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This Telecom Addendum to IPC-A-610F Acceptability of Electronic Assemblies provides specific requirements for telecommunications products when it is specifically required by procurement documentation. Information in this document either supplements or replaces specifically identified requirements of IPC-A-610 Revision F by providing additional requirements to ensure that electrical and electronic...

Bu döküman; kaplı delikiçine sahip olan veya olmayan tek yüzlü, çift yüzlü baskı devre kartları ve kör/gömülü geçiş deliklerine sahip olan veya olmayan çok katmanlı baskı devre kartları ile metal çekirdekli kartları içeren sert baskı devre kartlarının kalifikasyonunu ve performansını kapsamaktadır. Son kaplama ve yüzey kaplama gereklilikleri, iletkenler, delikler/geçiş delikleri, kabul testlerinin...

This space applications addendum was for the previous Revision D of J-STD-001, February 2005. J-STD-001DS can only be used with J-STD-001D and J-STD-001ES can only be used with J-STD-001E.

Telecom Addendum to IPC-A-610D Acceptability of Electronic Assemblies Telecom Addendum Published August 2009. When specifically required by procurement documentation, this Addendum supplements or replaces specifically identified requirements of IPC-A-610, Revision D of February 2005 by providing additional requirements to ensure compliance to GR-78-CORE.

The IPC-QRG-PTH-H desk reference manual contains illustration/images of through-hole solder connections for IPC-A-610H standard. As a convenient manual but not a replacement for IPC-A-610H standard, the IPC-QRG-PTH-H is an additional tool to help operators and inspectors when evaluating the three classes of product for solder joint acceptance. The IPC-QRG-PTH-H is a useful training aid as well. It...

Ergänzung 1 zu IPC-7711/21C-DE, das Dokument enthält Verfahren für das Entfernen und Montieren von D-Pak-Komponenten.

Enmienda 1 al IPC-7711/21C, el documento proporciona los procedimientos para la extracción y la instalación de componentes D-Pak.

IPC-7711/21C的修订本1，本文件提供D-Pak元器件的去除和安装程序.

Amendement 1 à IPC-7711 / 21C fournit des procédures supplémentaires de retrait et d'installation

IPC/WHMA-A-620C-S provides additional requirements to IPC/WHMA-A-620C to ensure the reliability of cable and wire harness assemblies that must survive the vibration and thermal cyclic environments getting to and operating in space. The IPC/WHMA-A-620C-S space addendum cannot be used as a stand alone document, it must be used with the base standard IPC/WHMA-A-620C.

When specifically required by procurement documentation, this Addendum supplements or replaces specifically identified requirements of IPC/WHMA-A-620, Revision B, providing additional requirements to ensure the reliability of cable and wire harness assemblies that must survive the vibration and thermal cyclic environments getting to and operating in space. The required IPC training & certification...

IPC/WHMA-A-620AS with Amendment 1 Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A Requirements and Acceptance for Cable and Wire Harness Assemblies. When specifically required by procurement documentation, this Addendum supplements or replaces specifically identified requirements of IPC/WHMA-A-620, Revision A of July 2006 by providing additional requirements to ensure the...

This Addendum supplements or replaces specifically identified requirements of IPC-6018C, for high frequency (microwave) printed boards that must survive the vibration, ground testing and thermal cyclic environments of space and military avionics.

The IPC-QRG-SMT-H desk reference manual contains illustration/images of surface mount solder connections for IPC-A-610H standard. As a convenient manual but not a replacement for IPC-A-610H standard, the IPC-QRG-SMT-H is an additional tool to help operators and inspectors when evaluating the three classes of product for solder joint acceptance. Useful as a training aid but not a replacement for...

IPC-DR-DES-2022 document is intended to guide PCB designers in the use of IPC PCB Design standards as they define processes and parameters for use in CAD tools. The IPC-DR-DES-2022 is an excellent hands on desk reference manual for use by every designer.

This technical paper covers the testing and evaluation of polymeric conformal coatings for moisture and insulation resistance (MIR) and dielectric withstanding voltage (DWV). This effort was initiated by the IPC Conformal Coating Task Group to support technical decisions for IPC coating specification CC-830 as part of the Revision C process. MIR testing was done per a modified method of IPC-TM-650...

In answer to numerous industry requests for guidance on electroless nickel/immersion gold (ENIG), IPC-4552 was developed. Containing full color photographs, this specification sets the requirements for the use of ENIG as a surface finish for printed boards. It includes requirements for ENIG deposit thicknesses based on performance criteria. It is an invaluable resource for use by suppliers, board...

*** Discount Price at 20 copies per order, or greater... $28/each (Member); $35/each (Nonmember). Price will be reduced automatically when ordering.*** A learning resource for new hires, operators, sales, purchasing, human resources, administrative personnel, students or anyone interested in understanding the basic processes for both Through-Hole and Surface Mount Assembly. This 32-page, full...

IPC J-STD-001JA/IPC-A-610JAは、J-STD-001JおよびIPC-A-610Jの車載用途向け追加規格である。本書は、自動化された大量生産という条件を考慮しながら、過酷な環境下にある車載用電気・電子組立品について、そのはんだ付け信頼性を保証するための基準を提供するものである。 IPC J-STD-001JA/IPC-A-610JA(Addendum：追加規格)は独立した文書として使用するのではなく、J-STD-001JおよびIPC-A-610Jと併用する必要がある。

The IPC-1602 standard provides requirements intended to protect printed boards from contamination, physical damage, solderability degradation and moisture uptake. Consideration is given to packaging materials types and methods, production environment, handling and transport of product, and establishing baking profiles for moisture removal. IPC-1602 is now providing requirements that can be called...

A discussion was held in the 5-33AWG (ad hoc working group), on things that conformal coat professionals (materials and processes) wish designers knew about conformal coating. The 5-33AWG group is comprised of individuals from OEMs, coating suppliers, and test lab personnel.

This standard is the companion document to IPC-A-630. IPC-HDBK-630 is an in-depth guideline to the design, manufacture, inspection and testing of the high level assembly, or "box" that encloses electronics assemblies. This document was written to help designers, manufacturers and end users of electronic enclosures of electrical and electronic equipment understand the industry's best practices to...

This handbook is a companion to the solder paste standard J-STD-005 and should be considered to be a guide to help assess the applicability of a solder paste for its use in surface mount technology (SMT) processes. This document also suggests some test methods that can help with designing and testing solder pastes. It is intended for use by both vendors and users of solder paste. This document has...

This document describes materials that can be used for the fabrication of embedded passive capacitor devices within the finished printed circuit board substrate. For this document, embedded passive devices and the phrase embedded passives are considered to be equivalent. It provides information on general designations and associated characteristics of embedded passive device (EPD) capacitor...

This guideline provides an overview of the design process flow for printed electronics based devices, modules and units, and final products.The intent of IPC/JPCA-2291 is to establish a design process flow that will facilitate and improve the practice of printed electronics design. IPC/JPCA-2291 identifies documents such as standards that can be used to assist during the design process flow. 24...

IPC-HDBK-620 is a companion reference to IPC-D-620 ‘‘Design and Critical Process Requirements for Cable and Wiring Harnesses’’ and IPC/WHMA-A-620 ‘‘Requirements and Acceptance for Cable and Wire Harness Assemblies” and provides supporting information and technical rationale for requirements in those standards. This guidance document is highly recommended for anyone who wants to learn the “how” and...

Free Review Updated to Revision G of the latest IPC-A-610 industry standard for the Acceptability of Electronic Assemblies, this Training & Reference Guide illustrates critical acceptance criteria for the evaluation of surface mount solder connections. At only 44 pages and a compact 5.5 x 8.5 inch (14 x 21.5 cm) size, these convenient spiral-bound manuals make it easy for your inspectors and...

IPC-1754 WAM 1 Materials and Substances Declaration for Aerospace and Defense and Other Industries establishes the requirements for exchanging material and substance data for products between suppliers and their customers for Aerospace and Defense, Heavy Equipment and other industries. This standard covers the process for exchanging data on chemical substances (“Substances”) that may be present in...

This standard establishes the requirements for timely customer notification of changes to electronic products and associated processes.

“IPC J-STD-001JS 宇宙・軍事用途向け追加規格”は、IPC J-STD-001Jの要求事項のうち特定の要件を補完する/置き換えるものであり、宇宙および軍事用途において、輸送時や運用時の振動/熱サイクル環境に耐えることが求められる電気・電子組立品を対象としている。

Die Richtlinie IPC J-STD-001HS-DE Ergänzung für Raumfahrt-Anwendungen ergänzt oder ersetzt spezifisch identifizierte Anforderungen von IPC J-STD-001H-DE für gelötete elektrische und elektronische Baugruppen, die Schwingungen und die Umgebungsbedingungen thermischer Zyklen von Raumfahrt und militärischen Anwendungen überstehen müssen.

Lead-free electronics continues to be a concern of the aerospace, defense, and high performance products (ADHP) industries. This is primarily due to the lack of data and knowledge to: thoroughly categorize performance under harsh service conditions and provide a level of confidence in reliability assessments of Pb-free electronics equal to those for traditional tin-lead electronics. To help close...

IPC-WP-028 white paper provides guidance on obtaining objective evidence for validating the acceptability of bubbles in conformal coatings. It focuses on a failure mode where bubbles in coatings could activate a microclimate involving condensation of humidity inside the bubbles resulting in an increase of the local humidity load to a critical level, thus generating electrochemical migration...

This is a three-page list of common terms and definitions use when discussing solder reflow processes and equipment.

This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. The goal of this notification standard is to better enable customers to manage and mitigate the disruption caused by the discontinuation of a product and to ensure continuity of supply. This standard establishes the requirements for timely customer notification of planned...

IPC J-STD-001JS 航太和軍事補充標準補充或取代了 IPC J-STD-001J 中針對焊接電氣和電子元件的特定要求，這些元件必須能在航太和軍事應用振動與熱迴圈環境下運行。

IPC-2591, CFX standard establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. IPC-2591, CFX standard applies to communication between all executable processes in the manufacture of printed board assemblies, automated, semiautomated and manual, and is applicable to related mechanical...

This standard on spherical transient bend testing is intended to characterize the maximum allowable strain that a surface mount component's board level interconnects can withstand in flexural loading. Whereas four-point monotonic bend test methods only address simple planar bending, spherical bend tests establish strain limits of board level interconnects under worst-case flexure conditions that...

IPC-4554, Specification for Immersion Tin Plating for Printed Circuit Boards, is included in the IPC-455X series of specifications that set the requirements for printed board surface finishes that are alternates to non-coplanar finishes, most often referred to as tin-lead HASL finish. This specification is a full-color document that is intended for use by the supplier or printed board fabricator...

This is a seven-page list of electronics cleaning terms and definitions as they relate to printed circuit assembly cleaning.

This is a four-page list of common terms and definitions use when discussing screen printing processes and equipment.

This SMEMA standard is for fiducial marks. It was developed to facilitate the accurate placement of components on printed circuit boards.

IPC-HDBK-840 supplements the solder mask requirements established in IPC specifications such as IPC-SM-840 and IPC-6012 by providing detailed information on solder mask types, application processes, pre- and post- assembly processes, characteristics and properties that are useful in the selection and use of the most appropriate mask type for a given application. Applicable to solder mask...

001H-DE und IPC-A-610H-DE enthält Kriterien zur Sicherstellung der Zuverlässigkeit gelöteter elektrischer und elektronischer Automotive-Baugruppen im Feld unter rauen Umgebungsbedingungen und berücksichtigt die Bedingungen einer automatisierten Großserienproduktion. Die Ergänzung IPC J-STD-001HA-DE/IPC-A-610HA-DE ist kein eigenständiges Dokument. Diese Ergänzung fordert, dass sie in Verbindung mit...

IPC-2591, Version 1.6 establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. IPC-2591, Version 1.6 applies to communication between all executable processes in the manufacture of printed board assemblies, automated, semiautomated and manual, and is applicable to related mechanical assembly...

The IPC-HERMES-9852 is an open industry standard, developed by the Hermes Standard Initiative and approved by IPC. The IPC-HERMES-9852 provides a state-of-the-art communication protocol for machine-to-machine communication for surface-mount technology. Specifically, IPC-HERMES-9852, version 1.5 provides additional alignment with IPC-2591 (IPC-CFX). Used with IPC-2591, Connected Factory Exchange...

The IPC-4592 standard establishes the classification system, the qualification and quality conformance requirements for functional dielectric materials used in printed electronics applications. The intended applications include but are not limited to dielectric materials as protective dielectric or insulator/insulation layer(s), capacitive layer(s), crossovers and encapsulant(s) for devices in...

This specification sets the requirements for the use of electroless nickel/electroless palladium/immersion gold (ENEPIG) as a surface finish for printed boards. It establishes requirements for ENEPIG deposit thicknesses for applications including soldering, wire bonding and as a contact finish. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing...

The IPC-Hermes-9552 v. 1.4 is an open industry standard, developed by The Hermes Initiative and approved by IPC. The IPC-Hermes-9542 provide a state-of-the-art communication protocol for machine-to-machine communication for surface-mount technology (SMT). Specifically, IPC-HERMES-9852, version 1.4 provides additional alignment with IPC-2591 (IPC-CFX). Used with IPC-2591, Connected Factory Exchange...