Menu
Close
Contact Us

Standards

Your results

Document #

Language

Products

no-image-available

IPC-4101 - Revision E - Standard with Amendment 1

Specification for Base Materials for Rigid and Multilayer Printed Boards

Document #:
IPC-4101
Revision
E
Product Type
Standard with amendment(s)
Released:  04/14/2020
Language
English
Current Revision
IPC-4101E-WAM1 covers the requirements for base materials that are referred to as laminate or prepreg and listed in the specification sheets which are found after the main body of the standard. The specification sheets are to be used primarily for rigid and multilayer printed boards for electronic interconnections. The IPC-4101E-WAM1 standard contains 70 individual specification sheets that can be...

IPC-SM-840 - Revision E - Standard Only

Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials

Document #:
IPC-SM-840
Revision
E
Product Type
Standard Only
Released:  12/22/2010
Language
English
Current Revision
Establishes the requirements for the evaluation of liquid and dry film solder mask material and for the determination of the acceptability of use on a standard printed board system. IPC-SM-840 provides two classes of requirements, T and H, to reflect functional performance requirements and testing severity based on industry/end use requirements. Coverage is given to adhesion, material qualification...
no-image-available

IPC/WHMA-A-620 - Revision F - Standard Only

Requirements and Acceptance for Cable and Wire Harness Assemblies

Document #:
IPC/WHMA-A-620
Revision
F
Product Type
Standard Only
Released:  12/01/2025
Language
English
Current Revision
IPC/WHMA-A-620 is the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies. IPC/WHMA-A-620F describes materials, methods, tests and acceptance criteria for producing crimped, mechanically secured and soldered interconnections and the related assembly activities associated with cable and harness assemblies.

IPC-7095 - Revision D - Standard with Amendment 1

Design and Assembly Process Implementation for BGAs

Document #:
IPC-7095
Revision
D
Product Type
Standard with amendment(s)
Released:  07/09/2019
Language
English
Current Revision
The IPC-7095D-AM1 standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages. IPC-7095D-AM1 provides the useful and practical information to those who use or are considering using BGAs. IPC-7095D-AM1 provides...
no-image-available

IPC-1782 - Revision B - Standard Only

Standard for Manufacturing and Supply Chain Traceability of Electronic Products

Document #:
IPC-1782
Revision
B
Product Type
Standard Only
Released:  10/20/2023
Language
English
Current Revision
IPC-1782B establishes minimum requirements for manufacturing and supply chain traceability based on perceived risk. IPC-1782B applies to all products, processes, assemblies, parts, components, equipment used and other items as defined by users and suppliers in the manufacture of printed board assemblies, as well as mechanical assembly and printed board fabrication. IPC-1782B is applicable both for...
no-image-available

IPC-1602 - Revision A - Standard Only

Standard for Printed Board Handling and Storage

Document #:
IPC-1602
Revision
A
Product Type
Standard Only
Released:  12/17/2024
Language
English
Current Revision
The industry's sole standard on the handling, packaging and storage of printed boards. The requirements in this document are intended to protect printed boards from contamination, physical damage, solderability degradation, ESD and moisture uptake. Consideration is given to packaging material types and methods, production environment, handling and transport of product, and establishing baking...
IPC-4562 - Cover Image

IPC-4562 - Revision B - Standard Only

Metal Foil for Printed Board Applications

Document #:
IPC-4562
Revision
B
Product Type
Standard Only
Released:  04/01/2024
Language
English
Current Revision
IPC-4562A standard covers metal unsupported foils and foils supported by carrier films suitable for subsequent use in printed boards. IPC-4562B addresses the requirements of metal foils used in printed wiring applications.

IPC-CH-65 - Revision B - Standard Only

Guidelines for Cleaning of Printed Boards and Assemblies

Document #:
IPC-CH-65
Revision
B
Product Type
Standard Only
Released:  07/25/2011
Language
English
Current Revision
This document includes lead free, no-clean, and environmental friendly chemistries. This is a collection of information on electronic board and assembly cleaning in a single location. This major revision explains the relationship between materials, processes, and contaminants in fabrication and assembly operations. It also addresses cleanliness assessment and process control in relation to...
no-image-available

IPC-7530 - Revision B - Standard Only

Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)

Document #:
IPC-7530
Revision
B
Product Type
Standard Only
Released:  03/13/2025
Language
English
Current Revision
This document provides useful and practical information for developing thermal profiles to produce acceptable SnPb and Pb-free electronics assemblies using reflow, vapor phase, laser, selective and wave soldering equipment. The document also includes a troubleshooting guide for addressing common defects which can be attributed to profiling.
IPC-2231A Cover Image

IPC-2231 - Revision A - Standard Only

DFX Guidelines

Document #:
IPC-2231
Revision
A
Product Type
Standard Only
Released:  10/27/2021
Language
English
Current Revision
IPC-2231A provides guidelines for establishing a best practice methodology for use in developing a formal DFX (Design for Manufacturing, Fabrication, Assembly, Testability, Cost, Reliability, Environment, Reuse) process for layout of printed boards.
no-image-available

IPC-4203 - Revision C - Standard Only

Cover and Bonding Material for Flexible Printed Circuitry

Document #:
IPC-4203
Revision
C
Product Type
Standard Only
Released:  04/10/2025
Language
English
Current Revision
This standard establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides, which are to be used as cover material and/or bondply for flexible printed circuitry, and supported or unsupported adhesive films to be used in the fabrication of flexible printed circuitry.

IPC-CC-830 - Revision C - Standard Only

Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

Document #:
IPC-CC-830
Revision
C
Product Type
Standard Only
Released:  01/15/2019
Language
English
Current Revision
The IPC-CC-830C standard establishes qualification and conformance requirements for electrical insulating compounds (conformal coatings). It has been designed and constructed with the intent of obtaining maximum confidence in the materials with minimum test redundancy. The IPC-CC-830C standard covers: • The qualification and qualification retention of the conformal coating material (Table 3-1...

IPC-7093 - Revision A - Standard Only

Design and Assembly Process Implementation for Bottom Termination Components (BTCs)

Document #:
IPC-7093
Revision
A
Product Type
Standard Only
Released:  11/30/2020
Language
English
Current Revision
The IPC-7093A standard provides essential design and assembly guidance for implementing bottom termination components (BTCs). Specifically, IPC-7093A provides guidelines on critical design, materials, assembly, inspection, repair, quality, and reliability issues associated with BTCs.
no-image-available

IPC-4556 - Revision A - Standard Only

Specification for Electroless Nickel/Electroless Palladium Immersion Gold (ENEPIG) Plating for Printed Boards

Document #:
IPC-4556
Revision
A
Product Type
Standard Only
Released:  07/02/2025
Language
English
Current Revision
IPC-4556A Standard sets the requirements for the use of Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) as a surface finish for printed boards. IPC-4556A standard defines ENEPIG deposit thicknesses for applications including soldering, wire bonding, and as a contact finish.
no-image-available

IPC-1752 - Revision B - Standard Only

Materials Declaration Management Standard

Document #:
IPC-1752
Revision
B
Product Type
Standard Only
Released:  07/01/2020
Language
English
Current Revision
The IPC-1752B standard establishes the requirements for exhanging material and substance data between suppliers and their customers for electrical and electronics products and other produicts. IPC-1752B includes data fields to help supply chain members transfer materials data required for submission into the ECHA SCIP database.
no-image-available

IPC-1751 - Revision A - Standard Only

Generic Requirements for Declaration Process Management

Document #:
IPC-1751
Revision
A
Product Type
Standard Only
Released:  03/16/2010
Language
English
Current Revision
Amendment 1 to IPC-1751A standard provides the principles and details for declarations necessary between members of a supply chain relationship. This standard is the first in a series of standards that permits segmentation of declaration details based on the subject and scope of the declaration as well as the manufacturing domain. This standard contains general information and is supplemented by...
IPC-7801A Cover Image

IPC-7801 - Revision A - Standard Only

Reflow Oven Process Control Standard

Document #:
IPC-7801
Revision
A
Product Type
Standard Only
Released:  09/14/2022
Language
English
Current Revision
The IPC-7801A standard provides requirements for process control of conveyorized solder reflow ovens. It includes a methodology for performing temperature measurements over time to establish a baseline profile, and then provides requirements to verify repeatability through periodic verification of the oven profile.
IPC-9121A Cover Image

IPC-9121 - Revision A - Standard Only

Troubleshooting for Printed Board Fabrication Processes

Document #:
IPC-9121
Revision
A
Product Type
Standard Only
Released:  04/14/2022
Language
English
Current Revision
The IPC-1921A handbook provides problems, causes and possible corrective actions related to printed board manufacturing processes. Includes more than 200 photos and illustrations depicting common defects.

IPC-4591 - Revision A - Standard Only

Requirements for Printed Electronics Functional Conductive Materials

Document #:
IPC-4591
Revision
A
Product Type
Standard Only
Released:  01/01/2018
Language
English
Current Revision
The IPC-4591A standard establishes the classification system and the qualification and quality conformance requirements for functional conductive materials used in printed electronics applications. It provides companies that procure functional materials for printed electronics with the necessary technical structure to design and manufacture products meeting conformance to industry-determined...
IPC-4412C Cover Images

IPC-4412 - Revision C - Standard Only

Specification for Finished Fabric Woven from "E" Glass for Printed Boards

Document #:
IPC-4412
Revision
C
Product Type
Standard Only
Released:  02/28/2022
Language
English
Current Revision
The IPC-4412C covers the requirements for reinforcements woven from "E"glass yarn. These reinforcements are used in the production of prepregs, some of which are pressed into laminates. These prepregs and laminates are the base materials for rigid and mulitlayer printed boards. The IPC-4412C standard contains tables which describe each fabriic style in detail including the yarn used, the number of...
IPC-7091A Cover Image

IPC-7091A - Revision A - Standard Only

Design and Assembly Process Implementation of 3D Components

Document #:
IPC-7091
Revision
A
Product Type
Standard Only
Released:  01/13/2023
Language
English
Current Revision
This document describes the design and assembly challenges and ways to address those challenges for implementing 3D component technology. Recognizing the effects of combining multiple uncased semiconductor die elements in a single-package format can impact individual component characteristics and can dictate suitable assembly methodology. The information contained in this standard focuses on...
IPC-1401A Cover Image

IPC-1401 - Revision A - Standard Only

Corporate Social Responsibility Management System Standard

Document #:
IPC-1401
Revision
A
Product Type
Standard Only
Released:  11/29/2021
Language
English
Current Revision
The IPC-1401A standard specifies the requirements and best practice guidelines for an effective corporate social responsibility (CSR) management system to help an enterprise integrate CSR as a customer requirement into products and value chain activities, as well as to identify and manage CSR risks and opportunities through cooperation with customers and suppliers, to enhance the competitive...

IPC-1755 - Revision A - Standard Only

Responsible Sourcing of Minerals Data Exchange Standard

Document #:
IPC-1755
Revision
A
Product Type
Standard Only
Released:  04/14/2020
Language
English
Current Revision
The IPC-1755A standard establishes the requirements for exchanging data between suppliers and their customers in regard to the responsible resourcing of minerals. The IPC-1755As standard originally addressed conflict minerals within the scope of the Dodd-Frank Act in the US. IPC-1755A expands the scope of this document to address global responsible minerals sourcing.

IPC-4203 - Revision B - Standard Only

Cover and Bonding Material for Flexible Printed Circuitry

Document #:
IPC-4203
Revision
B
Product Type
Standard Only
Released:  03/01/2018
Language
English
Current Revision
IPC-4203B establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides, which are to be used as cover material and/or bondply for flexible printed circuitry, as well as supported or unsupported adhesive films to be used in the fabrication of flexible printed circuitry. IPC-4203B does not cover non...

IPC-7094 - Revision A - Standard Only

Design and Assembly Process Implementation for Flip Chip and Die-Size Components

Document #:
IPC-7094
Revision
A
Product Type
Standard Only
Released:  02/14/2018
Language
English
Current Revision
IPC-7094A describes the design and assembly challenges for implementing flip chip technology in a direct chip attach (DCA) assembly. The effect of bare-die or die-size components in a flip chip format has an impact on component characteristics and dictates the appropriate assembly methodology. The IPC-7094A standard focuses on design, assembly methodology, critical inspection, repair and...

IPC-4103 - Revision B - Standard Only

Specification for Base Materials for High Speed/High Frequency Applications

Document #:
IPC-4103
Revision
B
Product Type
Standard Only
Released:  11/01/2017
Language
English
Current Revision
IPC-4103B standard covers the requirements for clad and unclad plastic laminate and bonding layer materials to be used for the fabrication of printed boards for microstrip, stripline and high speed digital electrical and electronic circuits. In addition to better definitions of inclusions and how to properly classify them; redefine "substrates" as, "fabricated sheets"; and a more proper definition...
no-image-available

IPC-PE-740 - Revision A - Standard Only

Troubleshooting for Printed Board Manufacture and Assembly

Document #:
IPC-PE-740
Revision
A
Product Type
Standard Only
Released:  12/01/1997
Language
English
Current Revision
This is the document all process engineers must have! Useful for day-to-day problem solving, it contains case histories of problems and corrective action in the design, manufacture, assembly and testing of printed wiring products. Each section has been updated to reflect today's manufacturing challenges. Sections address documentation, phototooling, raw materials, mechanical operations, hole...

IPC-SM-817 - Revision A - Standard Only

General Requirements for Dielectric Surface Mount Adhesives

Document #:
IPC-SM-817
Revision
A
Product Type
Standard Only
Released:  12/23/2014
Language
English
Current Revision
Provides requirements for dielectric adhesives to hold components in place from the mounting to the soldering process and identifies test methods to ensure their long term properties. 9 pages. Released December 2014.

IPC-4411 - Revision A - Standard Only

Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement

Document #:
IPC-4411
Revision
A
Product Type
Standard Only
Released:  11/01/2003
Language
English
Current Revision
Covers the nomenclature, definitions and requirements for reinforcement made from nonwoven para-aramid fibers. Para-aramid reinforcement is primarily used in PCBs for HDI and high speed/high frequency applications. IPC-4411A also includes specification sheets, which can be used when selecting and purchasing nonwoven para-aramid reinforcement. Includes the incorporation of 14 new nonwoven para...
no-image-available

IPC-1730 - Revision A - Standard Only

Laminator Qualification Profile

Document #:
IPC-1730
Revision
A
Product Type
Standard Only
Released:  06/30/2000
Language
English
Current Revision
IPC-1730A is a tool used to categorize a laminate manufacturer's capabilities, which furnishes customer access to detailed information. Used for single or multiple sites or locations, IPC-1730A simplifies auditing processes and reduces the frequency of audits, decreasing paperwork and improving efficiency. The program includes a description, approval and certification profile and a quality profile...
IPC-1755A Am1 Cover Image

IPC-1755 - Revision A - Amendment 1

Responsible Sourcing of Minerals Data Exchange Standard

Document #:
IPC-1755
Revision
A
Product Type
Amendment
Released:  10/27/2021
Language
English
Current Revision
IPC-1755A-Am1 cannot be used without a copy of IPC-1755A the base standard. You can purchase IPC-1755A-Am1 and IPC-1755A in the IPC.org online store. The IPC-1755A standard establishes the requirements for exchanging data between suppliers and their customers regarding the responsible resourcing of minerals. The IPC-1755 standard originally addressed conflict minerals within the scope of the Dodd...
IPC-A-620E Space Cover Image

IPC/WHMA-A-620 - Revision E - Addendum - Space and Military

Space and Military Applications Electronic Hardware Addendum to IPC/WHMA-A-620

Document #:
IPC/WHMA-A-620
Revision
E
Product Type
Addendum
Released:  11/28/2023
Language
English
Current Revision
IPC/WHMA-A-620E-S space addendum provides additional requirements to IPC/WHMA-A-620E standard to ensure the reliability of cable and wire harness assemblies that must survive the vibration and thermal excursions encountered getting to and operating in the military and space environments. IPC/WHMA-A-620E-S cannot be used as a standalone document. It must be used with the base standard IPC/WHMA-A...
no-image-available

IPC/WHMA-A-620 - Revision C - Addendum - Rail Transit

Rail Transit Addendum to IPC/WHMA-A-620C

Document #:
IPC/WHMA-A-620
Revision
C
Product Type
Addendum
Released:  05/31/2022
Language
English
Current Revision
IPC/WHMA-A-620C-R rail transit addendum provides additional requirements to IPC/WHMA-A-620C standard, describing materials, methods, tests, and acceptance criteria for producing crimped, mechanically secured, and soldered interconnections. It also provides the related assembly activities associated with cable and harness assemblies in rail transit industry, to ensure the high reliability and...

IPC-4781 - Standard Only

Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend and/or Marking Ink

Document #:
IPC-4781
Revision
Original Version
Product Type
Standard Only
Released:  05/30/2008
Language
English
Current Revision
The industry's first specification for the evaluation of a legend and/or marking ink material for the determination of acceptability of use in a standard printed board system. IPC-4781 provides coverage for adhesion, material qualification and testing, resistances to solvents, requirements for resistance to lead-free solders, and electrical requirements. 17 pages. Released May 2008.
no-image-available

IPC/WHMA-A-620 - Revision F- Redline Standard

IPC/WHMA-A-620E to IPC/WHMA-620F Redline Comparison

Document #:
IPC/WHMA-A-620
Revision
F
Product Type
Redline Standard
Released:  01/05/2026
Language
English
Current Revision
IPC/WHMA-A-620F-RL is a redline document showing the difference from IPC/WHMA-A-620E to IPC/WHMA-A-620F. IPC/WHMA-A-620F-RL provides a side-by-side comparison of the two documents and includes the figures and tables. The document shows deleted/changed/moved text in the IPC/WHMA-A-620E pages and new/revised/moved text in the IPC/WHMA-A-620F pages. This is a visual tool showing the changes as a...
no-image-available

IPC-TM-650 - Standard Only

Test Methods Manual

Document #:
IPC-TM-650
Revision
Original Version
Product Type
Standard Only
Language
English
Current Revision
Contains over 150 industry approved test techniques and procedures for chemical, mechanical, electrical, and environmental tests on all forms of printed boards and connectors. New and updated test methods are available for download at https://www.ipc.org/test-methods.
no-image-available

IPC-T-50 - Revision P - Standard Only

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

Document #:
IPC-T-50
Revision
P
Product Type
Standard Only
Released:  11/25/2025
Language
English
Current Revision
This document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing English as a second language could understand the subtleties of the meaning. Revision P contains over 120 new or revised terms, including new terminology for back-drill structures, cable and wire...

IPC-4811 - Standard Only

Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards

Document #:
IPC-4811
Revision
Original Version
Product Type
Standard Only
Released:  05/30/2008
Language
English
Current Revision
This document describes materials that can be used for the fabrication of embedded passive resistor devices within the finished printed circuit board substrate. It provides information on general designations and associated characteristics of embedded passive device (EPD) resistor materials. The document shall be used as a qualification and conformance standard for designers and users when...
no-image-available

JIG-101 - Standard Only

Joint Industry Guide Materials Composition Declaration for Electrotechnical Products

Document #:
JIG-101
Revision
4
Product Type
Standard Only
Released:  09/08/2011
Language
English
Current Revision
The Joint Industry Guide Material Composition Declaration for Electrotechnical Products has been updated to include the most recent substances for restriction. The JIG-101 is an industry materials declaration guide that facilitates reporting of material content information across the global electrotechnical supply chain. This document sets minimum requirements for a materials declaration. The...
IPC-8401 Cover Image

IPC-8401 - Standard Only

Guidelines for In-Mold Electronics

Document #:
IPC-8401
Revision
Original Version
Product Type
Standard Only
Released:  10/22/2024
Language
English
Current Revision
IPC-8401 standard provides guidelines for In-Mold Electronics (IME) manufacturing processes, part structures, candidate materials, and production test methods. In-Mold Electronics integrates printed electronics and electrical components into injection molded plastics, creating a three-dimensional smart molded structure. IME technology uses mass production processes, materials, and components. IME...

IPC-4563 - Standard Only

Resin Coated Copper Foil for Printed Boards Guideline

Document #:
IPC-4563
Revision
Original Version
Product Type
Standard Only
Released:  02/11/2008
Language
English
Current Revision
This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies. 19 pages. Released November 2007.

IPC-4121 - Standard Only

Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications

Document #:
IPC-4121
Revision
Original Version
Product Type
Standard Only
Released:  01/01/2000
Language
English
Current Revision
IPC-4121 provides industry-approved guidelines for selecting core constructions for multilayer printed wiring boards (PWBs). The specification sheets in the document categorize the different core constructions by laminate type and nominal thickness. The constructions are rated for characteristics such as dielectric constant (DK), dimensional stability (DS), flatness, smoothness and drillability...

IPC-1753 - Standard Only

Laboratory Report Standard

Document #:
IPC-1753
Revision
Original Version
Product Type
Standard Only
Released:  01/31/2014
Language
English
Current Revision
IPC-1753 Laboratory Declaration Standard will allow for the electronic exchange of laboratory chemical analysis reports between supply chain members. Companies are being asked to provide laboratory analytic data to show compliance with the RoHS Directive and other customer requirements, such as halogen-free. This standard will allow for the expedited exchange of the necessary laboratory...

IPC/EIA-J-STD-032 - Standard Only

Performance Standard for Ball Grid Array Balls

Document #:
IPC/EIA-J-STD-032
Revision
Original Version
Product Type
Standard Only
Released:  06/01/2002
Language
English
Current Revision
This standard, developed jointly by IPC and the Electronic Industries Association (EIA) establishes the construction detail requirements for balls and other terminal structures on Ball Grid Array (BGA) packages. It also establishes a set of designations and expectations for product performance. A large variety of terminal structures are recognized for a wide range of applications ranging from...

IPC-A-142 - Standard Only

Specification for Finished Fabric Woven from Aramid for Printed Boards

Document #:
IPC-A-142
Revision
Original Version
Product Type
Standard Only
Released:  06/01/1990
Language
English
Current Revision
Covers finished fabrics woven from aramid yarns that are intended as reinforcing material in laminated plastics for electrical and electronic use. All fabrics covered by this specification are plain weave. 9 pages. Released June 1990.

IPC-9199 - Standard Only

Statistical Process Control (SPC) Quality Rating

Document #:
IPC-9199
Revision
Original Version
Product Type
Standard Only
Released:  09/01/2002
Language
English
Current Revision
This document is a tool for a customer or supplier organization's internal audit group to assess a statistical process control (SPC) system against the requirements of IPC-9191. This document should be used by customers and suppliers of any size and for any commodity. This tool can be used to perform an assessment of the use of SPC at both organizational and process levels. The questions in this...

IPC-8921 - Standard Only

Requirements for Woven and Knitted Electronic Textiles (E-Textiles) Integrated with Conductive Fibers, Conductive Yarns and/or Wires

Document #:
IPC-8921
Revision
Original Version
Product Type
Standard Only
Released:  12/05/2019
Language
English
Current Revision
The IPC-8921 standard provides and defines industry test methods and guidance for providing performance data on key characteristics and durability of woven and knitted e-textiles integrated with conductive fibers, conductive yarns and/or wires. The IPC-8921 standard also provides classifications for woven and knitted e-textiles, fibers, yarns and wires and includes 20 new terms and definitions for...

IPC-7621 - Standard Only

Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics

Document #:
IPC-7621
Revision
Original Version
Product Type
Standard Only
Released:  02/14/2018
Language
English
Current Revision
Encapsulation, for the purpose of IPC-7621 standard, is defined as a low pressure molded thermoplastic, e.g., polyamide, which is brought to a liquid state and injection molded and (rather quickly) returned to a temperature below its melting point., forming a durable yet pliable (rubbery-like) form. The desired performance characteristics of low pressure molding (LPM) encapsulation depend on the...

IPC-3408 - Standard Only

General Requirements for Anisotropically Conductive Adhesives Films

Document #:
IPC-3408
Revision
Original Version
Product Type
Standard Only
Released:  11/01/1996
Language
English
Current Revision
This document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components. Applications include the following: flexible PWB-to-glass, flexible PWB-to-rigid PWB, flip chip-to-glass, flip chip-to-flexible PWB, flip chip-to-rigid PWB, and fine pitch SMD. The adhesive film may be supplied pre-attached to a flexible circuit or...

IPC-3406 - Standard Only

Guidelines for Electrically Conductive Surface Mount Adhesives

Document #:
IPC-3406
Revision
Original Version
Product Type
Standard Only
Released:  07/01/1996
Language
English
Current Revision
IPC-3406 offers guidelines for selecting electrically conductive adhesives for use in electronics manufacturing as solder alternatives. The process discussion attempts to stay within the bounds of the existing solder assembly infrastructure. Both major types of adhesives, isotropic (conducting equally in all directions) and anisotropic (unidirectional conductivity) are covered. Polymer adhesives...

IPC-1758 - Standard Only

Declaration Requirements for Shipping, Pack and Packing Materials

Document #:
IPC-1758
Revision
Original Version
Product Type
Standard Only
Released:  05/22/2012
Language
English
Current Revision
This standard addresses the industry need for exchange of information regarding the materials used to protect products during shipment between supply chain partners. This standard is one of several in the 175x series of standards that permits segmentation of declaration details based on the subject and scope of the declaration. This standard describes essential information exchange content with...
no-image-available

IPC-1756 - Standard Only

Manufacturing Process Data Management

Document #:
IPC-1756
Revision
Original Version
Product Type
Standard Only
Released:  04/05/2010
Language
English
Current Revision
IPC-1756 establishes the requirements for exchanging manufacturing data between suppliers and customers for electrical and electronic products. IPC-1756 establishes 23 fields for declaration of manufacturing data supported by Scriba and other tools developed for use between users and suppliers. The type of manufacturing information includes sensitivity to moisture and high temperature, different...

IPC-1753 - Standard with Amendment 1

Laboratory Report Standard

Document #:
IPC-1753
Revision
Original Version
Product Type
Standard with amendment(s)
Released:  05/03/2018
Language
English
Current Revision
IPC 1753 WAM1 Laboratory Declaration Standard will allow for the electronic exchange of laboratory chemical analysis reports between supply chain members. Companies are being asked to provide laboratory analytic data to show compliance with the RoHS Directive and other customer requirements, such as halogen-free. This standard will allow for the expedited exchange of the necessary laboratory...
no-image-available

IPC-1731 - Standard Only

Strategic Raw Materials Supplier Qualification Profile

Document #:
IPC-1731
Revision
Original Version
Product Type
Standard Only
Released:  06/01/2000
Language
English
Current Revision
Suppliers of raw materials for laminate manufacturing now have an industry-approved questionnaire to supply current and potential customers with a self-assessment of their facilities. IPC-1731 gives suppliers of raw materials the opportunity to create a profile of their manufacturing facility(s) that will be consistent with those developed by other industry suppliers. Using the Microsoft Word (TM)...
no-image-available

IPC-T-50- Revision N - Standard Only

电子电路互连与封装术语及定义

Document #:
IPC-T-50
Revision
N
Product Type
Standard Only
Released:  01/13/2023
Language
Chinese
Current Revision
IPC-T-50N-CN文件旨在为电子行业中常用的词汇和术语提供其定义。本文件所规定的定义充分详细地阐明了术语，以便以英语为第二语言的读者能够理解含义的细微之处。IPC-T-50N-CN包含550多个新的或修订的术语，包括通孔结构、表面贴装器件类型、焊料凸点、焊料合金、焊接、退润湿、电路板制造工艺和测试的新术语。

IPC-T-50 - Revision K - Standard Only

Begriffe und Definitionen für Leiterplatten und elektronische Baugruppen

Document #:
IPC-T-50
Revision
K
Product Type
Standard Only
Released:  02/03/2015
Language
German
Current Revision
Das unentbehrliche Nachschlagewerk für alle Verantwortlichen entlang der Wertschöpfungskette von elektronischen Produkten. Die Revision K enthält auf mehr als 120 Seiten, mehr als 220 neue und überarbeitete Begriffe und bildliche Darstellungen. Beispiele: Access Hole, Accelerated Equivalent Soak, Capture Land, Micro Via Technology, Plating Thief, Etchback, Resin Recession, Tape Automated Bonding...
no-image-available

IPC-1602 - Revision A - Redline Standard

Redline Comparison IPC-1602 to IPC-1602A

Document #:
IPC-1602
Revision
A
Product Type
Redline Standard
Released:  04/23/2025
Language
English
Current Revision
IPC-1602A Redline document shows the changes from IPC-1602 to IPC-1602A in a side-by-side comparison of the two documents. This is only available in digital format.
no-image-available

IPC-4413 - Amendment 1

Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards

Document #:
IPC-4413
Revision
Original Version
Product Type
Amendment
Released:  01/29/2026
Language
English
Current Revision
IPC-4105 is a new document that covers the requirements for metal-base materials that are referred to as metal-based laminate listed in the specification sheets that are contained in the last of the main body. These are to be used primarily for rigid and multilayer printed boards for electronic interconnections.
no-image-available

IPC-4821 - Amendment 1

Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards

Document #:
IPC-4821
Revision
Original Version
Product Type
Amendment
Released:  05/01/2006
Language
English
Current Revision
IPC-4821 Amendment 1 provides the update of IPC-CF-148 to the correct IPC-4563, references the IPC-TM-650, Method 2.5.7.2 for correct Hi-Pot testing of these thin materials, uses proper reference for visual inspection by inspectors and finally, updated the first five material specification sheets (IPC-4821/1 through IPC-4821/5) that now show Effective Dates of April 2010. The Specification Sheet...
no-image-available

IPC-1754 - Amendment 2

Materials and Substances Declaration for Aerospace and Defense and Other Industries

Document #:
IPC-1754
Revision
Original Version
Product Type
Amendment
Released:  06/23/2020
Language
English
Current Revision
IPC-1754-Am2, establishes the requirements for the exchanging material and substance data for Products between suppliers and their customers and has been developed through the participation of aerospace, defense, automotive, electronics and solution provider representatives.
no-image-available

IPC/WHMA-A-620 - Revision E - Standard Only

Anforderungen und Abnahmekriterien für Kabel- und Kabelbaum-Baugruppen

Document #:
IPC/WHMA-A-620
Revision
E
Product Type
Standard Only
Released:  03/05/2025
Language
German
Current Revision
IPC/WHMA-A-620E ist die einzige, im Branchenkonsens entwickelte Richtlinie für Anforderungen und Abnahmekriterien für Kabel- und Kabelbaum-Baugruppen. IPC/WHMA-A-620E beschreibt Materialien, Methoden, Tests und Abnahmekriterien für die Herstellung gecrimpter, mechanisch gesicherter oder gelöteter Verbindungen und die zu den Kabel- und Kabelbaum-Baugruppen zugehörigen Montageaktivitäten. IPC/WHMA-A...
no-image-available

IPC/WHMA-A-620 - Revision E - Standard Only

Exigences et acceptabilité des assemblages de câbles et de faisceaux de fils

Document #:
IPC/WHMA-A-620
Revision
E
Product Type
Standard Only
Released:  04/29/2025
Language
French
Current Revision
IPC/WHMA-A-620E est la seule norme consensuelle de l’industrie pour les exigences et l’acceptation des assemblages de câbles et de faisceaux de fils. IPC/WHMA-A-620E décrit les matériaux, les méthodes, les tests et les critères d’acceptation pour la production d’ensembles interconnectés brasés, sertis et mécaniquement sécurisés, ainsi que les activités d’assemblage qui y sont associées pour...
no-image-available

IPC/WHMA-A-620 - Revision E - Standard Only

Requisitos y aceptación para ensambles con cables compuestos y mazos/ arneses de cables

Document #:
IPC/WHMA-A-620
Revision
E
Product Type
Standard Only
Released:  05/02/2025
Language
Spanish
Current Revision
El IPC/WHMA-A-620E es el único estándar consensuado por el sector sobre Requisitos y aceptabilidad de ensambles de cables y mazos de cables. El estándar IPC/WHMA-A-620E describe los materiales, métodos, pruebas y criterios de aceptabilidad para la producción de interconexiones crimpadas, mecánicamente aseguradas o soldadas y las actividades de ensamble relacionadas que estén asociadas con...

IPC/WHMA-A-620 - Revision D - Standard Only

Godkendelseskrav for kabler og for produkter med wire harness

Document #:
IPC/WHMA-A-620
Revision
D
Product Type
Standard Only
Released:  11/20/2020
Language
Danish
Current Revision
IPC/WHMA-A-620D er den eneste industriudviklede standard for ” Godkendelseskrav for kabler og for produkter med wire harness”. IPC/WHMA-A-620D beskriver materialer, metoder, test og godkendelseskriterier for fremstilling af crimpede samlinger, mekanisk sikrede og loddede forbindelser samt de tilhørende monteringsprocesser som er forbundet med kabel og harness produkter. IPC/WHMA-A-620D blev...
no-image-available

IPC/WHMA-A-620 - Revision E - Standard Only

ケーブルおよびワイヤーハーネス組立品の要求事項および許容基準 Requirements and Acceptance for Cable and Wire Harness Assemblies

Document #:
IPC/WHMA-A-620
Revision
E
Product Type
Standard Only
Released:  07/13/2023
Language
Japanese
Current Revision
IPC/WHMA-A-620Eは、ケーブルおよびワイヤーハーネス組立品の要求事項および許容基準に関する、唯一の業界合意文書(規格書)である。IPC/WHMA-A-620Eでは、ケーブルおよびハーネス組立品に関係する配線の圧着、機械的固定、またははんだ付を行うための材料、方法、試験、および許容基準、ならびに関連組立活動について説明している。 IPC/WHMA-A-620Eは、IPCおよびThe Wire Harness Manufacturers Association (WHMA) (IPCの関連団体)により作成されたものである。
no-image-available

IPC/WHMA-A-620 - Revision D - Standard Only

Wymagania i akceptacje dla montażu kabli i wiązek przewodów

Document #:
IPC/WHMA-A-620
Revision
D
Product Type
Standard Only
Released:  03/12/2021
Language
Polish
Current Revision
IPC/WHMA-A-620D jest jedynym standardem branżowym dotyczącym Wymagań i Akceptacji dla Montażu Kabli i Wiązek Przewodów. IPC/WHMA-A-620D opisuje materiały, metody, testy i kryteria akceptacji dla tworzenia zagniatanych, mechanicznie zabezpieczonych i lutowanych połączeń oraz powiązanych czynności montażowych związanych z zespołami kabli i wiązek przewodów. IPC/WHMA-A-620D został opracowany przez...
no-image-available

IPC/WHMA-A-620 - Revision E - Standard Only

線纜及線束組件的要求與驗收Requirements and Acceptance for Cable and Wire Harness Assemblies

Document #:
IPC/WHMA-A-620
Revision
E
Product Type
Standard Only
Released:  11/01/2023
Language
Chinese (Zhōngwén)
Current Revision
IPC/WHMA-A-620E 是線纜及線束元件的要求與驗收的唯一行業共識標準。本標準描述了用於壓接、機械緊固或焊接互連的材料、方法、測試和可接受性標準以及其他線纜線束元件組裝活動的相關標準。 IPC/WHMA-A-620E由IPC和線束製造商協會（WHMA）（隸屬於IPC）共同開發
no-image-available

IPC/WHMA-A-620 - Revision E - Standard Only

Yêu Cầu và Tiêu Chuẩn Chấp Nhận cho Các Bộ Dây Điện và Cáp Điện

Document #:
IPC/WHMA-A-620
Revision
E
Product Type
Standard Only
Released:  10/09/2023
Language
Vietnamese
Current Revision
IPC/WHMA-A-620E là tiêu chuẩn duy nhất trong ngành được đồng thuận về Yêu Cầu và Tiêu Chuẩn Chấp Nhận cho Các Bộ Dây Điện và Cáp Điện. IPC/WHMA-A-620E mô tả các nguyên vật liệu, phương pháp, cách kiểm tra và tiêu chuẩn chấp nhận để sản xuất các liên kết bấm, cố định cơ học, hoặc hàn, cũng như các hoạt động lắp ráp có liên quan liên quan đến các bộ dây điện và cáp điện. IPC/WHMA-A-620E được phát...
no-image-available

IPC/WHMA-A-620 - Revision E - Standard Only

ข้อกำหนดและเกณฑ์การยอมรับสำหรับชุดสายไฟและสายเคเบิล

Document #:
IPC/WHMA-A-620
Revision
E
Product Type
Standard Only
Released:  03/13/2025
Language
Thai
Current Revision
IPC/WHMA-A-620E เป็นมาตรฐานที่มีความเห็นร่วมกันในอุตสาหกรรมเพียงมาตรฐานเดียวสำหรับข้อกำหนดและการยอมรับของการประกอบชุดสายไฟและสายเคเบิล IPC/WHMA-A-620E อธิบายเกี่ยวกับวัสดุ วิธีการ การทดสอบ และเกณฑ์การยอมรับสำหรับการผลิตการเชื่อมต่อแบบคริม (crimped), การรักษาเชิงกล (mechanically secured) และการเชื่อมบัดกรี (soldered) รวมถึงกิจกรรมการประกอบที่เกี่ยวข้องกับการประกอบสายไฟและสายเคเบิล IPC/WHMA-A-620E...
no-image-available

IPC/WHMA-A-620 - Revision E - Standard Only

线缆及线束组件的要求与验收Requirements and Acceptance for Cable and Wire Harness Assemblies

Document #:
IPC/WHMA-A-620
Revision
E
Product Type
Standard Only
Released:  07/26/2023
Language
Chinese
Current Revision
IPC/WHMA-A-620E 是线缆及线束组件的要求与验收的唯一行业共识标准。本标准描述了用于压接、机械紧固或焊接互连的材料、方法、测试和可接受性标准以及其他线缆线束组件组装活动的相关标准。 IPC/WHMA-A-620E由IPC和线束制造商协会（WHMA）（隶属于IPC）共同开发。
no-image-available

IPC/WHMA-A-620 - Revision D - Standard Only

Yêu Cầu và Tiêu Chuẩn Chấp Nhận cho Các Bộ Dây Điện và Cáp Điện

Document #:
IPC/WHMA-A-620
Revision
D
Product Type
Standard Only
Released:  06/14/2022
Language
Vietnamese
Current Revision
IPC/WHMA-A-620D là bộ tiêu chuẩn duy nhất được chấp thuận rộng rãi trong ngành công nhiệp cho Các Yêu Cầu và Tiêu Chuẩn Chấp Nhận của Các Bộ Dây Điện Cáp Điện. IPC/WHMA-A-620D mô tả các vật liệu, phương pháp, kiểm tra và các tiêu chuẩn chấp nhận để thực hiện các mối liên kết bằng phương pháp bấm, gia cố cơ học và hàn và các hoạt động lắp ráp liên quan đến cáp điện và bộ dây điện. IPC/WHMA-A-620D...
no-image-available

IPC/WHMA-A-620 - Revision D - Standard Only

ケーブルおよびワイヤーハーネス組立品の要求事項および許容基準

Document #:
IPC/WHMA-A-620
Revision
D
Product Type
Standard Only
Released:  01/14/2021
Language
Japanese
Current Revision
IPC/WHMA-A-620Dは、「ケーブルおよびワイヤーハーネス組立品の要求事項および許容基準」に関する、業界合意による唯一の規格である。IPC/WHMA-A-620Dでは、ケーブルおよびハーネス組立品と関係する配線の圧着、機械的固定、およびはんだ付を行うための材料、方法、試験、および許容基準、ならびに関連組立活動について説明する。 IPC/WHMA-A-620Dは、IPCおよびWire Harness Manufacturers Association (WHMA) (IPCの関連組織)によって開発された。 目次を見る。pdfファイル。
no-image-available

IPC-7095 - Revision D - Standard with Amendment 1

ボールグリッドアレイ(BGA)の設計および組立プロセスの実施 – 改訂版1

Document #:
IPC-7095
Revision
D
Product Type
Standard with amendment(s)
Released:  06/17/2020
Language
Japanese
Current Revision
IPC-7095D-AM1は、ボールグリッドアレイ(BGA)およびファインピッチBGA(FBGA)技術の設計および組立の実施について記述するものであり、これらのパッケージを使用したプリント基板の設計と組立に関連する検査、リペアおよび信頼性の問題に焦点を当てている。 IPC-7095D-AM1は、BGAを使用している、もしくは使用を検討している本書読者に対し、有用で実用的な情報を提供するものである。またIPC-7095D-AM1では、BGAを使用するプリント基板組立のためのロバスト設計と組立プロセスの正しい方法について説明するとともに、BGAの組立中に発生する可能性のある一般的な異常について、トラブルシューティングの方法を説明している。
no-image-available

IPC/WHMA-A-620 - Revision D - Standard Only

Requisitos y admisibilidad de ensambles con cables y mazos de cables

Document #:
IPC/WHMA-A-620
Revision
D
Product Type
Standard Only
Released:  06/17/2020
Language
Spanish
Current Revision
El IPC/WHMA-A-620D es el único estándar consensuado por el sector sobre Requisitos y aceptabilidad de ensambles de cables y mazos de cables. El estándar IPC/WHMA-A-620D describe los materiales, métodos, pruebas y criterios de aceptabilidad para la producción de interconexiones crimpadas, mecánicamente aseguradas o soldadas y las actividades de ensamble relacionadas que estén asociadas con...

IPC/WHMA-A-620 - Revision D - Standard Only

Exigences et acceptation des assemblages de câbles et de faisceaux de fils

Document #:
IPC/WHMA-A-620
Revision
D
Product Type
Standard Only
Released:  06/17/2020
Language
French
Current Revision
IPC/WHMA-A-620D est la seule norme consensuelle de l’industrie pour les exigences et l’acceptation des assemblages de câbles et de faisceaux de fils. IPC/WHMA-A-620D décrit les matériaux, les méthodes, les tests et les critères d’acceptation pour la production d’ensembles interconnectés brasés, sertis et mécaniquement sécurisés, ainsi que les activités d’assemblage qui y sont associées pour...
IPC-WHMA-A-620D KR Cover

IPC/WHMA-A-620 - Revision D - Standard Only

케이블과 와이어 하네스 어셈블리의 요건과 허용 가능성

Document #:
IPC/WHMA-A-620
Revision
D
Product Type
Standard Only
Released:  07/27/2021
Language
Korean
Current Revision
IPC/WHMA-A-620D는 케이블 및 와이어 하네스 어셈블리의 요건과 및 허용 가능성에 대해 업계에서 유일하게 합의된 표준입니다. IPC/WHMA-A-620D는 크림핑된 기계적으로 고정되고 솔더링된 상호연결의 생산을 위한 물질, 방법, 테스트 및 허용 기준과 케이블 및 하네스 어셈블리와 관련된 조립 활동을 설명한다. IPC/WHMA-A-620D는 IPC와 WHMA(Wire Hanage Manufacturers Association)에 의해 개발되었다.

IPC/WHMA-A-620 - Revision D - Standard Only

线缆及线束组件的要求与验收

Document #:
IPC/WHMA-A-620
Revision
D
Product Type
Standard Only
Released:  06/17/2020
Language
Chinese
Current Revision
IPC/WHMA-A-620D 是线缆及线束组件的要求与验收的唯一行业共识标准。本标准描述了用于压接、机械紧固或焊接互连的材料、方法、测试和可接受性标准以及其他线缆线束组件组装活动的相关标准。 IPC / WHMA-A-620D由IPC和线束制造商协会（WHMA）（隶属于IPC）共同开发。 全文共420页。2020年1月开发。2020年5月翻译。

IPC/WHMA-A-620 - Revision D - Standard Only

Anforderungen und Abnahmekriterien für Kabel- und Kabelbaum-Baugruppen

Document #:
IPC/WHMA-A-620
Revision
D
Product Type
Standard Only
Released:  06/17/2020
Language
German
Current Revision
IPC/WHMA-A-620D ist die einzige, im Branchenkonsens entwickelte Richtlinie für Anforderungen und Abnahmekriterien für Kabel- und Kabelbaum-Baugruppen. IPC/WHMA-A-620D beschreibt Materialien, Methoden, Tests und Abnahmekriterien für die Herstellung gecrimpter, mechanisch gesicherter oder gelöteter Verbindungen und die zu den Kabel- und Kabelbaum-Baugruppen zugehörigen Montageaktivitäten. IPC/WHMA-A...

IPC/WHMA-A-620 - Revision D - Standard Only

Eisen en acceptatie van kabel en kabelboomassemblages

Document #:
IPC/WHMA-A-620
Revision
D
Product Type
Standard Only
Released:  09/10/2020
Language
Dutch
Current Revision
IPC/WHMA-A-620D is de enige consensusstandaard in de branche voor eisen en acceptatie van kabel- en kabelboomassemblages. IPC/WHMA-A-620D beschrijft materialen, methoden, tests en acceptatiecriteria voor het produceren van krimp-, mechanisch beveiligde en gesoldeerde verbindingen en de bijbehorende assemblageactiviteiten in verband met kabels en kabelbomen. IPC/WHMA-A-620D is ontwikkeld door IPC...

IPC-SM-840 - Revision E - Standard Only

永久性阻焊剂和挠性覆盖材料的鉴定和性能规范

Document #:
IPC-SM-840
Revision
E
Product Type
Standard Only
Released:  11/20/2012
Language
Chinese
Current Revision
简要介绍 （英文） 建立了液态和干膜阻焊材料的评估要求，以及确定其用在一个标准的印制板系统上的可接受性要求。IPC-SM-840提供了两个等级的要求，T级和H级，以反映基于行业/最终用户要求对功能性的要求及测试严格程度的差别。覆盖了附着力、材料鉴定、耐溶剂、以及电气要求。E版本包含了挠性覆盖材料的要求，在已蚀刻的导体和其他导电图形上提供挠性的介质保护层。共19页。2010年12月发布。2012年10月翻
no-image-available

IPC-7095 - Revision D - Standard with Amendment 1

BGA设计与组装工艺的实施

Document #:
IPC-7095
Revision
D
Product Type
Standard with amendment(s)
Released:  09/19/2019
Language
Chinese
Current Revision
IPC-7095D在设计，组装，检查和维修过程中实施球栅阵列（BGA）和细节距球栅阵列（FBGA）技术提出了了一些独特的挑战。它为使用或正在考虑使用BGA的用户提供有用和实用的信息。 它还介绍了如何使用BGA成功实现印刷电路板组件的稳健设计和装配流程，以及解决BGA组装过程中可能出现的一些常见异常的方法。由于焊球中合金，焊球形状，封装程序等的改变，许多问题变得尤为重要。D版主要重点是为组装后出现的一些新的机械失效问题如坑裂或层压缺陷提供信息。除了提供BGA检查和维修的指引外，本标准还解决了与BGA相关的可靠性问题和无铅焊点的使用标准。该标准中有许多X射线和内窥镜的照片和插图以确认行业中BGA组装工艺的实施中的遇到的一些情况。

IPC-4101 - Revision E - Standard Only

刚性及多层印制板用基材规范

Document #:
IPC-4101
Revision
E
Product Type
Standard Only
Released:  11/16/2018
Language
Chinese
Current Revision
IPC-4101E涵盖了被称为层压板或粘结片的基材的要求，并列在主体最后一部分的规格单中。 这些要求主要用于电子互连的刚性和多层印刷电路板中。 本文档包含了65个单独的规格单，可以使用关键字搜索。 这些关键字允许本文档的用户查找类似性质的材料，但具有特定的不同特性，可以对其层压板和/或粘结片选择需求进行微调。 修订版E增加了附录A，提供补充检查要求，但仅在材料用户的采购订单或主图纸有要求时使用。 全文共152页。 于2017年3月发布。2018年10月翻译。
no-image-available

IPC-7530 - Revision B - Standard Only

量産はんだ付プロセス(リフローおよびウェーブ)のための温度プロファイルガイドライン

Document #:
IPC-7530
Revision
B
Product Type
Standard Only
Released:  12/17/2025
Language
Japanese
Current Revision
本書は、リフロー、ベーパーフェーズ(気相)、レーザー、セレクティブ、ウェーブの各ソルダリング装置を使用し、許容可能な電子組立品(SnPb及びPbフリー)を生産する上で必要となる熱プロファイルの作成において、有用かつ実用的な情報を提供するものである。本書には、プロファイル測定に起因する一般的な欠陥に対処するためのトラブルシューティングガイドも含まれている
no-image-available

IPC-7093 - Revision A - Standard Only

底部端子元器件(BTCs)设计和组装工艺的实施

Document #:
IPC-7093
Revision
A
Product Type
Standard Only
Released:  09/14/2022
Language
Chinese
Current Revision
IPC-7093A 标准为实施底部端子元器件(BTCs)提供了基本的设计和组装指南。具体而言，IPC-7093A 提供了与 BTCs 相关的关键设计、材料、组装、检查、维修、质量和可靠性问题的指南。
no-image-available

IPC-7091 - Revision A - Standard Only

3D(三次元)部品の設計および組立プロセスの実施

Document #:
IPC-7091
Revision
A
Product Type
Standard Only
Released:  11/04/2024
Language
Japanese
Current Revision
本書では、3D部品の技術を実施する際の設計/組立の課題や、課題への対処方法について述べる。ケースに収納されていない複数の半導体ダイ素子を単一パッケージのフォーマットに組み合わせる効果を考える場合、その影響は個々の部品特性にも、これまでの組立手法にも及ぶ。本規格に含まれる情報は、3D半導体パッケージの組立とプロセスに関連する最適な機能性、工程評価、最終製品の信頼性とリペアの諸問題の解決に向け焦点を当てたものである。
no-image-available

IPC-1602 - Revision A - Standard Only

プリント基板の取扱いと保管に関する規格

Document #:
IPC-1602
Revision
A
Product Type
Standard Only
Released:  04/16/2025
Language
Japanese
Current Revision
本書はプリント基板の取扱い、梱包、保管に関する業界唯一の規格書である。本書に記載する要求事項は、プリント基板を汚染や物理的損傷、はんだ付性の低下、ESD、吸湿から保護することを目的としている。梱包資材の種類や梱包方法、製品の製造環境、取扱いと輸送、また、水分除去を目的としたベーキングプロファイルの策定などに関し、懸念事項が示されている。 本書では、プリント基板のはんだ付性に対するベーキングの影響、エッチング後のコア材・複合材の湿気に関する懸念事項、防湿袋(MBB)、乾燥剤、HICカードなどのドライパックに関する要求事項、相対的な吸湿を評価するためのテストクーポン、ベーキングによるフロアライフとリワークに関するガイダンスについて取り上げている。本書はIPC-1602の改訂版である。
no-image-available

IPC-4562 - Revision B - Standard Only

印制板用金属箔

Document #:
IPC-4562
Revision
B
Product Type
Standard Only
Released:  01/10/2025
Language
Chinese
Current Revision
IPC-4562B标准涵盖了适合于印制电路应用的无金属支撑金属箔和由载体膜支撑金属箔的相关要求。本标准规定了不同类型金属箔的定义、符号、型号、单位重量/厚度等基本要求，还包含金属箔的外观要求、物理化学特性要求，以及实现满足制造优质印制板用金属箔的品质保障条款和采购要求。
no-image-available

IPC-9121 - Revision A - Standard Only

プリント基板製造工程のトラブルシューティングTroubleshooting for Printed Board Fabrication Processes

Document #:
IPC-9121
Revision
A
Product Type
Standard Only
Released:  07/26/2023
Language
Japanese
Current Revision
ハンドブック「IPC-1921A」は、プリント基板の製造工程に関する問題点、原因、想定される対策(是正処置)について文書化したものである。よくある欠陥事象について、200枚を超える写真やイラストとともに紹介している。
no-image-available

IPC-4921 - Revision A - Standard Only

印刷电子基材（基板）要求

Document #:
IPC-4921
Revision
A
Product Type
Standard Only
Released:  04/12/2019
Language
Chinese
Current Revision
本标准的目的是提供和定义用于采购印刷电子基材（基板）的关键特性和测试方法。 包括6份材料规格单。
no-image-available

IPC-SM-817 - Revision A - Standard Only

表面実装用誘電体接着剤に関する一般要求事項

Document #:
IPC-SM-817
Revision
A
Product Type
Standard Only
Released:  09/14/2022
Language
Japanese
Current Revision
本書は、実装からはんだ付工程までにおける部品固定用として、また、プリント配線板の一部として長期的に適用される誘電体接着剤に関し、その要求事項と試験方法を提供するものである。9ページ。2014年12月発行。翻訳年 <2022年7月> 目次を見る
1-100 of 137

Coming Soon

IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards