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IPC-PCB Technology Trends 2023

IPC-PCB Technology Trends 2023

Document #:
IPC-TT
Revision
2023
Product Type
Industry Report
Released:  09/28/2023
Language
English
PCB Technology Trends 2023 is based on data from 60 respondents (26 electronics OEMs, 16 PCB fabricators, 12 EMS companies and 6 "other" industry segment participants) worldwide. PCB Technology Trends 2022 presents data on the current state of PCB fabrication and OEM's PCB requirements and their use of emerging technologies. Predictions from both industry segments indicate how these measurements...
no-image-available

IPC-TR-586 - Standard Only

Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium

Document #:
IPC-TR-586
Revision
Original Version
Product Type
Study/Technical Report
Released:  03/01/2009
Language
English
This technical report provides the documentation of a round robin testing effort that generated data used by the 4-14 Plating Processes Subcommittee in developing the maximum immersion silver plating thickness requirement in the revision A of IPC-4553. This compendium of data resulted from three information sets: a) Test vehicle assembly report by Celestica, b) Thermal cycle test report by...
no-image-available

IPC-DR-DES-2022 - Desk Reference Manual

PCB Design Desk Reference 2022 Edition

Document #:
IPC-DES
Revision
2022
Product Type
Desk Reference Manual
Released:  05/31/2022
Language
French
Ce document a été créé pour guider les concepteurs dans leur processus de définition des paramètres nécessaires pour créer les différents motifs dans leurs outils de CAD.

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Coming Soon

IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-6905: Qualification and Performance Specification for Additively Manufactured Electronics (AME)

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC/JEDEC-9702A: Monotonic Bend Characterization of Board-Level Interconnects

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards

IPC-9716A: Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies

IPC-9711: Generic Requirements for Automated Inspection Process Control

IPC-HERMES-9852 Version 1.7: The Global Standard for Machine-to-Machine Communication in SMT Assembly

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