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IPC-4101E-WAM1 covers the requirements for base materials that are referred to as laminate or prepreg and listed in the specification sheets which are found after the main body of the standard. The specification sheets are to be used primarily for rigid and multilayer printed boards for electronic interconnections. The IPC-4101E-WAM1 standard contains 70 individual specification sheets that can be...

The IPC-7095D-AM1 standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages. IPC-7095D-AM1 provides the useful and practical information to those who use or are considering using BGAs. IPC-7095D-AM1 provides...

Establishes the requirements for the evaluation of liquid and dry film solder mask material and for the determination of the acceptability of use on a standard printed board system. IPC-SM-840 provides two classes of requirements, T and H, to reflect functional performance requirements and testing severity based on industry/end use requirements. Coverage is given to adhesion, material qualification...

The industry's sole standard on the handling, packaging and storage of printed boards. The requirements in this document are intended to protect printed boards from contamination, physical damage, solderability degradation, ESD and moisture uptake. Consideration is given to packaging material types and methods, production environment, handling and transport of product, and establishing baking...

The IPC-4202C standard covers the requirements for flexible base materials, herein referred to as laminates, prepregs or films, to be used primarily for flexible printed boards for electrical and electronic circuits

IPC-4103B standard covers the requirements for clad and unclad plastic laminate and bonding layer materials to be used for the fabrication of printed boards for microstrip, stripline and high speed digital electrical and electronic circuits. In addition to better definitions of inclusions and how to properly classify them; redefine "substrates" as, "fabricated sheets"; and a more proper definition...

IPC-4556A Standard sets the requirements for the use of Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) as a surface finish for printed boards. IPC-4556A standard defines ENEPIG deposit thicknesses for applications including soldering, wire bonding, and as a contact finish.

IPC-2231A provides guidelines for establishing a best practice methodology for use in developing a formal DFX (Design for Manufacturing, Fabrication, Assembly, Testability, Cost, Reliability, Environment, Reuse) process for layout of printed boards.

Covers the requirements for copper/invar/copper (CIC), copper/molybdenum/ copper (CMC) and three-layer composites for use in electronic applications.

The IPC-7093B guideline provides essential design and assembly guidance for implementing bottom termination components (BTCs). Specifically, IPC-7093B provides guidelines on critical design, materials, assembly, inspection, repair, quality, and reliability issues associated with BTCs.

This document includes lead free, no-clean, and environmental friendly chemistries. This is a collection of information on electronic board and assembly cleaning in a single location. This major revision explains the relationship between materials, processes, and contaminants in fabrication and assembly operations. It also addresses cleanliness assessment and process control in relation to...

This standard establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides, which are to be used as cover material and/or bondply for flexible printed circuitry, and supported or unsupported adhesive films to be used in the fabrication of flexible printed circuitry.

IPC-4562A standard covers metal unsupported foils and foils supported by carrier films suitable for subsequent use in printed boards. IPC-4562B addresses the requirements of metal foils used in printed wiring applications.

The IPC-1921A handbook provides problems, causes and possible corrective actions related to printed board manufacturing processes. Includes more than 200 photos and illustrations depicting common defects.

The IPC-4412C covers the requirements for reinforcements woven from "E"glass yarn. These reinforcements are used in the production of prepregs, some of which are pressed into laminates. These prepregs and laminates are the base materials for rigid and mulitlayer printed boards. The IPC-4412C standard contains tables which describe each fabriic style in detail including the yarn used, the number of...

This document describes the design and assembly challenges and ways to address those challenges for implementing 3D component technology. Recognizing the effects of combining multiple uncased semiconductor die elements in a single-package format can impact individual component characteristics and can dictate suitable assembly methodology. The information contained in this standard focuses on...

IPC-4203B establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides, which are to be used as cover material and/or bondply for flexible printed circuitry, as well as supported or unsupported adhesive films to be used in the fabrication of flexible printed circuitry. IPC-4203B does not cover non...

IPC-7094A describes the design and assembly challenges for implementing flip chip technology in a direct chip attach (DCA) assembly. The effect of bare-die or die-size components in a flip chip format has an impact on component characteristics and dictates the appropriate assembly methodology. The IPC-7094A standard focuses on design, assembly methodology, critical inspection, repair and...

This is the document all process engineers must have! Useful for day-to-day problem solving, it contains case histories of problems and corrective action in the design, manufacture, assembly and testing of printed wiring products. Each section has been updated to reflect today's manufacturing challenges. Sections address documentation, phototooling, raw materials, mechanical operations, hole...

This guideline describes flexibility and stretchability testing to evaluate printable electronics for stretchable and wearable applications. 26 pages. Released March 2017

Covers the nomenclature, definitions and requirements for reinforcement made from nonwoven para-aramid fibers. Para-aramid reinforcement is primarily used in PCBs for HDI and high speed/high frequency applications. IPC-4411A also includes specification sheets, which can be used when selecting and purchasing nonwoven para-aramid reinforcement. Includes the incorporation of 14 new nonwoven para...

IPC-1730A is a tool used to categorize a laminate manufacturer's capabilities, which furnishes customer access to detailed information. Used for single or multiple sites or locations, IPC-1730A simplifies auditing processes and reduces the frequency of audits, decreasing paperwork and improving efficiency. The program includes a description, approval and certification profile and a quality profile...

IPC-T-50N document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing English as a second language could understand the subtleties of the meaning. IPC-T-50N contains over 550 new or revised terms, including new terminology for via structures, surface mount device...

This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision M contains over 220 new or revised terms, including new terminology for conformal coatings, potting and encapsulation processes, stencil design, statistical process control, and flexible printed board...

This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision K contains more than 220 new or revised terms, including new terminology for thermal properties, etchback, assembly processing, hole drilling, and microvia technology. Also includes commonly used industry...

This essential industry standard provides descriptions and illustrations of electronics interconnect industry terminology to help users and their customers break down language barriers. Revision J contains nearly 400 new or revised terms, including new terminology for chip scale and area array packaging, cable and wire harness technology, assembly processing, moisture sensitive components, and...

This document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing English as a second language could understand the subtleties of the meaning. Revision P contains over 120 new or revised terms, including new terminology for back-drill structures, cable and wire...

IPC-9191 reflects the principals of statistical process control (SPC) represented by ISO/DIS 11462-1, Guidelines for Implementation of Statistical Process Control (SPC) -- Part 1: Elements of SPC. This document outlines the SPC philosophy, implementation strategies, tools, and techniques used for relating process control and capability to final product requirements. Supersedes IPC-PC-90.

The industry's first specification for the evaluation of a legend and/or marking ink material for the determination of acceptability of use in a standard printed board system. IPC-4781 provides coverage for adhesion, material qualification and testing, resistances to solvents, requirements for resistance to lead-free solders, and electrical requirements. 17 pages. Released May 2008.

Contains over 150 industry approved test techniques and procedures for chemical, mechanical, electrical, and environmental tests on all forms of printed boards and connectors. New and updated test methods are available for download at https://www.ipc.org/test-methods.

This document describes materials that can be used for the fabrication of embedded passive resistor devices within the finished printed circuit board substrate. It provides information on general designations and associated characteristics of embedded passive device (EPD) resistor materials. The document shall be used as a qualification and conformance standard for designers and users when...

IPC-4101E covers the requirements for base materials that are referred to as laminate or prepreg and listed in the specification sheets that are contained in the last of the main body. These are to be used primarily for rigid and multilayer printed boards for electronic interconnections. This document contains 65 individual specification sheets that can be searched using keywords. These keywords...

The Joint Industry Guide Material Composition Declaration for Electrotechnical Products has been updated to include the most recent substances for restriction. The JIG-101 is an industry materials declaration guide that facilitates reporting of material content information across the global electrotechnical supply chain. This document sets minimum requirements for a materials declaration. The...

IPC-4413 standard covers finished fabrics woven from low Dk electrical grade glass fiber yarns that are intended as a reinforcing material in laminated plastics for electrical and electronic use. All fabrics covered by IPC-4413 standard are plain weave.

This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies. 19 pages. Released November 2007.

This standard, developed jointly by IPC and the Electronic Industries Association (EIA) establishes the construction detail requirements for balls and other terminal structures on Ball Grid Array (BGA) packages. It also establishes a set of designations and expectations for product performance. A large variety of terminal structures are recognized for a wide range of applications ranging from...

IPC-4121 provides industry-approved guidelines for selecting core constructions for multilayer printed wiring boards (PWBs). The specification sheets in the document categorize the different core constructions by laminate type and nominal thickness. The constructions are rated for characteristics such as dielectric constant (DK), dimensional stability (DS), flatness, smoothness and drillability...

Covers classification and requirements for finished fabrics woven from quartz fiber yarns that are intended as a reinforcing material in laminated plastics for electrical and electronic use. 13 pages. Released February 1992.

Establishes the requirements for the evaluation of liquid and dry film solder mask material and for the determination of the acceptability of use on a standard printed board system. IPC-SM-840 provides two classes of requirements, T and H, to reflect functional performance requirements and testing severity based on industry/end use requirements. Coverage is given to adhesion, material qualification...

Covers the classification and requirements for finished fabrics woven from "S" glass, electrical grade glass fiber yarns intended as a reinforcing material in laminated plastics for electrical and electronic use. 12 pages. Released February 1992.

Covers finished fabrics woven from aramid yarns that are intended as reinforcing material in laminated plastics for electrical and electronic use. All fabrics covered by this specification are plain weave. 9 pages. Released June 1990.

This document is a tool for a customer or supplier organization's internal audit group to assess a statistical process control (SPC) system against the requirements of IPC-9191. This document should be used by customers and suppliers of any size and for any commodity. This tool can be used to perform an assessment of the use of SPC at both organizational and process levels. The questions in this...

IPC-4101D-WAM1 covers the requirements for base materials that are referred to as laminate or prepreg. These are to be used primarily for rigid and multilayer printed boards for electrical and electronic circuits. This document contains 65 individual specification sheets that can be searched using keywords. These keywords allow the document's user to find materials of a similar nature, but with...

This specification covers the requirements for base materials that are referred to as laminate or prepreg. These are to be used primarily for rigid and multilayer printed boards for electrical and electronic circuits. This document contains 64 individual specification sheets that can be searched using keywords. These keywords allow the document's user to find materials of a similar nature, but...

Determines the nomenclature, chemical and physical requirements of paper made from cellulose fibers for PWB fabrication. IPC-4110 also includes specification sheets for selecting and purchasing these materials. 11 pages. Released August 1998.

This document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components. Applications include the following: flexible PWB-to-glass, flexible PWB-to-rigid PWB, flip chip-to-glass, flip chip-to-flexible PWB, flip chip-to-rigid PWB, and fine pitch SMD. The adhesive film may be supplied pre-attached to a flexible circuit or...

IPC-3406 offers guidelines for selecting electrically conductive adhesives for use in electronics manufacturing as solder alternatives. The process discussion attempts to stay within the bounds of the existing solder assembly infrastructure. Both major types of adhesives, isotropic (conducting equally in all directions) and anisotropic (unidirectional conductivity) are covered. Polymer adhesives...

Suppliers of raw materials for laminate manufacturing now have an industry-approved questionnaire to supply current and potential customers with a self-assessment of their facilities. IPC-1731 gives suppliers of raw materials the opportunity to create a profile of their manufacturing facility(s) that will be consistent with those developed by other industry suppliers. Using the Microsoft Word (TM)...

The industry's sole guideline on the handling, packaging and storage of printed boards. The guidelines in this document are intended to protect printed boards from contamination, physical damage, solderability degradation and moisture uptake. Consideration is given to packaging material types and methods, production environment, handling and transport of product, and establishing baking profiles...

The IPC-7093A standard provides essential design and assembly guidance for implementing bottom termination components (BTCs). Specifically, IPC-7093A provides guidelines on critical design, materials, assembly, inspection, repair, quality, and reliability issues associated with BTCs.