Amendment 1 to IPC-7711/21C, the document provides procedures for removal and installation of D-Pak components
Products
This amendment provides resolution to some internal conflicts, aligns common criteria to other IPC standards, and corrects some editorial errors. This amendment is only to be used in conjunction with IPC/WHMA-A-620 Revision B, October 2012. Follow your company policy and procedures to make pen and ink changes or notations to the published IPC/WHMA-A-620 Revision B. When there are changes to a...
Ergänzung 1 zu IPC-7711/21C-DE, das Dokument enthält Verfahren für das Entfernen und Montieren von D-Pak-Komponenten.
Enmienda 1 al IPC-7711/21C, el documento proporciona los procedimientos para la extracción y la instalación de componentes D-Pak.
IPC-7711/21C的修订本1，本文件提供D-Pak元器件的去除和安装程序.
Amendement 1 à IPC-7711 / 21C fournit des procédures supplémentaires de retrait et d'installation
The amendment 2 to IPC-9121 provides new troubleshooting topics on hole quality, laser drilling, microvias, drill smear, electroless nickel, organic solderability preservative (OSP) and rigid-flex boards.
IPC-9121 AM1 is an amendment to IPC-9121 which provides updates to the Hole Preparation/Protection and Interconnect Formation sections, covering troubleshooting topics and guidance on nonconductive plugging paste, microvias and pattern plating rim voids. IPC-9121 AM1 also includes a new section on Flexible Circuits.
The IPC-1791-Am1 provides revisions and clarifications for requirements pertaining to CAGE Code, citizenship, security, foreign person access, traceability records and NIST SP 800-171 compliance.
本手册可供任何生产制造或采购印制板的人员作为基本资源。数百张真实的全彩色照片聚焦了650多个印刷电路板工艺缺陷，每个缺陷都有其分析原因和纠正措施。IPC-9121是取代1997年12月发布 的IPC-PE-740A中的PCB部分。2016年3月发布9121英文母标准，2018年年4月发布修订本1，修订本1于2020年4月翻译。详情参见目录。
Amendment 1 to IPC/WHMA-A-620B This amendment provides resolution to some internal conflicts, aligns common criteria to other IPC standards, and corrects some editorial errors. This amendment is only to be used in conjunction with IPC/WHMA-A-620 Revision B, October 2012. Follow your company policy and procedures to make pen and ink changes or notations to the published IPC/WHMA-A-620 Revision B...
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IPC-9242: Guidelines for Microsection Evaluation
IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures
IPC-7527A: Requirements for Solder Paste Application
IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards
IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards
IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard
IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797
IPC-WP-011: Guidance for Strain Gage Limits for Assemblies
J-STD-048A: Notification Standard for Product Discontinuance
IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits
IPC-1401B: Corporate Social Responsibility Management System Standard
IPC -1751B: Generic Requirements for Declaration Process Management
IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards