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Products

IPC-6018 - Revision C - Standard Only

Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

Document #:
IPC-6018
Revision
C
Product Type
Standard Only
Released:  08/09/2016
Language
English
This specification covers qualification and performance of high frequency (microwave) boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as...

IPC-7351 - Revision A - Standard Only

SUPERSEDED BY 7351B

Document #:
IPC-7351
Revision
A
Product Type
Standard Only
Released:  02/01/2007
Language
English
NEW! IPC-7351A includes both the standard and an IPC-7351A land pattern calculator on CD-ROM for accessing component and land pattern dimensional data.The calculator includes the document’s mathematical algorithms so users can build a land pattern for a corresponding surface mount part quickly and accurately.The tool also allows for modification of dimensional attributes of IPC-approved land...

IPC-4412 - Revision B - Standard Only

Specification for Finished Fabric Woven from "E" Glass for Printed Boards

Document #:
IPC-4412
Revision
B
Product Type
Standard Only
Released:  06/17/2013
Language
English
IPC-4412B exhaustively covers the classification and requirements for finished fabrics that are formed by plain woven glass fiber yarns. Simply, these yarns are appropriately sized bundles of continuous filament, electrical-grade ("E" glass) borosilicate glass. Bulk "E" glass, for ease of description, is composed of a blend of raw metal oxides that form a borosilicate glass upon melting. Once...

IPC-4204 - Revision A - Standard with Amendment 1

Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

Document #:
IPC-4204
Revision
A
Product Type
Standard with amendment(s)
Released:  02/22/2014
Language
English
This standard establishes the classification system, the qualification and quality performance requirements for flexible metal-clad dielectric materials to be used for the fabrication of flexible printed circuitry and flexible flat cable. It encompasses 12 specification sheets that result from the combinations of various copper foil claddings; a polymer base dielectric selected from at least two...

IPC-6013 - Revision C - Standard Only

Qualification and Performance Specification for Flexible Printed Boards

Document #:
IPC-6013
Revision
C
Product Type
Standard Only
Released:  12/18/2013
Language
English
Covers qualification and performance requirements for flexible printed boards designed to IPC-2221 and IPC-2223. The flexible printed board may be single-sided, double-sided, multilayer or rigid-flex multilayer. All of these constructions may include stiffeners, PTHs, microvias, and blind/buried vias. Revision C incorporates new and updated requirements for final finishes, surface and hole plating...
no-image-available

IPC-2581 - Revision B - Standard Only

Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

Document #:
IPC-2581
Revision
B
Product Type
Standard Only
Released:  09/01/2013
Language
English
This standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements. This format may be used for transmitting information between a printed board designer and a manufacturing or assembly facility. The data is most useful...

IPC-4202 - Revision A - Standard Only

Flexible Base Dielectrics for Use in Flexible Printed Circuitry

Document #:
IPC-4202
Revision
A
Product Type
Standard Only
Released:  04/13/2010
Language
English
This document provides comprehensive data to help users more easily determine both material capability and compatibility for flexible base dielectric materials for manufacture of flexible printed circuitry and flexible flat cables. It includes flexible base material specification sheets that have been updated with the newest properties for the specification material types. It establishes the most...
no-image-available

IPC-4101 - Revision C - Standard Only

Specification for Base Materials for Rigid and Multilayer Printed Boards

Document #:
IPC-4101
Revision
C
Product Type
Standard Only
Released:  08/26/2009
Language
English
This specification covers the requirements for base materials that are referred to as laminate or prepreg. These are to be used primarily for rigid and multilayer printed boards for electrical and electronic circuits. This document contains 66 individual specification sheets that can be searched using key words. These key words allow the document's user to find materials of a similar nature, but...
no-image-available

IPC-1602 - Revision A - Redline Standard

Redline Comparison IPC-1602 to IPC-1602A

Document #:
IPC-1602
Revision
A
Product Type
Redline Standard
Released:  04/23/2025
Language
English
Current Revision
IPC-1602A Redline document shows the changes from IPC-1602 to IPC-1602A in a side-by-side comparison of the two documents. This is only available in digital format.
no-image-available

IPC-2221 - Revision A - Standard Only

Generic Standard on Printed Board Design

Document #:
IPC-2221
Revision
A
Product Type
Standard Only
Released:  05/01/2003
Language
English
UPDATED!IPC-2221A is the foundation design standard for all documents in the IPC-2220 series. It establishes the generic requirements for the design of printed boards and other forms of component mounting or interconnecting structures, whether single-sided, double-sided or multilayer. Among the many updates to Revision A are new criteria for surface plating, internal and external foil thicknesses...

IPC-4203 - Revision A - Standard Only

Cover and Bonding Material for Flexible Printed Circuitry

Document #:
IPC-4203
Revision
A
Product Type
Standard Only
Released:  01/25/2013
Language
English
This standard establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides. These materials are to be used as cover material for flexible printed circuitry as well as supported or unsupported adhesive films to be used in the fabrication of flexible printed circuitry. The standard does not address...

IPC-4202 - Revision B - Standard Only

Flexible Base Dielectrics for Use in Flexible Printed Boards

Document #:
IPC-4202
Revision
B
Product Type
Standard Only
Released:  04/20/2017
Language
English
This document provides comprehensive data to help users more easily determine both material capability and compatibility for flexible base dielectric materials for manufacture of flexible printed boards. It includes flexible base material specification sheets that have been updated with the newest properties for the specification material types. It establishes the most current classification...

IPC-1752 - Revision A - Standard with Amendments 1 & 2

Materials Declaration Management

Document #:
IPC-1752
Revision
A
Product Type
Standard with amendment(s)
Released:  03/14/2014
Language
English
IPC-1752A establishes a standard reporting format for material declaration data exchange between supply chain participants and supports reporting of bulk materials, components, printed boards, sub-assemblies, and products. This standard is not supported directly by a PDF form. Third party software developers are invited to supply the implementation tool, and one organization has already made a...
no-image-available

IPC-A-600 - Revision M - Standard Only

印製板的可接受性

Document #:
IPC-A-600
Revision
M
Product Type
Standard Only
Released:  11/25/2025
Language
Chinese (Zhōngwén)
Current Revision
關於印製板可接受性的權威圖解指南!本四色檔提供了裸印製板內部或外部可觀察到的目標、可接受和不符合條件的照片和示意圖。確保您的操作人員、檢驗員和工程師掌握最新的行業共識資訊。版本M新增或修訂了數十張照片和示意圖,新增和擴展了有關印製板邊緣電鍍、印製板階梯槽、邊緣毛刺、退潤濕、導體厚度、環寬(重合度)、內部銅滲透和鍍層空洞等主題的內容。本檔與 IPC-6012F 和 IPC-6013E 中表述的可接受性要求同步。取代 IPC-A-600K。
no-image-available

IPC/JEDEC-J-STD-609 - Revision A - Standard Only

IPC/JEDEC J-STD-609A Errata Information

Document #:
IPC/JEDEC-J-STD-609
Revision
A
Product Type
Standard Only
Released:  06/01/2012
Language
English
This is a list of reported errata to the printed copies of IPC/JEDEC J-STD-609A. Pen and ink changes should be made in accordance with your company's document control policies.
no-image-available

IPC-A-610 - Revision J - Standard Only

Acceptabilité des Assemblages Électroniques

Document #:
IPC-A-610
Revision
J
Product Type
Standard Only
Released:  01/05/2026
Language
French
Current Revision
La norme IPC-A-610J est la norme d'acceptation des assemblages électroniques la plus largement utilisée dans l'industrie électronique. Des participants de 31 pays ont apporté leur contribution et leur expertise à l'élaboration de ce document destiné à l'industrie électronique. Cet ouvrage est indispensable aux inspecteurs, aux opérateurs et à toute personne intéressée par les critères d...
no-image-available

IPC-A-610 - Revision J - Standard Only

Aceptabilidad de Ensambles Electrónicos

Document #:
IPC-A-610
Revision
J
Product Type
Standard Only
Released:  01/08/2026
Language
Spanish
Current Revision
La norma IPC-A-610J es la norma de aceptación de ensambles electrónicos más utilizada en la industria electrónica. Participantes de 31 países aportaron su experiencia al desarrollo de este documento para la industria electrónica. Esta publicación es esencial para inspectores, operadores y cualquier persona interesada en los criterios de aceptación de ensambles electrónicos. La norma IPC-A-610 se...
IPC-A610H Spanish Cover Image

IPC-A-610 - Revision H - Standard Only

Aceptabilidad de Ensambles Electrónicos

Document #:
IPC-A-610
Revision
H
Product Type
Standard Only
Released:  08/11/2021
Language
Spanish
Current Revision
IPC-A-610H es la norma de aceptación de ensambles electrónicos más utilizada en la industria electrónica. La norma IPC-A-610H incluye una actualización general del documento, introduce varios nuevos tipos de componentes de montaje en superficie y elimina las condiciones ideales. Participantes de 29 países proporcionaron su apoyo y conocimientos especializados para traer este documento a la...
no-image-available

IPC-J-STD-001 - Revision H - Standard Only

Requisitos para Ensambles Eléctricos y Electrónicos Soldados

Document #:
IPC-J-STD-001
Revision
H
Product Type
Standard Only
Released:  05/13/2021
Language
Spanish
Current Revision
IPC-J-STD-001H es reconocido mundialmente por sus criterios sobre procesos y materiales de soldadura. Actualizado con participantes de 27 países que proporcionan información y experiencia, la norma IPC-J-STD-001H trae los últimos criterios a la industria, incluyendo pautas sobre el uso de rayos X para inspeccionar condiciones de soldadura en orificios con soporte que no son visibles bajo ningún...
no-image-available

IPC-A-610 - Revision J - Standard Only

Tiêu Chuẩn Chấp Nhận Các Cụm Lắp Ráp Điện Tử

Document #:
IPC-A-610
Revision
J
Product Type
Standard Only
Released:  04/29/2025
Language
Vietnamese
Current Revision
IPC-A-610J là tiêu chuẩn chấp nhận các cụm lắp ráp điện tử được sử dụng rộng rãi nhất trong ngành công nghiệp điện tử. Những đơn vị tham gia từ 31 quốc gia đã cung cấp thông tin đầu vào cùng chuyên môn của họ để đưa tài liệu này đến với ngành công nghiệp điện tử. Đây là tài liệu bắt buộc phải có đối với những người kiểm hàng, người thao tác và những người khác quan tâm đến tiêu chuẩn chấp nhận đối...
no-image-available

IPC-J-STD-001 - Revision J - Standard Only

Các Yêu Cầu đối với Các Cụm Lắp Ráp Điện và Điện Tử Được Hàn

Document #:
IPC-J-STD-001
Revision
J
Product Type
Standard Only
Released:  04/10/2025
Language
Vietnamese
Current Revision
J-STD-001J được công nhận trên toàn cầu về các tiêu chuẩn liên quan đến vật liệu và quy trình hàn . Được cập nhật với sự tham gia của các thành viên từ 27 quốc gia cung cấp thông tin đầu vào và chuyên môn. J-STD-001J là tài liệu bắt buộc dành cho những người trong ngành điện tử quan tâm đến quy trình và tiêu chuẩn chấp nhận đối với các cụm lắp ráp điện và điện tử. J-STD-001 được phát triển kết hợp...
IPC-A-610H Danish Cover

IPC-A-610 - Revision H - Standard Only

Godkendelseskrav for elektronikprodukter

Document #:
IPC-A-610
Revision
H
Product Type
Standard Only
Released:  07/27/2021
Language
Danish
Current Revision
IPC-A-610H er den mest udbredte godkendelsesstandard for elektronikprodukter i elektronikindustrien. IPC-A-610H standarden inkluderer en generel opdatering af dokumentet, introducere flere nye overflademonterede komponenttyper og fjerner ”Ønskelig” tilstand. Deltagere fra 29 lande leverede deres input og ekspertise til at bringe dette dokument til elektronikindustrien. Dette er en ”skal have”...
no-image-available

IPC-A-610 - Revision J - Standard Only

电子组件的可接受性

Document #:
IPC-A-610
Revision
J
Product Type
Standard Only
Released:  10/25/2024
Language
Chinese
Current Revision
IPC-A-610J 是电子行业应用最广泛的电子组件验收标准。来自31个国家的参与者提供了他们的意见和专业知识,为电子行业带来了这份文件。 这是检查人员、操作人员和其他对电子组件验收标准感兴趣的人员的必备工具。IPC-A-610 是与 J-STD-001 和 IPC/WHMA-A-620 协同开发的。
no-image-available

IPC-A-610 - Revision J - Standard Only

電子組立品の許容基準

Document #:
IPC-A-610
Revision
J
Product Type
Standard Only
Released:  12/17/2024
Language
Japanese
Current Revision
IPC-A-610Jは、エレクトロニクス業界で最も広く使用されている電子組立品の許容基準である。本書をエレクトロニクス業界に提供するにあたり、今回は31もの国々から参加者が集い、情報や専門知識が示された。 本書は検査担当者やオペレータはもとより、電子組立品の許容基準に関心のあるの人々にとって必携の書といえる。IPC-A-610は、J-STD-001およびIPC/WHMA-A-620と共に作成されたものである。
IPC-A-610H RO Cover Image

IPC-A-610 - Revision H - Standard Only

Acceptabilitatea Ansamblurilor Electronice

Document #:
IPC-A-610
Revision
H
Product Type
Standard Only
Released:  04/12/2022
Language
Romanian
Current Revision
IPC-A-610H este cel mai folosit standard de acceptabilitate pentru asamblare electronice din industria electronică. Standardul IPC-A-610H include o actualizare generală a documentului, introduce mai multe tipuri noi de componente cu montare pe suprafață și elimină condițiile Obiectiv. Participanții din 29 de țări și-au adus contribuția și expertiza lor pentru a da acest document industriei...

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Coming Soon

IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-6905: Qualification and Performance Specification for Additively Manufactured Electronics (AME)

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC/JEDEC-9702A: Monotonic Bend Characterization of Board-Level Interconnects

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards

IPC-9716A: Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies

IPC-9711: Generic Requirements for Automated Inspection Process Control

IPC-HERMES-9852 Version 1.7: The Global Standard for Machine-to-Machine Communication in SMT Assembly

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