lines and related passive metal layers are considered as distributed circuits, instead of conventional lumped circuit elements. The IPC-2228 standard is used to...

IPC-2316 - Standard Only

Design Guide for Embedded Passive Device Printed Boards

Document #:
IPC-2316
Revision
Original Version
Product Type
Standard Only
Released:  03/01/2007
Language
English
Current Revision
IPC-2316 offers printed board users and designers the necessary information for incorporating formed and placed embedded passive components into their applications. The history of embedded passive technologies is given along with full coverage of embedded resistors, capacitors and inductors. In addition, it also assists the user in understanding some of the physical, electrical and thermal...

IPC-2612 - Standard Only

Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)

Document #:
IPC-2612
Revision
Original Version
Product Type
Standard Only
Released:  04/30/2010
Language
English
Current Revision
This standard establishes the requirements for the documentation of electronic diagrams used as the foundation for defining the electrical interconnectivity of electronic products. The description pertains to either schematic diagrams, logic diagrams or Boolean truth tables and includes methodology for defining circuit flow, electrical or functional restrictions, or maintenance test procedures...

IPC-2152 - Standard Only

Standard for Determining Current Carrying Capacity in Printed Board Design

Document #:
IPC-2152
Revision
Original Version
Product Type
Standard Only
Released:  09/16/2009
Language
English
Current Revision
The sole industry standard for determining appropriate internal and external conductor sizes on printed boards as a function of the current carrying capacity required and the acceptable conductor temperature rise. This document provides guidance on how thermal conductivity, vias, copper planes, power dissipation and printed board material and thickness all factor into the relationship between...

IPC-4761 - Standard Only

Design Guide for Protection of Printed Board Via Structures

Document #:
IPC-4761
Revision
Original Version
Product Type
Standard Only
Released:  07/01/2006
Language
English
Current Revision
IPC-4761 is the sole industry guideline providing PCB designers, manufacturers and uses with detailed information on all existing methods for protecting vias on printed boards, including all types of via tenting, plugging, filling and capping. Production issues, long term reliability concerns and material specification and selection are provided to aid in evaluating the benefits and concerns for...
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IPC-2614 - Standard Only

Sectional Requirements for Board Fabrication Documentation

Document #:
IPC-2614
Revision
Original Version
Product Type
Standard Only
Released:  04/30/2010
Language
English
Current Revision
This standard establishes the requirements for the documentation of printed circuit board fabrication, and identifies the physical attributes and performance requirements of the unpopulated product. The descriptions apply to rigid, flexible, inorganic substrates or any combination thereof. The construction may be single, double, multilayered, or HDI technology and may include embedded (integrated)...

IPC/WHMA-A-620 - Revision D - Standard Only

Requirements and Acceptance for Cable and Wire Harness Assemblies

Document #:
IPC/WHMA-A-620
Revision
D
Product Type
Standard Only
Released:  01/21/2020
Language
English
IPC/WHMA-A-620D is the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies. IPC/WHMA-A-620D describes materials, methods, tests and acceptance criteria for producing crimped, mechanically secured and soldered interconnections and the related assembly activities associated with cable and harness assemblies. IPC/WHMA-A-620D was developed by IPC and...
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IPC-2615 - Standard Only

Printed Board Dimensions and Tolerances

Document #:
IPC-2615
Revision
Original Version
Product Type
Standard Only
Released:  07/01/2000
Language
English
Current Revision
The definitive standard on printed board dimensioning and tolerancing is finally here! IPC-2615 comprehensively covers dimensioning and tolerancing of electronic packaging and is consistent with other IPC printed board standards such as IPC-6012A and IPC-2221A. The document includes fundamental dimensioning and tolerancing rules, positional, profile, orientation and form tolerances and detailed...
IPC-8401 Cover Image

IPC-8401 - Standard Only

Guidelines for In-Mold Electronics

Document #:
IPC-8401
Revision
Original Version
Product Type
Standard Only
Released:  10/22/2024
Language
English
Current Revision
IPC-8401 standard provides guidelines for In-Mold Electronics (IME) manufacturing processes, part structures, candidate materials, and production test methods. In-Mold Electronics integrates printed electronics and electrical components into injection molded plastics, creating a three-dimensional smart molded structure. IME technology uses mass production processes, materials, and components. IME...
IPC-5262 Cover Image

IPC-5262 - Standard Only

Design, Critical Process and Acceptance Requirements for Polymeric Applications

Document #:
IPC-5262
Revision
Original Version
Product Type
Standard Only
Released:  10/17/2022
Language
English
Current Revision
The IPC-5262 prescribes the minimum design, critical process and acceptance requirements for the application of polymeric materials to electrical/electronic components, modules, printed wiring assemblies and other elements thereof. The intent of IPC-5262 is to establish a baseline of requirements, procedures, practices and process attributes based on lessons learned and best practices that have...

IPC-A-610 - Revision F - Standard Only

Acceptability of Electronic Assemblies

Document #:
IPC-A-610
Revision
F
Product Type
Standard Only
Released:  08/28/2014
Language
English
IPC-A-610F Amendment 1 is now available. See Related items. IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610F illustrates industry-accepted workmanship criteria for electronics assemblies through detailed statements reflecting acceptable and defect conditions, supported by full-color photographs and...
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IPC-A-610 - Revision E - Standard Only

Acceptability of Electronic Assemblies

Document #:
IPC-A-610
Revision
E
Product Type
Standard Only
Released:  04/13/2010
Language
English
IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610E illustrates industry-accepted workmanship criteria for electronics assemblies through full-color photographs and illustrations. Topics include flex attachment, board in board, part on part, lead free, component orientation and soldering criteria for...

IPC-2225 - Standard Only

Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies

Document #:
IPC-2225
Revision
Original Version
Product Type
Standard Only
Released:  05/01/1998
Language
English
Current Revision
Used in conjunction with IPC-2221A, IPC-2225 establishes the requirements and other considerations (thermal, electrical, electromechanical and mechanical) for the design of Single Chip Module (SCM-L), MCM or MCM-L assemblies. Key concepts include adhesive interconnection information, typical die attach materials, microvia material properties and relationships with DFM and DFE.

IPC-D-422 - Standard Only

Design Guide for Press Fit Rigid Printed Board Back Planes

Document #:
IPC-D-422
Revision
Original Version
Product Type
Standard Only
Released:  09/01/1982
Language
English
Current Revision
Contains backplane design information from the fabrication and assembly perspective. Includes sections on design and documentation; fabrication; assembly; repair; and inspection. 17 pages. Revised September 1982.
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IPC-D-354 - Standard Only

Library Format Description for Printed Boards in Digital Form

Document #:
IPC-D-354
Revision
Original Version
Product Type
Standard Only
Released:  02/01/1987
Language
English
Current Revision
Describes the usage of libraries within the processing and generation of information files. The data contained within covers both the definition and usage of internal (existing within the information file) and external libraries. The libraries can be used to make generated data more compact and facilitate data exchange and archival. The subroutines within a library can be used one or more times...
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IPC-D-355 - Standard Only

Printed Board Automated Assembly Description in Digital Form

Document #:
IPC-D-355
Revision
Original Version
Product Type
Standard Only
Released:  01/01/1995
Language
English
Current Revision
Describes an intelligent, digital data transfer format for describing component mounting information. Supplements IPC-D-350 and is for designers and assemblers. Data included are pin location, component orientation, etc. This document is frozen; no future updates are planned. 33 pages. Released January 1995.
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IPC-D-352 - Standard Only

Electronic Design Data Description for Printed Boards in Digital Form

Document #:
IPC-D-352
Revision
Original Version
Product Type
Standard Only
Released:  08/01/1985
Language
English
Current Revision
Describes the relationship between elements used in electromechanical design and packaging of printed boards. Includes descriptions for logical and physical elements necessary as input to a design system, as well as the network of interconnection description between the various electronic parts. Provides the capability of describing all elements in their final form upon design completion. The...
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IPC-D-351 - Standard Only

Printed Board Drawings in Digital Form

Document #:
IPC-D-351
Revision
Original Version
Product Type
Standard Only
Released:  08/01/1985
Language
English
Current Revision
Describes an intelligent, digital format for transfer of drawings between printed wiring board designers, manufacturers and customers. Also conveys additional requirements, guidelines and examples necessary to provide the data structures and concepts for drawing description in digital form. Supplements ANSI/IPC-D-350. Pertains to four basic types of drawings: master drawings, schematics, assembly...
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