Search results

Establishes the requirements for the evaluation of liquid and dry film solder mask material and for the determination of the acceptability of use on a standard printed board system. IPC-SM-840 provides two classes of requirements, T and H, to reflect functional performance requirements and testing severity based on industry/end use requirements. Coverage is given to adhesion, material qualification...

Strain gage testing allows for objective analysis of the strain and strain rate levels to which a surface mount package may be subjected to during assembly, test and operation. Excessive strain can result in various failure modes for different solder alloys, package types, surface finishes or laminate materials. This document describes specific guidelines for strain gage testing during the printed...

This document is the product of the IPC Electrochemical Migration (ECM) Task Group. It was drafted to provide guidance regarding implementation of the User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing to evaluate the effects of mechanical stress, laminate material fracturing, ionic contamination, moisture...

The IPC-CC-830C standard establishes qualification and conformance requirements for electrical insulating compounds (conformal coatings). It has been designed and constructed with the intent of obtaining maximum confidence in the materials with minimum test redundancy. The IPC-CC-830C standard covers: • The qualification and qualification retention of the conformal coating material (Table 3-1...

This document includes lead free, no-clean, and environmental friendly chemistries. This is a collection of information on electronic board and assembly cleaning in a single location. This major revision explains the relationship between materials, processes, and contaminants in fabrication and assembly operations. It also addresses cleanliness assessment and process control in relation to...

The IPC-9701B standard establishes a thermal cycling test method to characterize the fatigue lifetimes of surface mount solder attachments of electronic assemblies. The surface mount devices may be solder-attached to rigid, flexible or rigid-flex printed boards. The characterization results can be used to predict the field lifetime of solder attachments for the use environments and conditions of...

The IPC-D-620A standard provides design and critical process requirements for cable and wire harness assemblies as well as military/space applications. IPC-D-620A is the design requirements companion to IPC/WHMA-A-620, "Requirements and Acceptance for Cable and Wire Harness Assemblies," and its associated Space Addendum. Three white papers are included to provide guidance on key topics discussed...

The IPC-7525C standard provides guidance for the design and fabrication of stencils for solder paste and surface-mount adhesive with much of the content based on the experience of stencil designers, fabricators, and users.

IPC-7526A handbook addresses understencil cleanliness during stencil printing, removal of solder paste from stencils following the cleaning process and misprint PCB board cleaning considerations.

While there are a variety of industry test vehicles for the examination of material compatibility, the IPC-B-52 test board was created to meet the needs for testing both ion chromatograph and surface insulation resistance (SIR) which would be more representative of the manufacturing materials and processes. IPC-9203A standard addresses the IPC-B-52 test vehicle, which can be used to evaluate a...

This standard provides and defines key characteristics and test methods for procuring printed electronics substrates. Includes six materials specification sheets.

The IPC-4591A standard establishes the classification system and the qualification and quality conformance requirements for functional conductive materials used in printed electronics applications. It provides companies that procure functional materials for printed electronics with the necessary technical structure to design and manufacture products meeting conformance to industry-determined...

The IPC-9202A, Material and Process Characterization/Qualification Test Protocol that records changes in Surface Insulation Resistance (SIR) on a representative sample of a printed circuit assembly (PCA). It quantifies any deleterious effects that might arise from solder flux or other process residues left on external surfaces after soldering, which can cause unwanted electro-chemical reactions...

The IPC-9709A standard guideline document establishes an Acoustic Emission (AE) method to enhance evaluation of the performance and reliability of surface mount attachments of electronic assemblies during mechanical loading.

Provides requirements for dielectric adhesives to hold components in place from the mounting to the soldering process and identifies test methods to ensure their long term properties. 9 pages. Released December 2014.

This guideline describes flexibility and stretchability testing to evaluate printable electronics for stretchable and wearable applications. 26 pages. Released March 2017

The IPC-6903A standard provides 62 additional terms and definitions for the design and manufacture of printed electronics. The IPC-6903A standard creates a common language and understanding for the worldwide printed electronics community.

IPC-T-50N document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing English as a second language could understand the subtleties of the meaning. IPC-T-50N contains over 550 new or revised terms, including new terminology for via structures, surface mount device...

This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision M contains over 220 new or revised terms, including new terminology for conformal coatings, potting and encapsulation processes, stencil design, statistical process control, and flexible printed board...

This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision K contains more than 220 new or revised terms, including new terminology for thermal properties, etchback, assembly processing, hole drilling, and microvia technology. Also includes commonly used industry...

This essential industry standard provides descriptions and illustrations of electronics interconnect industry terminology to help users and their customers break down language barriers. Revision J contains nearly 400 new or revised terms, including new terminology for chip scale and area array packaging, cable and wire harness technology, assembly processing, moisture sensitive components, and...

The IPC-DRM-WHA-E desk reference manual contains illustration/images of wire harness assemblies for IPC/WHMA-A-620E standard. IPC-QRG-WHA-E explains the basic acceptance criteria for wire harness assemblers, crimp operators, and QA personnel. The IPC-QRG-WHA-E is handy reference and training tool but does not replace the criteria found in IPC/WHMA-A-620E. IPC-QRG-WHA-E covers: wire types, gauges...

Contains over 150 industry approved test techniques and procedures for chemical, mechanical, electrical, and environmental tests on all forms of printed boards and connectors. New and updated test methods are available for download at https://www.ipc.org/test-methods.

The IPC-DRM-WHA-D desk reference manual contains illustration/images of wire harness assemblies for IPC/WHMA-A-620D standard. IPC-QRG-WHA-D explains the basic acceptance criteria for wire harness assemblers, crimp operators, and QA personnel. The IPC-QRG-WHA-D is handy reference and training tool but does not replace the criteria found in IPC/WHMA-A-620D. IPC-QRG-WHA -Dcovers: wire types, gauges...

IPC-8401 standard provides guidelines for In-Mold Electronics (IME) manufacturing processes, part structures, candidate materials, and production test methods. In-Mold Electronics integrates printed electronics and electrical components into injection molded plastics, creating a three-dimensional smart molded structure. IME technology uses mass production processes, materials, and components. IME...

Every electronics manufacturer, whether an original equipment manufacturer (OEM) or electronics manufacturing services (EMS) company, must determine if the unpopulated printed boards entering the assembly process have an adequate level of cleanliness. The question of “how clean is clean enough?” is one that has no definitive answer, as there is no "golden number" for board cleanliness. The issue...

Tackling PCB cleanliness is a tough job; residues on printed circuit boards are directly related to the reliability of the produced hardware and can result in serious failures if not known or monitored. But how do you measure "cleanliness"? How clean is "clean"? The IPC-5701 provides guidance into how these issues should be approached and specified in purchasing documents, addressing levels of...

This standard is intended as a guideline in the proper preparation of a metallographic sample (microsection) of a printed board. The finished microsection is used for evaluating the quality of the laminate system and plated structures (e.g. PTHs and vias). Microsection sample preparation is regarded by many as a highly developed skill. The guidelines in this standard discuss the many variables and...

The IPC-9505 standard provides details of test methodologies for cleaning chemistry compatibility with electronic assembly materials that replace those in MIL-STD-202 Method 215 for testing electronic and electrical components such as capacitors, resistors, transformers and inductors. The test methods can also be used, when applicable, to parts not covererd by military specifications or drawings

Establishes the requirements for the evaluation of liquid and dry film solder mask material and for the determination of the acceptability of use on a standard printed board system. IPC-SM-840 provides two classes of requirements, T and H, to reflect functional performance requirements and testing severity based on industry/end use requirements. Coverage is given to adhesion, material qualification...

Provides information on design characteristics and the application of solderless surface mount connectors, including conductive adhesives to aid IC package and board interconnection. 34 pages. Released January 1994.

Mechanical bend and shock tests are routinely performed on SMT assemblies to ensure that they can sustain anticipated production, handling and end use conditions. The strains and strain rates applied to SMT assemblies during bend and shock testing can lead to a variety of failure modes in the vicinity of the solder joints. This document provides test methods to evaluate the susceptibility of...

Survey-based study presents data and analysis on the EMS industry, examining trends in sources of revenue, revenue per employee, services offered, markets served, manufacturing technology, capital investment, spending on equipment and materials and market size including forecasts and potential for market expansion. This study is based on data provided by a representative sample of 120 EMS...

The IPC/JEDEC-9301document is an effort to standardize and document some of the basic tenets of a typical Finite Element Analysis (FEA) model, as well as, to educate new designers (and in some cases even experienced designers) on the basic information and best practices that should be captured and provided to technical reviewers of the results of FEA data.

This publication is intended to characterize the frature strength of a component's board level-interconnect by providing a common method of establishing the fracture resistance to flexural loading that may occur during conventional non-cyclic board assembly and test operations. The document is applicable to surface mount components attached to printed wiring boards using conventional solder reflow...

IPC-8701 presents acceptance guidelines for the solar panel in final module assembly. The intent of this standard is to cover crystalline solar modules.Some of the content may be applicable to other photovoltaic modules such as thin film. The standard reviews and includes acceptance guidelines for incoming and finished frames, frame assembly, sealant, tape, junction box assembly, and bus bar...

This standard establishes a Market Classification System and Level Classification System for printed electronics assemblies and provides a list of performance criteria and testing methods. It provides a standardized product category structure for designing and manufacturing printed electronics and assemblies which conform to industry-established performance metrics as determined by accepted...

This standard provides industry-approved terms and definitions to create a common language for users and suppliers to develop electronics products that utilize printed electronics alone or as additive processes combined with traditional rigid, flexible and rigid-flex PWB assemblies Released October 2015.

This handbook is a compilation of the conformal coating industry's practical experience, and will assist the designers and users of conformal coatings in making informed choices. Users will better understand the properties of the various conformal coatings, the results to be achieved by its application and how to verify that these goals have been met. Use this document as a supplement in...

The IPC-WP-019B white paper was created to support the IPC-J-STD-001H standard and provides additional guidance, examples, and understanding of Section 8.0 Cleaning and Residue Requirements. The IPC-WP-019B has information on how to meet the requirements of IPC-J-STD-001H chapter 8. Recommentded for those looking to implement the requirements of IPC-J-STD-001H standard, chapter 8. 0..

The IPC-WP-114A white paper provides guidance to reduce and control exposure to environmental conditions and contamination that promote the development of White Plague. A template for developing a White Plague Control Plan (WPCP) is included.

The IPC-WP-113A white paper provides guidance to reduce and control exposure to environmental conditions and contamination that promote the development of Red Plague. A template for developing a Red Plague Control Plan (RPCP) is included.

The IPC-WP-116A white paper provides guidance to control and mitigate risks associated with the introduction of Foreign Object Debris (FOD) in electrical and electronic assemblies. Guidance to control and mitigate risks associated with the introduction of Foreign Object Debris (FOD) in electrical and electronic assemblies is provided. A template for developing a Foreign Object Debris (FOD) Control...

IPC-T-50N-CN文件旨在为电子行业中常用的词汇和术语提供其定义。本文件所规定的定义充分详细地阐明了术语，以便以英语为第二语言的读者能够理解含义的细微之处。IPC-T-50N-CN包含550多个新的或修订的术语，包括通孔结构、表面贴装器件类型、焊料凸点、焊料合金、焊接、退润湿、电路板制造工艺和测试的新术语。

This is the industry standard for qualification and quality conformance of conformal coating. Its intent is to show how to obtain maximum information with minimum test redundancy. Includes requirements and evaluations of material properties using standardized test vehicles. Amendment 1 updates include new qualification, retention and conformance inspection requirements for FTIR, MIR and hydrolytic...

Provides specific test methods to evaluate the performance and reliability of surface mount solder attachments of electronic assemblies. Establishes levels of performance and reliability of the solder attachments of surface mount devices to rigid, flexible and rigid-flex circuit structures. When used with IPC-SM-785, it provides an understanding of the physics of SMT solder joint failure and an...

This document provides guidelines for the design and fabrication of stencils for solder paste and surface mount adhesive with discussion on through-hole and mixed technology. This includes differences for tin lead and lead-free solder paste, overprint, two-print and step stencil designs. A sample order form and user inspection checklist are also included.

The IPC-D-620A standard provides design and critical process requirements for cable and wire harness assemblies as well as military/space applications. IPC-D-620A is the design requirements companion to IPC/WHMA-A-620, "Requirements and Acceptance for Cable and Wire Harness Assemblies," and its associated Space Addendum. Three white papers are included to provide guidance on key topics discussed...

Das unentbehrliche Nachschlagewerk für alle Verantwortlichen entlang der Wertschöpfungskette von elektronischen Produkten. Die Revision K enthält auf mehr als 120 Seiten, mehr als 220 neue und überarbeitete Begriffe und bildliche Darstellungen. Beispiele: Access Hole, Accelerated Equivalent Soak, Capture Land, Micro Via Technology, Plating Thief, Etchback, Resin Recession, Tape Automated Bonding...

IPC-4105 is a new document that covers the requirements for metal-base materials that are referred to as metal-based laminate listed in the specification sheets that are contained in the last of the main body. These are to be used primarily for rigid and multilayer printed boards for electronic interconnections.