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This multimedia presentation was given at the IPC Tin Whisker Conference, April 2012, by David Hillman, metallurgical engineer in the Advanced Operations Engineering Department of Rockwell Collins. The author describes a program funded by the Strategic Environmental Research and Development Program (SERDP) to evaluate various conformal coatings to mitigate tin whisker growth. He also introduces an...

The IPC APEX EXPO 2025 Technical Conference Proceedings represent the latest research and developments in printed board materials, design, manufacture and assembly as well as technical papers on Factory of the Future.

"Underfill Selection and the Impact on Reliability" was presented at the IPC Conference on Reliability: Assembly Process for a Reliable Product in November 2011 by Dr. Brian Toleno, director of technical services and applications for Henkel. The author defines underfill and describes the types. He explaines the need for underfill and where it is typically used. He also explains the effects of...

This presentation "HDI Assembly Related Issues" was given by Ian Williams, manager of customer interconnect core competency team at Intel Corp. at the IPC Conference on HDI Technology High Performance: Strategies for the 21st Century at Baltimore, Md., in March 2011. The author describes an Intel investigation into assembly challenges, capabilities, quality, reliability and testability of HDI...

Presentation by Karl Dietz, Ph.D., DuPont at the Technology Interchange meeting at EIT in Endicott, N.Y. Contains powerpoint slides and recorded presentation. Includes overview, capabilities, challenges and advances of laser direct imaging techniques, photolithography and etching. Also includes problems in etching and how to minimize them. Excellent 37 minute non-commercial tutorial on the subject...

The 2019 IPC APEX EXPO technical conference is one of the most outstanding in the electronics industry. Proceedings from this technical conference include: 98 presentations from 34 sessions, 20 poster papers and 5 buzz session presentations on Automation in Electronics Manufacturing, Adhesives, Advanced Technology, Area Array/Flip Chip/0201 Metric, Assembly and Rework Processes, BGA/CSP Packaging...

The IPC APEX EXPO 2023 Technical Conference Proceedings represent the latest research and developments in printed board materials, design, manufacture and assembly, as well as technical papers on Factory of the Future.

The IPC APEX EXPO 2022 Technical Conference Proceedings represent the latest research and developments in printed board materials, design, manufacture and assembly, as well as technical papers on Factory of the Future.

The IPC APEX EXPO 2024 Technical Conference Proceedings represent the latest research and developments in printed board materials, design, manufacture and assembly as well as technical papers on Factory of the Future.

The IPC APEX EXPO 2021 Technical Conference Proceedings represent the latest research and developments in printed board materials, design, manufacture and assembly, as well as technical papers on Factory of the Future.

The 2020 IPC APEX EXPO technical conference is one of the most outstanding in the electronics industry. Proceedings from this technical conference include: 78 presentations from 29 sessions, 24 poster abstracts and 19 sessions @ the intersections. Advanced Technology, Area Array/Flip Chip/0201, Assembly Processes, BGA Packaging, Black Pad, Business & Supply Chain Issues Counterfeit Electronics...

The 2018 IPC APEX EXPO technical conference is one of the most outstanding in the electronics industry. Proceedings from the technical conference include: 70 presentations from 28 sessions, 24 poster papers and 5 buzz session presentations. Advanced Technology, Area Array/Flip Chip/0201, Assembly Processes, BGA Packaging, Black Pad, Business & Supply Chain Issues Counterfeit Electronics, Design...