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Document #:

IPC-9716

Revision

Original Version

Product Type

Standard Only

Released: 01/10/2025

Language

English

Current Revision

IPC-9716 provides requirements for automated optical inspection (AOI) systems to define, set up, establish, and apply process control for manufacturing printed board assemblies, including general and specific process and AOI system conditions. Requirements include inspection parameters, lighting conditions, calibration, detectability, resolution, threshold limits, program setups, measurement...

Document #:

IPC-9271

Revision

Original Version

Product Type

Standard Only

Released: 09/30/2025

Language

English

Current Revision

The IPC-9271 standard provides guidelines for device-level In-System Programming (ISP) as part of electronics assembly process. The standard addresses PCB design for ISP, fundamental characteristics when selecting an ISP programmer and the integration of the programmer in the production environment, including: fixtures, software, mechanical and process integration methodologies to increase...

Document #:

IPC-T-50

Revision

Product Type

Standard Only

Released: 01/13/2023

Language

Chinese

Current Revision

IPC-T-50N-CN文件旨在为电子行业中常用的词汇和术语提供其定义。本文件所规定的定义充分详细地阐明了术语，以便以英语为第二语言的读者能够理解含义的细微之处。IPC-T-50N-CN包含550多个新的或修订的术语，包括通孔结构、表面贴装器件类型、焊料凸点、焊料合金、焊接、退润湿、电路板制造工艺和测试的新术语。

Document #:

IPC-T-50

Revision

Product Type

Standard Only

Released: 02/03/2015

Language

German

Current Revision

Das unentbehrliche Nachschlagewerk für alle Verantwortlichen entlang der Wertschöpfungskette von elektronischen Produkten. Die Revision K enthält auf mehr als 120 Seiten, mehr als 220 neue und überarbeitete Begriffe und bildliche Darstellungen. Beispiele: Access Hole, Accelerated Equivalent Soak, Capture Land, Micro Via Technology, Plating Thief, Etchback, Resin Recession, Tape Automated Bonding...

Document #:

IPC-9716

Revision

Original Version

Product Type

Standard Only

Released: 06/27/2025

Language

Japanese

Current Revision

本規格は、自動光学検査(AOI)システムを用いてプリント基板組立品を製造する際の工程管理を定義、設定、確立、適用するための要求事項を規定するものである。ここでは一般工程、特殊工程およびAOIシステムの条件等を範囲としている。要求事項には、検査パラメータ、照明条件、校正、検出可能性、分解能、閾値の限度、プログラムセットアップ、測定システム解析(MSA)、保守、検証プロトコルが含まれる。