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Download the free Amendment 2 (.pdf) that resolves conflict in measles criteria between J-STD-001D, IPC-A-610D, IPC-6012B and IPC-A-600G. This is the Swedish Language version of IPC-6012B. This specification covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal...

This is the Chinese language translation of IPC-2221A. Only available in electronic format. IPC-2221A is the foundation design standard for all documents in the IPC-2220 series. It establishes the generic requirements for the design of printed boards and other forms of component mounting or interconnecting structures, whether single-sided, double-sided or multilayer. Among the many updates to...

Jedyny dokument branżowy dotyczący obsługiwania, pakowania i przechowywania płytek drukowanych. Wskazówki zawarte w tym dokumencie mają na celu ochronę płyt drukowanych przed zanieczyszczeniem, fizycznym uszkodzeniem, utratą lutowalności i wchłanianiem wilgotności. Uwzględniono rodzaje i metody materiałów opakowaniowych, środowisko produkcyjne, obsługiwanie i transport, a także profile wygrzewania...

記述 IPC-2221Bは、IPC-2220シリーズの全文書の基本となる設計基準である。これは片面、両面、または多層を問わず、プリント基板およびその他の形状の部品実装構造または相互接続構造の設計に関し、 一般的な要求事項を規定するものである。本書、リビジョンBの多くの更新内容として、導体特性、表面仕上げ、ビアプロテクション、基板の電気試験、誘電特性、基板ハウジング、熱ストレス、コンプライアントピン、パネライゼーション、および内層・外層の銅はくの厚さに関する新規基準がある。附属書Aには、ロットの受入れおよび品質適合試験で用いられるテストクーポンの新規設計が記載されている。170ページ。 2012年出版。2015年4月翻訳。 目次をみる。pdfファイル。

La única guía de la industria para el manejo, empaquetado y almacenamiento de tarjetas impresas. Las pautas descritas en este documento tienen la intención de proteger las tarjetas impresas de contaminación, daños físicos, degradación y absorción de humedad. Se consideran los tipos de materiales y métodos de empaquetado, los entornos de producción, el manejo y transporte del producto y se...

描述 关于印制板操作、包装和储存的行业指南。这些指南是为了保护印制板，避免其受到污染、物理损坏、可焊性降低、静电放电（必要时）和吸湿。本文件考虑了包装材料和方法、生产环境、操作和产品运输，建立了除湿烘烤曲线。修订本A扩大了覆盖范围，包括防潮袋（MBB）、烘烤对印刷板可焊性的影响、ESD问题、蚀刻芯和复合材料的湿度问题、干燥剂材料和HIC卡以及包装和处理要求的示例流程。2017年8月翻译。

The IPC-6012ES space addendum provides exceptions to Class 3 requirements of the IPC-6012E for use in space and military avionics product. Exceptions include changes to acceptance criteria and/or sample size and test frequency for production lot acceptance testing. The IPC-6012ES covers requirements for rigid printed boards to survive vibration, extreme thermal cycling and ground testing...

This Addendum supplements or replaces specifically identified requirements of IPC-6012D, Revision D, for rigid printed boards that must survive the vibration, ground testing and thermal cyclic environments of space and military avionics

The IPC-6018DS addendum supplements or replaces specifically identified requirements of IPC-6018D, for high frequency (microwave) printed boards that must survive the vibration, ground testing and thermal cyclic environments of space and military avionics. The IPC-6018DS addendum incorporates new requirements in areas such as copper wrap plating, dewetting, pad/land anomalies, copper cap plating...

IPC-6012E-AM1是IPC-6012E的修订本，澄清了再流焊SnPb或HASL镀层中退润湿和焊料回缩之间的区别。 该修订本还为成品印制板的最小外部导体厚度提供了修订标准，并为内部电镀层的最小厚度提供了新的接受标准。

IPC/WHMA-A-620D-S space addendum provides additional requirements to IPC/WHMA-A-620D standard to ensure the reliability of cable and wire harness assemblies that must survive the vibration and thermal excursions encountered getting to and operating in the military and space environments. IPC/WHMA-A-620D-S cannot be used as a standalone document. It must be used with the base standard IPC/WHMA-A...

This Addendum, when required by procurement documentation/drawings, supplements or replaces specifically identified requirements of IPC-6012D, Revision D, for rigid printed boards that must survive the vibration and thermal cycling environments of electronic interconnects within the automotive industry.

Bu döküman; kaplı delikiçine sahip olan veya olmayan tek yüzlü, çift yüzlü baskı devre kartları ve kör/gömülü geçiş deliklerine sahip olan veya olmayan çok katmanlı baskı devre kartları ile metal çekirdekli kartları içeren sert baskı devre kartlarının kalifikasyonunu ve performansını kapsamaktadır. Son kaplama ve yüzey kaplama gereklilikleri, iletkenler, delikler/geçiş delikleri, kabul testlerinin...

IPC/WHMA-A-620C-S provides additional requirements to IPC/WHMA-A-620C to ensure the reliability of cable and wire harness assemblies that must survive the vibration and thermal cyclic environments getting to and operating in space. The IPC/WHMA-A-620C-S space addendum cannot be used as a stand alone document, it must be used with the base standard IPC/WHMA-A-620C.

When specifically required by procurement documentation, this Addendum supplements or replaces specifically identified requirements of IPC/WHMA-A-620, Revision B, providing additional requirements to ensure the reliability of cable and wire harness assemblies that must survive the vibration and thermal cyclic environments getting to and operating in space. The required IPC training & certification...

IPC/WHMA-A-620AS with Amendment 1 Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A Requirements and Acceptance for Cable and Wire Harness Assemblies. When specifically required by procurement documentation, this Addendum supplements or replaces specifically identified requirements of IPC/WHMA-A-620, Revision A of July 2006 by providing additional requirements to ensure the...

This Addendum supplements or replaces specifically identified requirements of IPC-6018C, for high frequency (microwave) printed boards that must survive the vibration, ground testing and thermal cyclic environments of space and military avionics.

IPC-DR-DES-2022 document is intended to guide PCB designers in the use of IPC PCB Design standards as they define processes and parameters for use in CAD tools. The IPC-DR-DES-2022 is an excellent hands on desk reference manual for use by every designer.

This technical paper covers the testing and evaluation of polymeric conformal coatings for moisture and insulation resistance (MIR) and dielectric withstanding voltage (DWV). This effort was initiated by the IPC Conformal Coating Task Group to support technical decisions for IPC coating specification CC-830 as part of the Revision C process. MIR testing was done per a modified method of IPC-TM-650...

The IPC-1602 standard provides requirements intended to protect printed boards from contamination, physical damage, solderability degradation and moisture uptake. Consideration is given to packaging materials types and methods, production environment, handling and transport of product, and establishing baking profiles for moisture removal. IPC-1602 is now providing requirements that can be called...

A discussion was held in the 5-33AWG (ad hoc working group), on things that conformal coat professionals (materials and processes) wish designers knew about conformal coating. The 5-33AWG group is comprised of individuals from OEMs, coating suppliers, and test lab personnel.

This standard is the companion document to IPC-A-630. IPC-HDBK-630 is an in-depth guideline to the design, manufacture, inspection and testing of the high level assembly, or "box" that encloses electronics assemblies. This document was written to help designers, manufacturers and end users of electronic enclosures of electrical and electronic equipment understand the industry's best practices to...

This guideline provides an overview of the design process flow for printed electronics based devices, modules and units, and final products.The intent of IPC/JPCA-2291 is to establish a design process flow that will facilitate and improve the practice of printed electronics design. IPC/JPCA-2291 identifies documents such as standards that can be used to assist during the design process flow. 24...

IPC-HDBK-620 is a companion reference to IPC-D-620 ‘‘Design and Critical Process Requirements for Cable and Wiring Harnesses’’ and IPC/WHMA-A-620 ‘‘Requirements and Acceptance for Cable and Wire Harness Assemblies” and provides supporting information and technical rationale for requirements in those standards. This guidance document is highly recommended for anyone who wants to learn the “how” and...

This standard on spherical transient bend testing is intended to characterize the maximum allowable strain that a surface mount component's board level interconnects can withstand in flexural loading. Whereas four-point monotonic bend test methods only address simple planar bending, spherical bend tests establish strain limits of board level interconnects under worst-case flexure conditions that...