IPC-7711/21C的修订本1，本文件提供D-Pak元器件的去除和安装程序.
Products
Amendement 1 à IPC-7711 / 21C fournit des procédures supplémentaires de retrait et d'installation
IPC/WHMA-A-620C-S provides additional requirements to IPC/WHMA-A-620C to ensure the reliability of cable and wire harness assemblies that must survive the vibration and thermal cyclic environments getting to and operating in space. The IPC/WHMA-A-620C-S space addendum cannot be used as a stand alone document, it must be used with the base standard IPC/WHMA-A-620C.
When specifically required by procurement documentation, this Addendum supplements or replaces specifically identified requirements of IPC/WHMA-A-620, Revision B, providing additional requirements to ensure the reliability of cable and wire harness assemblies that must survive the vibration and thermal cyclic environments getting to and operating in space. The required IPC training & certification...
IPC/WHMA-A-620AS with Amendment 1 Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A Requirements and Acceptance for Cable and Wire Harness Assemblies. When specifically required by procurement documentation, this Addendum supplements or replaces specifically identified requirements of IPC/WHMA-A-620, Revision A of July 2006 by providing additional requirements to ensure the...
The IPC-QRG-SMT-H desk reference manual contains illustration/images of surface mount solder connections for IPC-A-610H standard. As a convenient manual but not a replacement for IPC-A-610H standard, the IPC-QRG-SMT-H is an additional tool to help operators and inspectors when evaluating the three classes of product for solder joint acceptance. Useful as a training aid but not a replacement for...
The IPC-1602 standard provides requirements intended to protect printed boards from contamination, physical damage, solderability degradation and moisture uptake. Consideration is given to packaging materials types and methods, production environment, handling and transport of product, and establishing baking profiles for moisture removal. IPC-1602 is now providing requirements that can be called...
This document describes materials that can be used for the fabrication of embedded passive capacitor devices within the finished printed circuit board substrate. For this document, embedded passive devices and the phrase embedded passives are considered to be equivalent. It provides information on general designations and associated characteristics of embedded passive device (EPD) capacitor...
IPC-HDBK-620 is a companion reference to IPC-D-620 ‘‘Design and Critical Process Requirements for Cable and Wiring Harnesses’’ and IPC/WHMA-A-620 ‘‘Requirements and Acceptance for Cable and Wire Harness Assemblies” and provides supporting information and technical rationale for requirements in those standards. This guidance document is highly recommended for anyone who wants to learn the “how” and...
Free Review Updated to Revision G of the latest IPC-A-610 industry standard for the Acceptability of Electronic Assemblies, this Training & Reference Guide illustrates critical acceptance criteria for the evaluation of surface mount solder connections. At only 44 pages and a compact 5.5 x 8.5 inch (14 x 21.5 cm) size, these convenient spiral-bound manuals make it easy for your inspectors and...
IPC-1754 WAM 1 Materials and Substances Declaration for Aerospace and Defense and Other Industries establishes the requirements for exchanging material and substance data for products between suppliers and their customers for Aerospace and Defense, Heavy Equipment and other industries. This standard covers the process for exchanging data on chemical substances (“Substances”) that may be present in...
This standard establishes the requirements for timely customer notification of changes to electronic products and associated processes.
This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. The goal of this notification standard is to better enable customers to manage and mitigate the disruption caused by the discontinuation of a product and to ensure continuity of supply. This standard establishes the requirements for timely customer notification of planned...
The IPC-4592 standard establishes the classification system, the qualification and quality conformance requirements for functional dielectric materials used in printed electronics applications. The intended applications include but are not limited to dielectric materials as protective dielectric or insulator/insulation layer(s), capacitive layer(s), crossovers and encapsulant(s) for devices in...
Addresses the complete process of reengineering new product development processes to incorporate DFX methodologies. Presents the case for a comprehensive analysis of the key business issues and definition of requirements before initiating work to refine or restructure processes. Editor, Dieter Bergman, IPC. 88 pages. Released by the Surface Mount Council, April 1997.
This document provides comprehensive data to help users more easily determine both material capability and compatibility for flexible and rigid base dielectric materials for manufacture of printed electronics. It includes base material specification sheets that have been updated with the newest properties for the specification material types. It establishes the most current classification system...
This document provides comprehensive data to help users more easily determine material performance, capabilities, and compatibility of functional conductive materials for the manufacture of printed electronics. It includes: classification schemes based on composition, conductor type, and post-processing structure; functional conductive material specification sheets to present properties for the...
This handbook assists individuals who make choices regarding adhesive bonding or who must work in adhesive bonding operations for electronic assemblies. The full-color guide also provides guidelines for design, selection and application of adhesive bonding.
This guideline standard is intended to aid in interpretation of the requirements in IPC-9191, "General Guidelines for Implementation of Statistical process Control," specifically for printed board assembly (PBA) manufacture. This document and IPC-9191 should be used together; the standards are cross-referenced to each other in the Appendices of this guideline. This standard promotes process...
During mass soldering, it is important that all solder joints reach the minimum soldering (reflow) temperature to assure metallurgical bonding of the solder alloy and the base metals to be soldered. Metallurgical bonding requires that both surfaces to be soldered, as well as the solder, reach this minimum soldering temperature for a sufficient time to allow the wetting of the solder surfaces. This...
Implementing flip chip technology in a direct chip attach (DCA) assembly presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7094 delivers useful and practical information to anyone who is currently using or contemplating developing products that employ the very complex and high density methods needed for the flip chip technology. The concepts have become...
Covers the various conductive and dielectric materials that can be used for the fabrication of HDI and microvias. The 23 specification sheets included in IPC/JPCA-4104 cover the qualification and conformance requirements for such materials as photoimageable dielectric dry films and liquids, epoxy blends and coated foils. IPC/JPCA-4104 also includes six new test methods developed specifically for...
This document provides an overview of the Registration, Evaluation, and Authorization of Chemicals regulation that will impact the electronics interconnect industry. Specifically, this document provides an Executive Overview, a timetable of activities and a review of the implications and obligations for each segment of the supply chain. 27 pages. Released October 2008.
This document establishes the requirements and interactions necessary for printed board assembly processes for interconnecting high performance/high pin count IC packages. Includes information on design principles, material selection, board fabrication, assembly technology, testing strategy and reliability expectations based on end-use environments. Developed by IPC, EIA, MCNC and Sematech. 96...
IPC/WHMA-A-620E-RL is a redline document showing the difference from IPC/WHMA-A-620D to IPC/WHMA-A-620E. IPC/WHMA-A-620E-RL provides a side-by-side comparison of the two documents and includes the figures and tables. The document shows deleted/changed text in the IPC/WHMA-A-620D pages and new/revised text in the IPC/WHMA-A-620E pages. Due to the complexity of this document, it is only available in...