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Products

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IPC-TINCC - White Paper

Long Term Investigation of Urethane Coating Against Tin Whisker Growth

Document #:
IPC-TINCC
Revision
Original Version
Product Type
White Paper
Released:  01/13/2011
Language
English
Current Revision
This paper "Long Term Investigation of Urethane Conformal Coating Against Tin Whisker Growth" was presented by Lyudmyla Panashchenko of NASA GSFC at the IPC Tin Whisker Conference, in December 2010. It describes the results of 11 years of aging of a conformal coat and its ability to inhibit tin whisker growth. It shows that whiskers continue to grow with time and how they may be constrained by the...
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IPC-FINFIN - White Paper

Final Finish for Connectivity

Document #:
IPC-FINFIN
Revision
Original Version
Product Type
White Paper
Released:  01/18/2012
Language
English
Current Revision
"Final Finish for Connectivity" was presented by George Milad of Uyemura International Corporation at the IPC Conference for the PCB Industry: Critical Issues for the Military Market, in December 2011. The author describes surface finishes applied to printed circuit boards to enhance their reliability, solderability, shelf life and the applicability to wire bonding. He also mentions the IPC...
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IPC-MILCERT-0915 - White Paper

Trends in Military Certifications: What You Need to Know About the Obvious and the Obscure

Document #:
IPC-CERT-915
Revision
Original Version
Product Type
White Paper
Released:  02/03/2011
Language
English
Current Revision
This presentation "Trends in Military Certifications: What You Need to Know About the Obvious and the Obscure," was presented at the IPC Conference for the North American EMS Industry, What it Takes to Supply the Military, Management Session, in September 2010 by Steve DeWaters, president of Penumbra Strategies, Inc. It describes the rise of Commercial Off the Shelf (COTS) items and why Military...
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IPC-WP-013 - White Paper

Analytical Procedures for Portable Lead-Free Alloy Test Data

Document #:
IPC-WP-013
Revision
Original Version
Product Type
White Paper
Released:  07/01/2014
Language
English
Current Revision
There are a large number of new lead-free alloys that address the manufacturing problems inherent in current lead-free products on the market. However, their reliability properties are less understood than many of the first alloys introduced, for example SAC 305. While it is tempting to look to the new alloys as solutions to manufacturing issues of the older materials, the lack of reliability...
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IPC-SPVC - White Paper

Take Action Limits (TAL) for SAC305 Lead Free Soldering Processes Utilizing Solder Baths/Pots

Document #:
IPC-SPVC-TAL
Revision
Original Version
Product Type
White Paper
Released:  11/12/2009
Language
English
Current Revision
The IPC Solder Products Value Council’s Technical Subcommittee Report “Take Action Limits (TAL) for SAC305 Lead Free Soldering Processes Utilizing Solder Baths/Pots” reports on research on take action limits of solder pot contamination for SAC305 lead-free solder. As opposed to one maximum contamination level, the IPC SPVC opted to identify three action levels: Normal operation defined as the...
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IPC-WP-023 - White Paper

IPC Technology Solutions White Paper on Performance-Based Printed Board OEM Acceptance: The Hidden Reliability Threat

Document #:
IPC-WP-023
Revision
Original Version
Product Type
White Paper
Released:  05/01/2018
Language
English
Current Revision
IPC-WP-023 is an IPC Technology Solutions White Paper addressing reliability issues associated with stacked microvias. There is evidence that staggering vias can result in a more robust structure; however, staggering microvias is only a temporary solution to accommodate complex designs with microvias built with weak interface structures IPC-WP-023 white paper provides an investigation of these...

IPC-WP-019 - Revision A - White Paper

An Overview on the Global Change in Ionic Cleanliness Requirements

Document #:
IPC-WP-019
Revision
A
Product Type
White Paper
Released:  10/12/2018
Language
English
IPC-WP-019A a revised white paper provides an overview of ionic cleanliness requirements, providing examples of tests and requirements for acceptability from a residue/cleanliness standpoint. The history of ROSE testing is also provided, with explanations of the shortcomings of that testing.

IPC-TR-583 - Study/Report

An In-Depth Look At Ionic Cleanliness Testing

Document #:
IPC-TR-583
Revision
Original Version
Product Type
Study/Technical Report
Released:  07/01/2002
Language
English
Current Revision
This original research was a cooperative effort between the EMPF and IPC, released as EMPF-RR-0013 in 1993 for better understanding of ionic cleanliness testing. The IPC Ionic Conductivity/Ion Chromatography Test Task Group has validated its continued importance and relevance to the cleaning community and IPC-TR-583 is the result. It includes how solvent temperature influences the final...

IPC-TR-486 - Study/Report

Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations

Document #:
IPC-TR-486
Revision
Original Version
Product Type
Study/Technical Report
Released:  07/01/2001
Language
English
Current Revision
This technical report provides full detail of the round robin study charged with assessing the use of Interconnect Stress Test (IST) as a test for incoming inspection in lieu of Thermal Stress in the detection of innerlayer separations in plated-through holes. Includes background on the Post Separation Task Group, test results, round robin test plan, conclusions and test methods used. 51 pages...

IPC-TR-579 - Study/Report

Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs

Document #:
IPC-TR-579
Revision
Original Version
Product Type
Study/Technical Report
Released:  09/01/1988
Language
English
Current Revision
Approximately 200,000 plated through-holes, covering primarily electroplated but also electroless technology, were exposed to several different thermal cycles. A number of PTH diameters, board constructions and plating thicknesses were evaluated. 80 pages. Released September 1988.
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IPC-582 - Study/Report

Cleaning & Cleanliness Test Program for Phase 3-Low Solids Fluxes & Pastes Processed in Ambiant Air

Document #:
IPC-TR-582
Revision
Original Version
Product Type
Study/Technical Report
Released:  10/02/2018
Language
English
Current Revision
This document details the test procedures, test results and team conclusions for the IPC Cleaning and Cleanliness Testing Program, Phase 3, Low Solids Flux in Ambient Air. This effort has been part of a multi-stage program to investigate material and process alternatives to the use of chlorofluorocarbons (CFCs) in electronics manufacturing. This Phase 3 effort has been dedicated to characterizing...
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IPC-TR-549 - Study/Report

Measles in Printed Wiring Boards

Document #:
IPC-TR-549
Revision
Original Version
Product Type
Study/Technical Report
Released:  12/02/2014
Language
English
Current Revision
An IPC Blue Ribbon Committee originally published this study. It provides extensive background and test results resolving methods to identify visible conditions such as measles in PWBs and that measles do not impact reliability. 81 Pages. Released November 1973.
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IPC-TR-467 - Study/Report

Supporting Data and Numerical Examples for ANSI/J-STD-001B APPENDIX D (Control of Fluxes)

Document #:
IPC-TR-467
Revision
Original Version
Product Type
Study/Technical Report
Released:  10/01/1996
Language
English
Current Revision
This addendum to J-STD-001, originally developed for Revision B but also applicable to Revision C, proposes solutions for cost-effective testing and increased implementation. Also covers other assembly test methods that are not addressed in J-STD-001. 12 pages. Released October 1996. Now available in electronic format.

IPC-TR-585 - Study/Report

Time, Temperature and Humidity Stress of Final Board Finish Solderability

Document #:
IPC-TR-585
Revision
Original Version
Product Type
Study/Technical Report
Released:  05/01/2006
Language
English
Current Revision
This Technical Report details the investigations into identifying stress tests that distinguish between robust and non-robust surface finishes. A robust finish will pass a test for solderability whereas a non-robust finish will fail. The stress tests identified do not necessarily duplicate real world environment (fabrication of the bare printed board through assembly), but they must correlate to...
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IPC-TR-465-3 - Study/Report

Evaluation of Steam Aging on Alternative Finishes, Phase 11A

Document #:
IPC-TR-465
Revision
Original Version
Product Type
Study/Technical Report
Released:  07/01/1996
Language
English
Current Revision
Details the results of a two-year study to determine the effect of steam aging exposure on components. A variety of solderable finishes were used. A small production simulation utilized preconditioned and as-received samples and tested a total of 2,000 joints. 15 pages. Released July 1996.
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IPC-TR-587 - Standard Only

Conformal Coating Material and Application ‘‘State of the Industry’’ Assessment Report

Document #:
IPC-TR-587
Revision
Original Version
Product Type
Study/Technical Report
Released:  08/04/2020
Language
English
Current Revision
IPC-TR-587 technical report delivers results of a major study on conformal coating. In most manufacturing specifications, conformal coating thickness is defined as the thickness of the final polymer film on a flat, unencumbered surface of the assembly, however conformal coating thickness on other assembly and component surfaces is not characterized. IPC-TR-587 is a report outlining an IPC study of...
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IPC-TR-001 - Study/Report

An Introduction to Tape Automated Bonding Fine Pitch Technology

Document #:
IPC-TR-001
Revision
Original Version
Product Type
Study/Technical Report
Released:  01/01/2006
Language
English
Current Revision
This document, co-developed by the IPC, EIA and ASTM, represents a comprehensive report on fine pitch technology with an emphasis on tape-automated bonding and design rules. Subjects include land pattern design, types of encapsulation, TAB tape format, assembly techniques and the advantages and disadvantages of FPT. 54 pages. Released by the Surface Mount Council January 1989.
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IPC-TP-1113 - Study/Report

Circuit Board Ionic Cleanliness Measurement: What Does it Tell Us?

Document #:
IPC-TP-1113
Revision
Original Version
Product Type
Study/Technical Report
Released:  01/01/1994
Language
English
Current Revision
A Technical Paper by Dr. Jack Brous discussing ionic cleanliness measurement, testing methods and cleanliness standards in relation to product reliability. Also includes a brief discussion of no-clean fluxes. 8 pages. Released 1994
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IPC-T800 - Study/Report

IPC-2017 North American Cable Assembly Manufacturers

Document #:
IPC-T800
Revision
2017
Product Type
Study/Technical Report
Language
English
Current Revision
The 2017 North American Cable Assembly Manufacturers report includes company name, address, phone number, business manager, website, estimated 2015 worldwide revenues, facility size, manufacturing locations by region of the world, markets served, product types manufactured, agency approvals/certifications, minority business designations, and a brief description of the business. Nonmember pricing...
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IPC-P799 - Study/Report

IPC-2019 World Cable Assembly Market

Document #:
IPC-P799
Revision
2019
Product Type
Study/Technical Report
Language
English
Current Revision
2019 World Cable Assembly Market, a new research report from industry leader Bishop & Associates, addresses the growth markets and regions and much more. This 17-chapter, 219-page report provides a detailed analysis of the cable assembly market by region, end-use equipment sector, and cable assembly type in US dollars for the years 2018 through 2024. Analysis is provided numerically and...
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IPC-TR-464 - Addendum with Amendment 1 - Other

Accelerated Aging for Solderability Evaluations-Addendum

Document #:
IPC-TR-464
Revision
Original Version
Product Type
Study/Technical Report
Released:  04/01/1987
Language
English
Current Revision
This addendum to IPC-TR-464 was released in April 1987 and represents the results of the task group study to evaluate and determine if the aging period recommended in the original Technical Report could be shortened and still provide the appropriate information on solderability retention.
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IPC-TR-587 - Standard Only

Conformal Coating Material and Application ‘‘State of the Industry’’ Assessment Report

Document #:
IPC-TR-587
Revision
Original Version
Product Type
Study/Technical Report
Language
English
Current Revision
IPC-TR-587 technical report delivers results of a major study on conformal coating. In most manufacturing specifications, conformal coating thickness is defined as the thickness of the final polymer film on a flat, unencumbered surface of the assembly, however conformal coating thickness on other assembly and component surfaces is not characterized. IPC-TR-587 is a report outlining an IPC study of...
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IPC-WP-019 - Revision B - White Paper

综述全球离子洁净度要求的变更

Document #:
IPC-WP-019
Revision
B
Product Type
White Paper
Released:  04/13/2022
Language
Chinese
Current Revision
本白皮书 IPC WP-019B 旨在支持 J-STD-001 修订版 H,并提供额外的指导、示例和对第 8.0 节清洁和残留物要求的理解。 推荐给那些希望实现 J-STD-001 8.0 要求的人。
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IPC-WP-019 - Revision A - White Paper

Présentation des modifications générales des exigences en matière de propreté ionique

Document #:
IPC-WP-019
Revision
A
Product Type
White Paper
Released:  03/13/2019
Language
French
Current Revision
La révision du livre blanc IPC-WP-019A présente les exigences en matière de propreté ionique, avec des exemples de tests et d’exigences pour l’acceptabilité du point de vue des résidus/de la propreté. Un historique des tests ROSE est également fourni, accompagné d’explications relatives aux défauts que présentent ces tests.
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IPC-WP-019 - Revision A - White Paper

Ein Überblick über die globalen Veränderungen bei den Anforderungen an ionische Reinheit

Document #:
IPC-WP-019
Revision
A
Product Type
White Paper
Released:  03/13/2019
Language
German
Current Revision
IPC-WP-019A ist ein revidiertes Whitepaper mit einem Überblick über die Anforderungen an ionische Reinheit, das Beispiele für Tests und Abnahmekriterien unter dem Blickwinkel von Flussmittelrückständen/Reinheit enthält. Die Geschichte des ROSE-Testverfahrens wird ebenfalls geschildert, und die Nachteile dieses Verfahrens werden erläutert.

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Coming Soon

IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-6905: Qualification and Performance Specification for Additively Manufactured Electronics (AME)

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC/JEDEC-9702A: Monotonic Bend Characterization of Board-Level Interconnects

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards

IPC-9716A: Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies

IPC-9711: Generic Requirements for Automated Inspection Process Control

IPC-HERMES-9852 Version 1.7: The Global Standard for Machine-to-Machine Communication in SMT Assembly

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