Skip to main content
  • My Location
    • Global Home Page
    • China Mainland
    • Europe
    • India & Southeast Asia
    • Japan
    • México
    • Republic of Korea
    • Taiwan
    • U.S. & Canada
  • Cert Portal (CQI)
  • Store
  • Membership
    • Membership Home Page
    • Membership Benefits
    • Get Started with Your Membership
    • Member Directory
    • Online Membership Application
    • Renew Membership Online
    • Membership Pricing
Cart

Hello, Sign In
My Account

  • Sign in
  • Don't have an account yet? Start here.
  • My Profile
  • View Orders
  • My Dashboard
  • My Electronics U
  • Help
electronics.org
Menu
Main navigation
  • Featured Standards
    • IPC-A-610
    • IPC-J-STD-001
    • IPC/WHMA-A-620
    • IPC-2591
    • IPC-1791
    • IPC-6012
    • IPC-6018
    • IPC-7711/21
  • Product Types
    • Certification
      • CQI
    • Handbooks & Guides
      • Desk Reference Manual
      • Handbook
      • Reference Materials
      • Training & Reference Guide
    • Illustrations/Art
      • Illustrations/Art
    • Industry Intelligence
      • Industry Report
      • Intelligence Subscription
      • Roadmap
    • Standards
      • Addendum
      • Addendum with amendment(s)
      • Amendment
      • Appendix
      • Development Packet
      • Errata
      • Handbook
      • Redline Standard
      • Schema
      • Standard Only
      • Standard with amendment(s)
      • Test Data Tables
      • Update
    • Technical Presentations
      • Conference Presentation/Proceedings
    • Technical Reports & White Papers
      • Industry Report
      • Study/Technical Report
      • White Paper
    • Test Board Schematics & Tools
      • Gerber Coupon Generator Subscription
      • Gerber Files
  • Topics
    • Advanced Packaging
    • Automotive Electronics
    • Conformal Coating
    • e-Textiles
    • Environmental Regulations
    • Factory of the Future
    • IPC CFX
    • PCB Design
Close
Main navigation
  • Featured Standards
    • IPC-A-610
    • IPC-J-STD-001
    • IPC/WHMA-A-620
    • IPC-2591
    • IPC-1791
    • IPC-6012
    • IPC-6018
    • IPC-7711/21
  • Product Types
    • Certification
      • CQI
    • Handbooks & Guides
      • Desk Reference Manual
      • Handbook
      • Reference Materials
      • Training & Reference Guide
    • Illustrations/Art
      • Illustrations/Art
    • Industry Intelligence
      • Industry Report
      • Intelligence Subscription
      • Roadmap
    • Standards
      • Addendum
      • Addendum with amendment(s)
      • Amendment
      • Appendix
      • Development Packet
      • Errata
      • Handbook
      • Redline Standard
      • Schema
      • Standard Only
      • Standard with amendment(s)
      • Test Data Tables
      • Update
    • Technical Presentations
      • Conference Presentation/Proceedings
    • Technical Reports & White Papers
      • Industry Report
      • Study/Technical Report
      • White Paper
    • Test Board Schematics & Tools
      • Gerber Coupon Generator Subscription
      • Gerber Files
  • Topics
    • Advanced Packaging
    • Automotive Electronics
    • Conformal Coating
    • e-Textiles
    • Environmental Regulations
    • Factory of the Future
    • IPC CFX
    • PCB Design
Contact Us

Search results

Breadcrumb

  1. Global Home
  2. Store
  3. Search results

Your results

  • 51
  • (-) Amendment
  • Clear filters
  • Current Revision Only

  • Standards (1002)
    • Standard Only (798)
    • (-) Amendment (51)
    • Addendum (77)
    • Standard with amendment(s) (34)
    • Handbook (2)
    • Addendum with amendment(s) (8)
    • Redline Standard (23)
    • Errata (5)
    • Appendix (1)
    • Update (1)
    • Development Packet (1)
    • Test Data Tables (1)
  • Technical Reports & White Papers (63)
    • Study/Technical Report (17)
    • White Paper (46)
  • Handbooks & Guides (41)
    • Handbook (24)
    • Desk Reference Manual (2)
    • Training & Reference Guide (14)
    • Reference Materials (1)
  • Industry Intelligence (16)
    • Industry Report (11)
    • Intelligence Subscription (3)
    • Roadmap (2)
  • Technical Presentations (12)
    • Conference Presentation/Proceedings (12)
  • Test Board Schematics & Tools (10)
    • Gerber Files (10)
  • Illustrations/Art (6)
    • Illustrations/Art (6)
  • Certification (1)
    • CQI (1)

  • Cables and Harnesses (7)
  • Data Transfer (4)
  • Press Fit (1)
  • Printed Boards (33)
  • Printed Electronics (2)
  • Soldering (17)

  • Assembly (22)
  • Board Fab (16)
  • Box Build (7)
  • Cables and Harnesses (WHMA) (8)
  • Cleaning and Coating (14)
  • Design (4)
  • Materials (19)
  • Rework and Repair (11)
  • Test (11)

Products

IPC-6012E-AM1 Cover Image

IPC-6012 - Revision E - Amendment 1

Qualification and Performance Specification for Rigid Printed Boards

Document #:
IPC-6012
Revision
E
Product Type
Amendment
Released:  04/20/2022
Language
English
Current Revision
IPC-6012E-AM1 is an Amendent to the IPC-6012E that clarifes the distinction between receding and dewetting solder in reflowed SPb or HASL coatings. The Amendment also provides amended criteria for minimum external conductor thickness of the finished printed board and new acceptance criteria for the minimum thickness of internal plated layers
no-image-available

IPC-6013 - Revision D - Amendment 1

Qualification and Performance Specification for Flexible and Rigid-Flexible Printed Boards

Document #:
IPC-6013
Revision
D
Product Type
Amendment
Released:  05/03/2018
Language
English
Current Revision
IPC-6013D-AM1 is an amendment makes changes to the existing acceptance criteria for copper wrap plating measurements as defined by IPC-6013D. IPC-6013D-AM1 is an amendment which implements a dual criterion for Class 3 copper wrap plating, based on design effectivity (before and after July 01, 2018), so as not to impose onto legacy designs any additional qualification activity associated with...

IPC-J-STD-006 - Revision C - Amendment 1

Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications

Document #:
IPC-J-STD-006
Revision
C
Product Type
Amendment
Released:  11/02/2017
Language
English
Current Revision
The IPC-J-STD-006C-AM1 amendment provides better detail of a solder alloy's maximum allowed deviation about the nominal level of the element's mass than was provided in past alloy standards. The IPC-J-STD-006C-AM1 amendment provided information on negative effects of adding rare earth elements to specific, heavy tin-containing, lead-free solder alloys and propensity of tin whisker formation...
no-image-available

IPC-7711/21 - Revision C - Amendment 1

Rework, Modification and Repair of Electronic Assemblies

Document #:
IPC-7711/21
Revision
C
Product Type
Amendment
Released:  08/05/2020
Language
English
Current Revision
Amendment 1 to IPC-7711/21C, the document provides procedures for removal and installation of D-Pak components
IPC-1755A Am1 Cover Image

IPC-1755 - Revision A - Amendment 1

Responsible Sourcing of Minerals Data Exchange Standard

Document #:
IPC-1755
Revision
A
Product Type
Amendment
Released:  10/27/2021
Language
English
Current Revision
IPC-1755A-Am1 cannot be used without a copy of IPC-1755A the base standard. You can purchase IPC-1755A-Am1 and IPC-1755A in the IPC.org online store. The IPC-1755A standard establishes the requirements for exchanging data between suppliers and their customers regarding the responsible resourcing of minerals. The IPC-1755 standard originally addressed conflict minerals within the scope of the Dodd...
no-image-available

IPC-4413 - Amendment 1

Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards

Document #:
IPC-4413
Revision
Original Version
Product Type
Amendment
Released:  01/29/2026
Language
English
Current Revision
IPC-4105 is a new document that covers the requirements for metal-base materials that are referred to as metal-based laminate listed in the specification sheets that are contained in the last of the main body. These are to be used primarily for rigid and multilayer printed boards for electronic interconnections.
no-image-available

IPC-4821 - Amendment 1

Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards

Document #:
IPC-4821
Revision
Original Version
Product Type
Amendment
Released:  05/01/2006
Language
English
Current Revision
IPC-4821 Amendment 1 provides the update of IPC-CF-148 to the correct IPC-4563, references the IPC-TM-650, Method 2.5.7.2 for correct Hi-Pot testing of these thin materials, uses proper reference for visual inspection by inspectors and finally, updated the first five material specification sheets (IPC-4821/1 through IPC-4821/5) that now show Effective Dates of April 2010. The Specification Sheet...
no-image-available

IPC-1754 - Amendment 2

Materials and Substances Declaration for Aerospace and Defense and Other Industries

Document #:
IPC-1754
Revision
Original Version
Product Type
Amendment
Released:  06/23/2020
Language
English
Current Revision
IPC-1754-Am2, establishes the requirements for the exchanging material and substance data for Products between suppliers and their customers and has been developed through the participation of aerospace, defense, automotive, electronics and solution provider representatives.
no-image-available

IPC-4554 - Amendment 1

Specification for Immersion Tin Plating for Printed Circuit Boards

Document #:
IPC-4554
Revision
Original Version
Product Type
Amendment
Released:  09/01/2013
Language
English
Current Revision
IPC-4554, "Specification for Immersion Tin Plating for Printed Circuit Boards," is the third document in a series of specifications [the first two are: IPC-4552 which addresses electroless nickel/immersion gold (ENIG) and IPC-4553 which addresses immersion silver (IAg)] that set the requirements for printed circuit board surface finishes that are alternates to eutectic tin-lead. IPC-4554, a full...
no-image-available

IPC-9707 - Amendment 1

Spherical Bend Test Method for Characterization of Board Level Interconnects

Document #:
IPC/JEDEC-9707
Revision
Original Version
Product Type
Amendment
Released:  05/01/2018
Language
English
Current Revision
IPC/JEDEC-9707-AM1 is an amendment which clarifies that the standard is only applicable to transient bending during short-term test operations. The standard specifies a common method of establishing strain limits of board-level device interconnects under spherical transient bending conditions, the worst-case flexure condition that can occur during conventional printed board/system assembly...
no-image-available

IPC-6012 - Revision D - Amendment 1

Qualification and Performance Specification for Rigid Printed Boards

Document #:
IPC-6012
Revision
D
Product Type
Amendment
Released:  09/01/2017
Language
English
The IPC-6012D-AM1 makes changes to the existing acceptance criteria for copper wrap plating measurements as defined by IPC-6012D. The IPC-6012D-AM1 implements a dual criterion for Class 3 copper wrap plating, based on design effectivity (before and after January 01, 2018), so as not to impose onto legacy designs any additional qualification activity associated with adopting acceptance requirements...
no-image-available

IPC-1754 - Amendment 2

Materials and Substances Declaration for Aerospace and Defense and Other Industries

Document #:
IPC-1754
Revision
0
Product Type
Amendment
Language
English
Current Revision
IPC-1754-Am2, establishes the requirements for the exchanging material and substance data for Products between suppliers and their customers and has been developed through the participation of aerospace, defense, heavy equipment, automotive, electronics and solution provider representatives.
no-image-available

IPC-J-STD-001 - Revision F - Amendment 1

Requirements for Soldered Electrical and Electronic Assemblies

Document #:
IPC-J-STD-001
Revision
F
Product Type
Amendment
Released:  11/01/2015
Language
English
This is an amendment to IPC J-STD-001F, a recognized industry-consensus standard covering materials and processes. Changes include, but are not limited to, a revision to plated-through hole, PTH, minimum fill requirements and BGA voiding criteria, new graphics for several surface mount component types, revised staking criteria, and recognition of the paragraphs addressed in J-STD-001FS, Space...
no-image-available

IPC-A-610 - Revision F - Amendment 1

Acceptability of Electronic Assemblies

Document #:
IPC-A-610
Revision
F
Product Type
Amendment
Released:  12/14/2015
Language
English
This amendment cannot be used without a copy of IPC-A-610F. See Related items. This is an amendment to IPC-A-610F, a recognized industry-consensus standard covering acceptability requirements for electronic assemblies. Changes include, but are not limited to, a revision to plated-through hole, PTH, minimum fill requirements, BGA voiding criteria for noncollapsing balls, and staking criteria.
no-image-available

IPC-1072 - Amendment 1

Intellectual Property Protection in Electronic Assembly Manufacturing

Document #:
IPC-1072
Revision
Original Version
Product Type
Amendment
Released:  03/07/2017
Language
English
Current Revision
This amendment to IPC-1072 updates the document to align its requirements with the requirements in its counterpart standard IPC-1071 for PCB shops. 5 Pages. Released March 2017 This amendment cannot be used without a copy of IPC-1072 (December 2015). To purchase the original document please see Related Products and choose 1072(D)1
no-image-available

IPC/WHMA-A-620 - Revision B - Amendment 1

Requirements and Acceptance for Cable and Wire Harness Assemblies

Document #:
IPC/WHMA-A-620
Revision
B
Product Type
Amendment
Released:  08/01/2013
Language
English
This amendment provides resolution to some internal conflicts, aligns common criteria to other IPC standards, and corrects some editorial errors. This amendment is only to be used in conjunction with IPC/WHMA-A-620 Revision B, October 2012. Follow your company policy and procedures to make pen and ink changes or notations to the published IPC/WHMA-A-620 Revision B. When there are changes to a...
no-image-available

IPC-4412 - Revision B - Amendment 1

Specification for Finished Fabric Woven from "E" Glass for Printed Boards

Document #:
IPC-4412
Revision
B
Product Type
Amendment
Released:  04/01/2014
Language
English
Specification for Finished Fabric Woven from "E" Glass for Printed Boards The Amendment 1 to IPC-4412B adds a new glass yarn [either SI identification => (4 1.32 1X0) or US identification => (BC 3750 1/0)] and a new light weight weave style => (1010) to the standard
no-image-available

IPC-4412 - Revision B - Amendment 2

Specification for finished Fabric Woven from "E" Glass for Printed Boards

Document #:
IPC-4412
Revision
B
Product Type
Amendment
Released:  05/18/2018
Language
English
IPC-4421B-AM2 an amendment includes two extensive tables of finished fabric glass styles, one in SI (metric) units and the other in U.S. (English) units. IPC-4412B standard exhaustively covers the classification and requirements for finished fabrics that are formed by plain woven glass fiber yarns. Simply, these yarns are appropriately sized bundles of continuous filament, electrical-grade ("E"...

IPC-4103 - Revision A - Amendment 1

Specification for Base Materials for High Speed/High Frequency Applications

Document #:
IPC-4103
Revision
A
Product Type
Amendment
Released:  01/01/2014
Language
English
Specification for Base Materials for High Speed/High Frequency Applications Amendment 1 generates a formalized record, for document control purposes, of corrections to ten separate sections in the main body of the standard; to the first 16 "legacy" specification sheets (IPC-4103/1 through IPC-4103/16); and to the 10 "new format" specification sheets for bonding layer materials (IPC-4103/500...

IPC-CC-830 - Revision B - Amendment 1

Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

Document #:
IPC-CC-830
Revision
B
Product Type
Amendment
Released:  09/01/2008
Language
English
IPC-CC-830B prescribes qualification and performance requirements of conformal coatings. Amendment 1 provides updated requirements for moisture and insulation resistance and temperature and humidity aging and additional information on coating classifications.
no-image-available

IPC-4203 - Revision A - Amendment 1

Cover and Bonding Material for Flexible Printed Circuitry

Document #:
IPC-4203
Revision
A
Product Type
Amendment
Released:  10/01/2014
Language
English
Amendment 1 modifies the standard by adding a new IPC-4203/25 Specification Sheet. Also, Table 1-5 Adhesive Type Designation has a new designation added: “V [Polyamide-imide]” and finally, the appropriate header information from /25 specification sheet is added to a section in the main body of the standard titled: Specification Sheets for Adhesive Coated Dielectric Films or Adhesive Bonding Films.
no-image-available

IPC-4202 - Amendment 2

Flexible Base Dielectrics for Use in Flexible Printed Circuitry

Document #:
IPC-4202
Revision
A
Product Type
Amendment
Released:  03/01/2014
Language
English
Amendment 2 to IPC-4202A modifies the standard by changing only one requirement in property 9. ‘Propogation Tear Strength, minimum’ for a base dielectric thickness that ranges from ≤ 50 µm to < 102 µm; changing the propogation tear strength to 13.5 grams [0.476 ounces].
no-image-available

IPC-4202 - Revision A - Amendment 1

Flexible Base Dielectrics for Use in Flexible Printed Circuitry

Document #:
IPC-4202
Revision
A
Product Type
Amendment
Released:  03/01/2014
Language
English
Amendment 1 to IPC-4202A modifies the standard by correcting editorial errors; converts metric dimensional units of measure to those commonly used throughout industry; describes the flammability method of test and requirements for very thin materials (VTM); and corrects property requirement errors in all nine specification sheets contained in this standard.
no-image-available

IPC-9252 - Revision A - Amendment 1

Requirements for Electrical testing of Unpopulated Printed Boards

Document #:
IPC-9252
Revision
A
Product Type
Amendment
Released:  10/01/2012
Language
English
IPC-9252A Amendment 1, published in October 2012, provides clarification to requirements for resistive isolation testing, as well as the testing of accessible midpoints for resistive continuity testing.
no-image-available

IPC-J-STD-006 - Revision B - Amendments 1 & 2

Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications

Document #:
IPC-J-STD-006
Revision
B
Product Type
Amendment
Released:  09/01/2009
Language
English
Amendments 1 & 2 to IPC J-STD-006B make the following nine changes to the basic document: 1. Correct some editorial mistakes in the document's text, 2. Add reference to IPC/JEDEC J-STD-609, Lead-Free and Leaded Marking, Symbols and Labels, 3. Clarify the meaning of those alloys that are designated as lead-free, 4. Provide guidance to suppliers how to designate and mark lead-free alloys, 5. Correct...

Pagination

  • First First page
  • Previous Previous page
  • Next Next page
  • Last Last page
1-25 of 51
    • 25
    • 50
    • 75
    • 100

Coming Soon

IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-6905: Qualification and Performance Specification for Additively Manufactured Electronics (AME)

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC/JEDEC-9702A: Monotonic Bend Characterization of Board-Level Interconnects

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards

IPC-9716A: Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies

IPC-9711: Generic Requirements for Automated Inspection Process Control

IPC-HERMES-9852 Version 1.7: The Global Standard for Machine-to-Machine Communication in SMT Assembly

Receive Email Updates from Global Electronics Association

electronics.org

Global Electronics Association
3000 Lakeside Drive, 105 N 
Bannockburn, IL 60015 
PH + 1 847-615-7100 
8:00 a.m. to 5:00 p.m. CST

EMAIL: contact@electronics.org

 

Contact Us

Footer Navigation
  • WHMA
  • Electronics Foundation
  • I-Connect007
Footer Secondary Navigation
  • About Us
  • Blog
  • FAQ
  • Careers
  • USPAE
© 2026 Legal Name: IPC International Inc, DBA Global Electronics Association
Footer Bottom Navigation
  • Cookie
  • Disclosure / Legal
  • Privacy Policy
  • Return Policy
  • LinkedIn
  • YouTube
  • Instagram
  • Facebook
  • Flickr