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概説 本書、IPC-9202A「材料・工程の特性評価/認定試験の方法」は、プリント回路組立品(PCA)の代表的なサンプル上の表面絶縁抵抗(SIR)の変化を記録するものである。この試験は、はんだ付後に外層に残るはんだ由来のフラックスまたはその他の工程残さが原因で不要な電気化学的反応を引き起こし、信頼性に重大な影響を及ぼす可能性について定量化するものである。 この試験では、実際の生産工程において電子回路の代表的なものとなるような基板をテストビークルとして使用する。これは、定量的かつ定性的なデータの両方を得ることができる試験である。 IPC-9202Aに紹介する試験は、提案された製造工程や工程変更を用いた場合に、生産するハードウェア(製品)の最終的な性能が電気化学的リスクに対し許容可能であるということを示すための「工程認定」用として使用することができる。工程変更には組立工程の手順...

規格「IPC-CC-830C」は、電気絶縁化合物 (コンフォーマルコーティング) の認定および適合要件について確立するものである。これは、最小限の冗長テストで材料の最大の信頼性を得ることを目的として、設計および構築されてきたものである。規格「IPC-CC-830C」は次の項目を対象とする： フォーマルコーティング剤の認定および認定の維持 (表3-1、コラムAおよびB)。 コンフォーマルコーティング剤の特性に関する品質適合性 (表3-1、コラムC)。 本規格においてコンフォーマルコーティングという用語は、プリント配線板組立に使用される保護コーティングのタイプを指す場合に用いられる。コンフォーマルコーティングは単に機械的な支持をもたらすものではなく、湿気および汚染から基板を保護し、電気絶縁を付与することを目的としている。

描述 简要介绍 （英文） 更新了新技术，包括无铅、免清洗及环保化学品。 本文件集合了电路板及组件清洗信息。该修订版本主要阐述了制造和组装运营中材料、制程及污染物之间的关系。它还提出清洁度评估方案和涉及清洁度的制程控制方案。配有彩图帮助理解。全文共200页。2011年7月修订。2013年8月翻

本标准规定了电气绝缘化合物（敷形涂覆材料）的鉴定和符合性要求，并设计和构建了充分且必要的测试项目来获取对材料性能的信心。本标准包括： 敷形涂覆材料的鉴定及鉴定效力保持（表3-1，A 列及B 列）。 敷形涂覆材料属性的质量符合性（表3-1，C 列）。 本标准中，敷形涂覆是指用于印制线路组件的保护涂层。敷形涂覆可起到防潮、防污物和电气绝缘的作用，但不是作为单独起机械保护作用的涂层。

本指南描述了可用于评估柔性的、可拉伸的和可穿戴的应用中所采用的印刷电子器件的柔性和拉伸性能的测试。26页。2017年3月发布。2019年3月翻译.

本文件是IPC电化学迁移（ECM）技术组的成果。本文件的目的是为如何更好地使用IPC-TM-650测试方法2.6.25《耐导电阳极丝（CAF）测试》以及其他内部电化学迁移（ECM）测试提供指南，以评估机械应力、层压板材料断裂、离子污染、压合层压板前湿气含量以及其它材料加工特性在层压材料中形成的导电路径，例如导电阳极丝（CAF），一种特殊类型的ECM失效模式，对测试结果的影响。该内部ECM测试方法提供了一个已经证实的标准，用于确定由于通孔偏移从而显著降低内部导体间绝缘电阻情况的风险，该现象发生在层压板内部，而不是在印制板的表面上

本文件对印制板（PWB）制造过程中印制板组件的应变测试制定了详细的指南，这些制造过程包括组装、测试、系统集成及印制板的周转/运输。 本文件建议的程序使印制板组装厂能够独立进行所要求的应变测试，并为印制板翘曲测量和风险等级评估提供了量化的方法。

A discussion was held in the 5-33AWG (ad hoc working group), on things that conformal coat professionals (materials and processes) wish designers knew about conformal coating. The 5-33AWG group is comprised of individuals from OEMs, coating suppliers, and test lab personnel.

The IPC-WP-021 white paper considers conformal coatings, like many high-performance materials, have evolved considerably since the 1990s. New coatings, such as fluoropolymers or hybrid coatings, have come on the market, many of which offer superior protection characteristics, but do not fit into the existing classifications of either MIL-I-46058 or IPC-CC-830. The IPC-WP-021 white paper discusses...

Establishes mechanical drop and shock and test guidelines for assessing solder joint reliability of printed board assemblies from system to component level. This document addresses methods to define mechanical shock use-conditions, methods to define system level, system printed board level and component test board level testing that correlate to such use conditions and guidance on the use of...

This document provides tests that record changes in surface insulation resistance (SIR) on a representative sample of a printed circuit assembly. It quantifies any deleterious effects that might arise from solder flux or other process residues left on external surfaces after soldering, which can cause unwanted electrochemical reactions that grossly affect reliability. It uses test vehicles that...

Surface mount pad cratering typically initiates prior to detection by existing electrical monitoring test methods. There are limited instrumentation techniques that are currently available that can identify non-electrical damage and its location to a high degree of accuracy. This guideline document establishes an acoustic emission (AE) method to evaluate the performance and reliability of surface...

While there are a variety of industry test vehicles for the examination of materials compatibility, most available test boards leave something to be desired as there is often a dramatic difference in materials between such test boards and produced assemblies. A test vehicle was needed which could be used for both ion chromatography and SIR testing that would be more representative of mainstream...

Manufacturers of high reliability electronics have been working for many years to mitigate the deleterious effects of tin whisker formation. One highly effective means to suppress the growth of tin whiskers is to replace the pure tin plating with reflowed tin-lead solder. One approach is to fully consume the tin plating by tin-lead solder during the SMT reflow process. This phenomenon of tin...

IPC-WP-019A a revised white paper provides an overview of ionic cleanliness requirements, providing examples of tests and requirements for acceptability from a residue/cleanliness standpoint. The history of ROSE testing is also provided, with explanations of the shortcomings of that testing.

This original research was a cooperative effort between the EMPF and IPC, released as EMPF-RR-0013 in 1993 for better understanding of ionic cleanliness testing. The IPC Ionic Conductivity/Ion Chromatography Test Task Group has validated its continued importance and relevance to the cleaning community and IPC-TR-583 is the result. It includes how solvent temperature influences the final...

This document has been created to help define criteria that will yield better test methods for use by the electronics and related industries. Key objectives to validating a new test method procedure are covered, including the usage of objective evidence to verify that the elements defined within a method fulfill the intended use and that the method yields repeatable and reproducible results when...

This document details the test procedures, test results and team conclusions for the IPC Cleaning and Cleanliness Testing Program, Phase 3, Low Solids Flux in Ambient Air. This effort has been part of a multi-stage program to investigate material and process alternatives to the use of chlorofluorocarbons (CFCs) in electronics manufacturing. This Phase 3 effort has been dedicated to characterizing...

IPC-TR-587 technical report delivers results of a major study on conformal coating. In most manufacturing specifications, conformal coating thickness is defined as the thickness of the final polymer film on a flat, unencumbered surface of the assembly, however conformal coating thickness on other assembly and component surfaces is not characterized. IPC-TR-587 is a report outlining an IPC study of...

Recognition vehicle for UL-796 and UL-746. Tests for conductor width plating quality-PTH, flammability, etc. (1 pc. 41 x 57 cm 1:1). Gerber Format.

简要介绍 （英文） 对SMT组件定期进行机械弯曲和冲击测试，以确保它们能够承受预期的生产、搬运和最终使用条件。在弯曲和冲击测试过程中，加载于SMT组件的应变和应变率在焊点附近会导致各种失效模式。本文件提供了测试方法去评估印制板组装（PBA）材料的敏感性和关于表面贴装技术（SMT）的连接焊盘下方绝缘材料接合失效的设计。这些测试方法，包括引脚拉拔、焊球拉拔、焊球剪切测试，可以对不同的印制板的材料和设计参数进行排序和比较。全文共17页。2010年12月发布。2013年5月翻译。

本文件旨在描述元器件板级互连的断裂强度特性，它详细说明了确定板级器件互连对非周期板组装和测试操作过程中可能发生的弯曲载荷的抗断裂力的常用方法。本文件适用于采用常规再流焊接技术连接到印制板上的表面贴装元器件，并补充了有关运输、装卸或现场操作过程中的机械冲击或撞击的现有标准。全文共14页，2004年6月正式发布英文版，2011年6月发布中文版 预览本标准

本标准建立了机械跌落和冲击测试指南，用于评估印刷电路板组件从系统到组件级别的焊点可靠性。 本文件介绍了定义机械冲击使用条件的方法，定义系统级别的方法；系统级印刷电路板以及与此类使用条件相关的元器件测试板级别的测试，以及使用实验测量机械冲击测试的指导。 正文42页。 2009年3月英文版发布。2019年3月翻译。

A Technical Paper by Dr. Jack Brous discussing ionic cleanliness measurement, testing methods and cleanliness standards in relation to product reliability. Also includes a brief discussion of no-clean fluxes. 8 pages. Released 1994

IPC-TR-587 technical report delivers results of a major study on conformal coating. In most manufacturing specifications, conformal coating thickness is defined as the thickness of the final polymer film on a flat, unencumbered surface of the assembly, however conformal coating thickness on other assembly and component surfaces is not characterized. IPC-TR-587 is a report outlining an IPC study of...