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Products

IPC-1601 - Standard Only

印制板操作和贮存指南

Document #:
IPC-1601
Revision
Original Version
Product Type
Standard Only
Released:  08/30/2010
Language
Chinese
简要介绍 (英文) 行业内唯一一份关于印制板操作、包装和贮存的指南。本文件中的指南是为了保护印制板,避免其受到污染、物理损伤、可焊性降低和吸潮。还给出了以下需考虑的因素:包装材料类型和方法、生产环境、产品操作和运输、建立推荐的湿气水平、建立去除湿气的烘烤曲线以及烘烤对印制板可靠性的影响。 全文共18页,2010年8月正式发布英文版;2011年5月发布中文版。
no-image-available

IPC-World PCB 2016

World PCB Production Report for the Year 2016

Document #:
IPC-WPCB
Revision
2016
Product Type
Industry Report
Released:  09/12/2017
Language
English
This annual IPC report offers consensus estimates of PCB (bare board) production value by country and by product type, and commentary on global and regional PCB industry trends, developed by a team of the industry's leading analysts. It also contains historical data on regional PCB production trends. This year's report includes a special report on trends in high-speed data communications and its...
no-image-available

IPC-Benchmark Study 2017

Study of Quality Benchmarks for Electronics Assembly 2017 - Single User Download

Document #:
IPC-BMK
Revision
2017
Product Type
Industry Report
Released:  10/03/2017
Language
English
This survey-based study covers production data, assembly attributes, yields, defect rates (DPMO), test and inspection methods used, customer returns, supplier performance, customer satisfaction and certification data. Electronics assembly companies can use this report to compare their performance to industry averages. The survey sample includes 89 contract electronics manufacturers and OEMs in...
no-image-available

IPC-PCB Technology Trends 2023

IPC-PCB Technology Trends 2023

Document #:
IPC-TT
Revision
2023
Product Type
Industry Report
Released:  09/28/2023
Language
English
PCB Technology Trends 2023 is based on data from 60 respondents (26 electronics OEMs, 16 PCB fabricators, 12 EMS companies and 6 "other" industry segment participants) worldwide. PCB Technology Trends 2022 presents data on the current state of PCB fabrication and OEM's PCB requirements and their use of emerging technologies. Predictions from both industry segments indicate how these measurements...
no-image-available

IPC-TR-586 - Standard Only

Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium

Document #:
IPC-TR-586
Revision
Original Version
Product Type
Study/Technical Report
Released:  03/01/2009
Language
English
This technical report provides the documentation of a round robin testing effort that generated data used by the 4-14 Plating Processes Subcommittee in developing the maximum immersion silver plating thickness requirement in the revision A of IPC-4553. This compendium of data resulted from three information sets: a) Test vehicle assembly report by Celestica, b) Thermal cycle test report by...
no-image-available

IPC-DR-DES-2022 - Desk Reference Manual

PCB Design Desk Reference 2022 Edition

Document #:
IPC-DES
Revision
2022
Product Type
Desk Reference Manual
Released:  05/31/2022
Language
French
Ce document a été créé pour guider les concepteurs dans leur processus de définition des paramètres nécessaires pour créer les différents motifs dans leurs outils de CAD.
no-image-available

IPC-J-STD-001G-AM1-Japanese

IPC-J-STD-001G-AM1: IPC-J-STD-001G-AM1: はんだ付される電気及び電子組立品に関する要件事項 改訂1

Language
Japanese
IPC J-STD-001D改訂1は、過去25年以上にわたり大きな変更のなかった清浄度要件について改訂を行い、業界における清浄度および残留物要件の取扱いに変化をもたらす。 この改訂により、ユーザーによる指示がない限り、クラス2および3製品の製造業者は本改訂に基いた高品質のはんだ付けおよび/または洗浄プロセスを行う必要がある。この際、ROSE試験の1.56 µg/NaCl等価重量/cm2 という数値を用いることは、製造工程を認定する上での許容可能な基準とは見なさない。 この製品にはIPC-WP-019A「イオン清浄度要件における、国際的な見直しの概要」が付随する。 このホワイトペーパーは、J-STD-001G 改訂1に取組んでいる5-22A委員会のサブタスクチームによって作成された。変更の経緯について説明し、新しい要件を検討するための背景を読者に提供する。

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Coming Soon

IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-6905: Qualification and Performance Specification for Additively Manufactured Electronics (AME)

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC/JEDEC-9702A: Monotonic Bend Characterization of Board-Level Interconnects

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards

IPC-9716A: Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies

IPC-9711: Generic Requirements for Automated Inspection Process Control

IPC-HERMES-9852 Version 1.7: The Global Standard for Machine-to-Machine Communication in SMT Assembly

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