Search results

This document describes the design and assembly challenges and ways to address those challenges for implementing 3D component technology. Recognizing the effects of combining multiple uncased semiconductor die elements in a single-package format can impact individual component characteristics and can dictate suitable assembly methodology. The information contained in this standard focuses on...

This standard defines classification levels and testing thresholds to assess the reliability of e-textile wearables in their intended end-use environments. It establishes baseline criteria for evaluating durability under mechanical stressors—such as abrasion, flexing, and UV exposure—and environmental conditions including perspiration, washing, water/saltwater, alkalis, and acids. Supported by 14...

This standard identifies categories and establishes a designation system and qualification/quality conformance requirements and test methods for conductive yarns used in e-textiles. The standard enables suppliers of conductive yarns to demonstrate their products’ performance against real-world processing and end-use environments, leveraging eight IPC Test Methods developed specifically for...

IPC-8401 standard provides guidelines for In-Mold Electronics (IME) manufacturing processes, part structures, candidate materials, and production test methods. In-Mold Electronics integrates printed electronics and electrical components into injection molded plastics, creating a three-dimensional smart molded structure. IME technology uses mass production processes, materials, and components. IME...

The IPC-8921 standard provides and defines industry test methods and guidance for providing performance data on key characteristics and durability of woven and knitted e-textiles integrated with conductive fibers, conductive yarns and/or wires. The IPC-8921 standard also provides classifications for woven and knitted e-textiles, fibers, yarns and wires and includes 20 new terms and definitions for...

本書では、3D部品の技術を実施する際の設計/組立の課題や、課題への対処方法について述べる。ケースに収納されていない複数の半導体ダイ素子を単一パッケージのフォーマットに組み合わせる効果を考える場合、その影響は個々の部品特性にも、これまでの組立手法にも及ぶ。本規格に含まれる情報は、3D半導体パッケージの組立とプロセスに関連する最適な機能性、工程評価、最終製品の信頼性とリペアの諸問題の解決に向け焦点を当てたものである。

The IPC-7091 intends to provide useful and practical information to those who are designing, developing or using 3D-packaged semiconductor components or those who are considering 3D package implementation. The 3D semiconductor package may include multiple die elements—some homogeneous and some heterogeneous. The package may also include several discrete passive SMT devices, some of which are...

IPC-WP-024 is a white paper which discusses the issues associated with reliability of smart textiles (e-textiles structures) following multiple washing cycles and emphasizes efforts that industry and research laboratories must undertake to make e-textile structures more robust and able to be washed similarly to everyday textile products (e.g., underwear, clothing, home textiles and technical...

This white paper is a benchmarking exercise of e-textile integrations, providing an introductory categorization of how the current market sector is using textile-based electrical components to achieve integrated functionality. This peer assessment provides a baseline understanding of e-textile process techniques, requirements and resources within this emerging sector.

IPC-8921标准提供并定义了工业测试方法和指南，以提供与导电纤维、导电纱和/或导线相结合的机织和针织型电子织物的关键特性和耐久性的性能数据。 IPC-8921标准还提供了机织和针织电子纺织品、纤维、纱线和电线的经典说明，并包括20个新的电子纺织品术语和定义。

IPC-WP-024是一份白皮书，讨论了多次洗涤循环后智能织物（电子织物结构）可靠性相关的问题，并强调了工业和研究实验室必须做出的努力。以使电子织物结构更加坚固，能够像市场上的日常织物（例如，内衣、服装、家用织物和技术织物）一样被清洁或洗涤。 研究人员在商用洗衣机和家用洗衣机洗涤剂多次洗涤循环后，为电子织物提供实验室测试的初始可靠性结论。