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Download the free Amendment 2 (.pdf) that resolves conflict in measles criteria between J-STD-001D, IPC-A-610D, IPC-6012B and IPC-A-600G. This is the Swedish Language version of IPC-6012B. This specification covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal...

This is the Chinese language translation of IPC-2221A. Only available in electronic format. IPC-2221A is the foundation design standard for all documents in the IPC-2220 series. It establishes the generic requirements for the design of printed boards and other forms of component mounting or interconnecting structures, whether single-sided, double-sided or multilayer. Among the many updates to...

Jedyny dokument branżowy dotyczący obsługiwania, pakowania i przechowywania płytek drukowanych. Wskazówki zawarte w tym dokumencie mają na celu ochronę płyt drukowanych przed zanieczyszczeniem, fizycznym uszkodzeniem, utratą lutowalności i wchłanianiem wilgotności. Uwzględniono rodzaje i metody materiałów opakowaniowych, środowisko produkcyjne, obsługiwanie i transport, a także profile wygrzewania...

本文档提供了全面的数据，帮助用户更轻松的确定挠性基底电介质材料的材料性能和兼容性，以制造挠性印制电路板。标准包括灵活的基础材料规格单，这些规格单针对已使用规格材料类型的最新属性进行了更新。标准建立了最新的分类体系、鉴定和质量符合性要求，其中包括高频介电特性。随着市场上的应用，标准还增加了碳氟化合物膜的新规格单。全文共23页。2017年3月发布。

Beschreibungin Englisch Diese Spezifikation beinhaltet die Anforderungen an Basismaterialien, hier als Laminate oder Prepregs bezeichnet, die hauptsächlich in starren Leiterplatten oder Multilayerleiterplatten für elektrische und elektronische Schaltungen verwendet werden. Das Dokument enthält 66 einzelne Spezifikationsblätter, die nach Suchbegriffen sortiert sind. Diese Suchbegriffe erlauben es...

記述 IPC-2221Bは、IPC-2220シリーズの全文書の基本となる設計基準である。これは片面、両面、または多層を問わず、プリント基板およびその他の形状の部品実装構造または相互接続構造の設計に関し、 一般的な要求事項を規定するものである。本書、リビジョンBの多くの更新内容として、導体特性、表面仕上げ、ビアプロテクション、基板の電気試験、誘電特性、基板ハウジング、熱ストレス、コンプライアントピン、パネライゼーション、および内層・外層の銅はくの厚さに関する新規基準がある。附属書Aには、ロットの受入れおよび品質適合試験で用いられるテストクーポンの新規設計が記載されている。170ページ。 2012年出版。2015年4月翻訳。 目次をみる。pdfファイル。

简要介绍 （英文） IPC-1720A由IPC OEM委员会开发，分为电子组件制造商的能力和有详细、实质性信息的供应商的OEM客户。本程序简化了审核过程且降低了审核频率，从而减少了文书工作且提高了效率。公司和分公司的描述，分公司能力简介 ，设备概况（现场审核前），技术概况要求，质量概况，以及制造概况。A版本由一个单一的，易使用的电子文档微软（ Word TM模板）组成，提供了具有合并和整理数据的电子功能。共56页。2004年7月发布。

La única guía de la industria para el manejo, empaquetado y almacenamiento de tarjetas impresas. Las pautas descritas en este documento tienen la intención de proteger las tarjetas impresas de contaminación, daños físicos, degradación y absorción de humedad. Se consideran los tipos de materiales y métodos de empaquetado, los entornos de producción, el manejo y transporte del producto y se...

描述 关于印制板操作、包装和储存的行业指南。这些指南是为了保护印制板，避免其受到污染、物理损坏、可焊性降低、静电放电（必要时）和吸湿。本文件考虑了包装材料和方法、生产环境、操作和产品运输，建立了除湿烘烤曲线。修订本A扩大了覆盖范围，包括防潮袋（MBB）、烘烤对印刷板可焊性的影响、ESD问题、蚀刻芯和复合材料的湿度问题、干燥剂材料和HIC卡以及包装和处理要求的示例流程。2017年8月翻译。

The IPC-1602 standard provides requirements intended to protect printed boards from contamination, physical damage, solderability degradation and moisture uptake. Consideration is given to packaging materials types and methods, production environment, handling and transport of product, and establishing baking profiles for moisture removal. IPC-1602 is now providing requirements that can be called...

This document describes materials that can be used for the fabrication of embedded passive capacitor devices within the finished printed circuit board substrate. For this document, embedded passive devices and the phrase embedded passives are considered to be equivalent. It provides information on general designations and associated characteristics of embedded passive device (EPD) capacitor...

This guideline provides an overview of the design process flow for printed electronics based devices, modules and units, and final products.The intent of IPC/JPCA-2291 is to establish a design process flow that will facilitate and improve the practice of printed electronics design. IPC/JPCA-2291 identifies documents such as standards that can be used to assist during the design process flow. 24...

This standard establishes the requirements for timely customer notification of changes to electronic products and associated processes.

This is a three-page list of common terms and definitions use when discussing solder reflow processes and equipment.

This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. The goal of this notification standard is to better enable customers to manage and mitigate the disruption caused by the discontinuation of a product and to ensure continuity of supply. This standard establishes the requirements for timely customer notification of planned...

IPC-2591, CFX standard establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. IPC-2591, CFX standard applies to communication between all executable processes in the manufacture of printed board assemblies, automated, semiautomated and manual, and is applicable to related mechanical...

This standard on spherical transient bend testing is intended to characterize the maximum allowable strain that a surface mount component's board level interconnects can withstand in flexural loading. Whereas four-point monotonic bend test methods only address simple planar bending, spherical bend tests establish strain limits of board level interconnects under worst-case flexure conditions that...

This is a seven-page list of electronics cleaning terms and definitions as they relate to printed circuit assembly cleaning.

This is a four-page list of common terms and definitions use when discussing screen printing processes and equipment.

This SMEMA standard is for fiducial marks. It was developed to facilitate the accurate placement of components on printed circuit boards.

IPC-2591, Version 1.6 establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. IPC-2591, Version 1.6 applies to communication between all executable processes in the manufacture of printed board assemblies, automated, semiautomated and manual, and is applicable to related mechanical assembly...

The IPC-HERMES-9852 is an open industry standard, developed by the Hermes Standard Initiative and approved by IPC. The IPC-HERMES-9852 provides a state-of-the-art communication protocol for machine-to-machine communication for surface-mount technology. Specifically, IPC-HERMES-9852, version 1.5 provides additional alignment with IPC-2591 (IPC-CFX). Used with IPC-2591, Connected Factory Exchange...

The IPC-4592 standard establishes the classification system, the qualification and quality conformance requirements for functional dielectric materials used in printed electronics applications. The intended applications include but are not limited to dielectric materials as protective dielectric or insulator/insulation layer(s), capacitive layer(s), crossovers and encapsulant(s) for devices in...

This specification sets the requirements for the use of electroless nickel/electroless palladium/immersion gold (ENEPIG) as a surface finish for printed boards. It establishes requirements for ENEPIG deposit thicknesses for applications including soldering, wire bonding and as a contact finish. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing...

The IPC-Hermes-9552 v. 1.4 is an open industry standard, developed by The Hermes Initiative and approved by IPC. The IPC-Hermes-9542 provide a state-of-the-art communication protocol for machine-to-machine communication for surface-mount technology (SMT). Specifically, IPC-HERMES-9852, version 1.4 provides additional alignment with IPC-2591 (IPC-CFX). Used with IPC-2591, Connected Factory Exchange...