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IPC-HDBK-840 supplements the solder mask requirements established in IPC specifications such as IPC-SM-840 and IPC-6012 by providing detailed information on solder mask types, application processes, pre- and post- assembly processes, characteristics and properties that are useful in the selection and use of the most appropriate mask type for a given application. Applicable to solder mask...

The IPC/DAC-2552 standard was developed jointly with the Digital Association of China (DAC), with the purpose to use Model Based Definition (MBD) to realize efficient and high-quality digital design of board-level assembly, support electronic assembly virtual manufacturing, and enabling the digitalization from requirement to product realization for printed board assemblies. The IPC/DAC-2552...

IPC-9797 is the only industry-consensus standard for Requirements and Acceptance of Press-fit Pins. IPC-9797 prescribes practices for the characterization, qualification and acceptance requirements of compliant press-fit technology for printed boards that cover the manufacturability and reliability needs for high reliability applications intended for use in harsh environments such as automotive...

The IPC-WP-021 white paper considers conformal coatings, like many high-performance materials, have evolved considerably since the 1990s. New coatings, such as fluoropolymers or hybrid coatings, have come on the market, many of which offer superior protection characteristics, but do not fit into the existing classifications of either MIL-I-46058 or IPC-CC-830. The IPC-WP-021 white paper discusses...

Discusses the many variables and problems associated with the process--from sample removal to micro-etch-- and the variables common to high volume microsection. The process variables and problems are organized so that the reader can research a specific issue or overview the variables of a process area. 31 pages. Released October 1993.

This standard establishes the generic requirements for a document set describing electronic products, and the methodology used for revision control and configuration management of the information. The generic descriptions apply to the entire document set and are used to define and maintain the electronic product. The methodology permits different grades of completeness of the documentation, as...

IPC-9631 addresses concerns and considerations related to IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation. This document describes how the test method is intended for use and the rationale behind some of the protocols and requirements. This document was developed with the understanding that the test method will require special equipment and the proper set-up and...

Establishes mechanical drop and shock and test guidelines for assessing solder joint reliability of printed board assemblies from system to component level. This document addresses methods to define mechanical shock use-conditions, methods to define system level, system printed board level and component test board level testing that correlate to such use conditions and guidance on the use of...

Published jointly with the Japan Printed Circuits Association, IPC/JPCA-2315 provides an easy to follow tutorial on the selection of HDI and microvia design rules and structures. Addresses various considerations when designing an HDI printed wiring board including design examples and processes, selection of materials, general descriptions, and various microvia technologies. Offers designers and...

During mass soldering, it is important that all solder joints reach the minimum soldering (reflow) temperature to assure metallurgical bonding of the solder alloy and the base metals to be soldered. Metallurgical bonding requires that both surfaces to be soldered, as well as the solder, reach this minimum soldering temperature for a sufficient time to allow the wetting of the solder surfaces. This...

Implementing flip chip technology in a direct chip attach (DCA) assembly presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7094 delivers useful and practical information to anyone who is currently using or contemplating developing products that employ the very complex and high density methods needed for the flip chip technology. The concepts have become...

Guidelines for accelerated reliability testing of surface mount solder attachments when evaluating and extrapolating the results of these tests towards actual use environments of electronic assemblies. 50 pages. Released November 1992. Included in the IPC-C-103 and the IPC-C-1000 Collections

This standard establishes mechanical outline requirements for devices supplied in flip chip or Chip Size Package (CSP) formats, including die surface, die terminals, and interconnection balls/bumps/lands to the next level. 13 Pages. Released February 2003.

This test method defines the procedures for performing acoustic microscopy on non-hermetic encapsulated electronic components. It provides users with an acoustic microscopy process flow for detecting defects non-destructively in plastic packages while achieving reproducibility. Developed by IPC and JEDEC. 16 pages. Released April 1999. Equivalent to IEC Publicly Available Specification (PAS) 62191

This document establishes the requirements and interactions necessary for printed board assembly processes for interconnecting high performance/high pin count IC packages. Includes information on design principles, material selection, board fabrication, assembly technology, testing strategy and reliability expectations based on end-use environments. Developed by IPC, EIA, MCNC and Sematech. 96...

IPC/WHMA-A-620E-RL is a redline document showing the difference from IPC/WHMA-A-620D to IPC/WHMA-A-620E. IPC/WHMA-A-620E-RL provides a side-by-side comparison of the two documents and includes the figures and tables. The document shows deleted/changed text in the IPC/WHMA-A-620D pages and new/revised text in the IPC/WHMA-A-620E pages. Due to the complexity of this document, it is only available in...

IPC-D-620 provides design and critical process requirements for the three product classes of cable and wire harness assemblies as well as military/space applications. It is the design requirements companion to IPC/WHMA-A-620, "Requirements and Acceptance for Cable and Wire Harness Assemblies," and its associated Space Addendum Three white papers are included to provide guidance on key topics...

This document provides tests that record changes in surface insulation resistance (SIR) on a representative sample of a printed circuit assembly. It quantifies any deleterious effects that might arise from solder flux or other process residues left on external surfaces after soldering, which can cause unwanted electrochemical reactions that grossly affect reliability. It uses test vehicles that...

Surface mount pad cratering typically initiates prior to detection by existing electrical monitoring test methods. There are limited instrumentation techniques that are currently available that can identify non-electrical damage and its location to a high degree of accuracy. This guideline document establishes an acoustic emission (AE) method to evaluate the performance and reliability of surface...

While there are a variety of industry test vehicles for the examination of materials compatibility, most available test boards leave something to be desired as there is often a dramatic difference in materials between such test boards and produced assemblies. A test vehicle was needed which could be used for both ion chromatography and SIR testing that would be more representative of mainstream...

This handbook is an essential resource for anyone involved in manufacturing or purchasing PCBs. Hundreds of real-world, full-color photos spotlight more than 650 PCB process defects, with causes and corrective actions for each. IPC-9121 supersedes the PCB sections of IPC-PE-740A. Released March 2016

This standard describes the design and assembly challenges for implementing Bottom Termination surface mount Components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body. The BTCs in this document include all types and forms of bottom-only termination components intended for surface mounting. This includes such industry descriptive...

The IPC-7091 intends to provide useful and practical information to those who are designing, developing or using 3D-packaged semiconductor components or those who are considering 3D package implementation. The 3D semiconductor package may include multiple die elements—some homogeneous and some heterogeneous. The package may also include several discrete passive SMT devices, some of which are...

This new standard supplements existing IPC-6010 series specifications with qualification and performance requirements for in-process and finished printed boards containing embedded passive circuitry (distributive capacitive planes and capacitive or resistive components). 10 pages. Released March 2009. Included in Collections C-105, C-1000 and the 6010 Series

The successor to the IPC-SM-782A is here! The document covers land pattern design for all types of passive and active components, including resistors, capacitors, MELFs, SSOPs, TSSOPs, QFPs, BGAs, QFNs and SONs. The standard provides many brand new features, including an intelligent land pattern naming convention, zero component rotations for CAD systems, and a set of three separate land pattern...