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IPC-6012E-AM1 is an Amendent to the IPC-6012E that clarifes the distinction between receding and dewetting solder in reflowed SPb or HASL coatings. The Amendment also provides amended criteria for minimum external conductor thickness of the finished printed board and new acceptance criteria for the minimum thickness of internal plated layers

IPC-6013D-AM1 is an amendment makes changes to the existing acceptance criteria for copper wrap plating measurements as defined by IPC-6013D. IPC-6013D-AM1 is an amendment which implements a dual criterion for Class 3 copper wrap plating, based on design effectivity (before and after July 01, 2018), so as not to impose onto legacy designs any additional qualification activity associated with...

The IPC-J-STD-006C-AM1 amendment provides better detail of a solder alloy's maximum allowed deviation about the nominal level of the element's mass than was provided in past alloy standards. The IPC-J-STD-006C-AM1 amendment provided information on negative effects of adding rare earth elements to specific, heavy tin-containing, lead-free solder alloys and propensity of tin whisker formation...

Amendment 1 to IPC-7711/21C, the document provides procedures for removal and installation of D-Pak components

IPC-4821 Amendment 1 provides the update of IPC-CF-148 to the correct IPC-4563, references the IPC-TM-650, Method 2.5.7.2 for correct Hi-Pot testing of these thin materials, uses proper reference for visual inspection by inspectors and finally, updated the first five material specification sheets (IPC-4821/1 through IPC-4821/5) that now show Effective Dates of April 2010. The Specification Sheet...

IPC-4554, "Specification for Immersion Tin Plating for Printed Circuit Boards," is the third document in a series of specifications [the first two are: IPC-4552 which addresses electroless nickel/immersion gold (ENIG) and IPC-4553 which addresses immersion silver (IAg)] that set the requirements for printed circuit board surface finishes that are alternates to eutectic tin-lead. IPC-4554, a full...

The IPC-6012D-AM1 makes changes to the existing acceptance criteria for copper wrap plating measurements as defined by IPC-6012D. The IPC-6012D-AM1 implements a dual criterion for Class 3 copper wrap plating, based on design effectivity (before and after January 01, 2018), so as not to impose onto legacy designs any additional qualification activity associated with adopting acceptance requirements...

Specification for Finished Fabric Woven from "E" Glass for Printed Boards The Amendment 1 to IPC-4412B adds a new glass yarn [either SI identification => (4 1.32 1X0) or US identification => (BC 3750 1/0)] and a new light weight weave style => (1010) to the standard

IPC-4421B-AM2 an amendment includes two extensive tables of finished fabric glass styles, one in SI (metric) units and the other in U.S. (English) units. IPC-4412B standard exhaustively covers the classification and requirements for finished fabrics that are formed by plain woven glass fiber yarns. Simply, these yarns are appropriately sized bundles of continuous filament, electrical-grade ("E"...

Specification for Base Materials for High Speed/High Frequency Applications Amendment 1 generates a formalized record, for document control purposes, of corrections to ten separate sections in the main body of the standard; to the first 16 "legacy" specification sheets (IPC-4103/1 through IPC-4103/16); and to the 10 "new format" specification sheets for bonding layer materials (IPC-4103/500...

Amendment 1 modifies the standard by adding a new IPC-4203/25 Specification Sheet. Also, Table 1-5 Adhesive Type Designation has a new designation added: “V [Polyamide-imide]” and finally, the appropriate header information from /25 specification sheet is added to a section in the main body of the standard titled: Specification Sheets for Adhesive Coated Dielectric Films or Adhesive Bonding Films.

Amendment 2 to IPC-4202A modifies the standard by changing only one requirement in property 9. ‘Propogation Tear Strength, minimum’ for a base dielectric thickness that ranges from ≤ 50 µm to < 102 µm; changing the propogation tear strength to 13.5 grams [0.476 ounces].

Amendment 1 to IPC-4202A modifies the standard by correcting editorial errors; converts metric dimensional units of measure to those commonly used throughout industry; describes the flammability method of test and requirements for very thin materials (VTM); and corrects property requirement errors in all nine specification sheets contained in this standard.

IPC-9252A Amendment 1, published in October 2012, provides clarification to requirements for resistive isolation testing, as well as the testing of accessible midpoints for resistive continuity testing.

Amendments 1 & 2 to IPC J-STD-006B make the following nine changes to the basic document: 1. Correct some editorial mistakes in the document's text, 2. Add reference to IPC/JEDEC J-STD-609, Lead-Free and Leaded Marking, Symbols and Labels, 3. Clarify the meaning of those alloys that are designated as lead-free, 4. Provide guidance to suppliers how to designate and mark lead-free alloys, 5. Correct...

Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry Amendment 1 to IPC-4204A modifies the standard by replacing five sections in the document (sections: 1.1.2 Specific Designation; 2.1 IPC; 2.5 ISO; 3.5.2 Wrinkles, Creases, Streaks and Scratches; and 3.9 Electrical Requirements) to clarify the meanings of these sections.

Amendment 1 to IPC-4562A re-inserts the specification sheet IPC-4562/6 (CU-W6) back into the IPC-4562A document that was previously removed when the standard was revised to it's a revision from its original release in April 2008. Also included in this Amendment 1 are all references to the IPC-4562/6 (CU-W6) in section 1.2.4.1, the Table A1, the summary of all specification sheets as well as the...

Amendment 1 to the J-STD-004B corrects editorial mistakes throughout the document and addresses Halogen-free and Halide-free terminology and requirements in fluxes.

IPC-6012E-AM1是IPC-6012E的修订本，澄清了再流焊SnPb或HASL镀层中退润湿和焊料回缩之间的区别。 该修订本还为成品印制板的最小外部导体厚度提供了修订标准，并为内部电镀层的最小厚度提供了新的接受标准。

Bu döküman; kaplı delikiçine sahip olan veya olmayan tek yüzlü, çift yüzlü baskı devre kartları ve kör/gömülü geçiş deliklerine sahip olan veya olmayan çok katmanlı baskı devre kartları ile metal çekirdekli kartları içeren sert baskı devre kartlarının kalifikasyonunu ve performansını kapsamaktadır. Son kaplama ve yüzey kaplama gereklilikleri, iletkenler, delikler/geçiş delikleri, kabul testlerinin...

Ergänzung 1 zu IPC-7711/21C-DE, das Dokument enthält Verfahren für das Entfernen und Montieren von D-Pak-Komponenten.

Enmienda 1 al IPC-7711/21C, el documento proporciona los procedimientos para la extracción y la instalación de componentes D-Pak.

IPC-7711/21C的修订本1，本文件提供D-Pak元器件的去除和安装程序.

Amendement 1 à IPC-7711 / 21C fournit des procédures supplémentaires de retrait et d'installation

Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards Amendment 1 to IPC-4552 replaces the Table 3-1 Requirements of Electroless Nickel Immersion Gold Plating plus also replaces all of sections 3.2.1 Immersion Nickel Thickness and 3.2.2 Immersion Gold Thickness in the original release of the IPC-4552. The Amendment 1 permits the use of thinner gold (≥4 µm...