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ECA/IPC/JEDEC-J-STD-075 - Standard Only

Classification of Non-IC Electronic Components for Assembly Processes

Document #:
ECA/IPC/JEDEC-J-STD-075
Revision
Original Version
Product Type
Standard Only
Released:  09/03/2008
Language
English
Current Revision
J-STD-075 picks up where J-STD-020 left off by providing test methods to classify worst-case thermal process limitations for electronic components. Classification is referenced to common industry wave and reflow solder profiles including lead-free processing. The classifications represent maximum process sensitivity levels and do not establish rework conditions or recommended processes for an...
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IPC-OI-645 - Standard Only

Standard for Visual Optical Inspection Aids

Document #:
IPC-OI-645
Revision
Original Version
Product Type
Standard Only
Released:  10/01/1993
Language
English
Current Revision
Establishes requirements, definitions and certification provisions for optical inspection aids. Defines inspection grades to be used as accept/reject criteria for optical inspection aids. 40 pages. Released October 1993.
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IPC/EIA-J-STD-028 - Standard Only

Performance Standard for Construction of Flip Chip and Chip Scale Bumps

Document #:
IPC/EIA-J-STD-028
Revision
Original Version
Product Type
Standard Only
Released:  08/01/1999
Language
English
Current Revision
This standard establishes construction detail requirements for bumps and other terminal structures used for Flip Chip Scale carriers. The specific standards for different terminations are appropriately matched to a particular interconnection process and include such diverse terminations as solder bumps, columns, non-melting stand-offs and conductive polymer deposits. The document articulates a set...
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IPC-MC-790 - Standard Only

Guidelines for Multichip Module Technology Utilization

Document #:
IPC-MC-790
Revision
Original Version
Product Type
Standard Only
Released:  07/01/1992
Language
English
Current Revision
Provides information on multichip module technology, including parametric data, design and manufacturing information and a proposed categorization of various approaches to multichip interconnect substrate technologies based on dielectric family. 120 pages. Released August 1992.

IPC-CA-821 - Standard Only

General Requirements for Thermally Conductive Adhesives

Document #:
IPC-CA-821
Revision
Original Version
Product Type
Standard Only
Released:  01/01/1995
Language
English
Current Revision
Covers requirements and test methods for thermally conductive dielectric adhesives used to bond components in place. Permanent, removable and self-shimming adhesives are addressed. 18 pages. Released January 1995.
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IPC-9708 - Standard Only

Test Methods for Characterization of Printed Board Assembly Pad Cratering

Document #:
IPC-9708
Revision
Original Version
Product Type
Standard Only
Released:  12/14/2010
Language
English
Current Revision
Mechanical bend and shock tests are routinely performed on SMT assemblies to ensure that they can sustain anticipated production, handling and end use conditions. The strains and strain rates applied to SMT assemblies during bend and shock testing can lead to a variety of failure modes in the vicinity of the solder joints. This document provides test methods to evaluate the susceptibility of...
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IPC-9706 - Standard Only

Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and Pad Crater/Trace Crack Detection

Document #:
IPC-9706
Revision
Original Version
Product Type
Standard Only
Released:  01/14/2014
Language
English
Current Revision
Survey-based study presents data and analysis on the EMS industry, examining trends in sources of revenue, revenue per employee, services offered, markets served, manufacturing technology, capital investment, spending on equipment and materials and market size including forecasts and potential for market expansion. This study is based on data provided by a representative sample of 120 EMS...

IPC-9641 - Standard Only

High Temperature Printed Board Flatness Guideline

Document #:
IPC-9641
Revision
Original Version
Product Type
Standard Only
Released:  07/10/2013
Language
English
Current Revision
Printed board flatness is largely affected by a change in intrinsic properties through exposure to variances in temperature. The worst case deviation of the printed board from flatness may be at room temperature, peak temperature during reflow, or at any temperature in between. Printed board flatness must therefore be characterized during the entire reflow thermal cycle, and not solely at room...

IPC-9301 - Standard Only

Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability

Document #:
IPC/JEDEC-9301
Revision
Original Version
Product Type
Standard Only
Released:  01/15/2019
Language
English
Current Revision
The IPC/JEDEC-9301document is an effort to standardize and document some of the basic tenets of a typical Finite Element Analysis (FEA) model, as well as, to educate new designers (and in some cases even experienced designers) on the basic information and best practices that should be captured and provided to technical reviewers of the results of FEA data.

IPC-9702 - Standard with Amendment 1

Monotonic Bend Characterization of Board-Level Interconnects

Document #:
IPC-9702
Revision
Original Version
Product Type
Standard with amendment(s)
Released:  08/18/2015
Language
English
Current Revision
This publication is intended to characterize the frature strength of a component's board level-interconnect by providing a common method of establishing the fracture resistance to flexural loading that may occur during conventional non-cyclic board assembly and test operations. The document is applicable to surface mount components attached to printed wiring boards using conventional solder reflow...
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IPC-T-50- Revision N - Standard Only

电子电路互连与封装术语及定义

Document #:
IPC-T-50
Revision
N
Product Type
Standard Only
Released:  01/13/2023
Language
Chinese
Current Revision
IPC-T-50N-CN文件旨在为电子行业中常用的词汇和术语提供其定义。本文件所规定的定义充分详细地阐明了术语，以便以英语为第二语言的读者能够理解含义的细微之处。IPC-T-50N-CN包含550多个新的或修订的术语，包括通孔结构、表面贴装器件类型、焊料凸点、焊料合金、焊接、退润湿、电路板制造工艺和测试的新术语。

IPC-T-50 - Revision K - Standard Only

Begriffe und Definitionen für Leiterplatten und elektronische Baugruppen

Document #:
IPC-T-50
Revision
K
Product Type
Standard Only
Released:  02/03/2015
Language
German
Current Revision
Das unentbehrliche Nachschlagewerk für alle Verantwortlichen entlang der Wertschöpfungskette von elektronischen Produkten. Die Revision K enthält auf mehr als 120 Seiten, mehr als 220 neue und überarbeitete Begriffe und bildliche Darstellungen. Beispiele: Access Hole, Accelerated Equivalent Soak, Capture Land, Micro Via Technology, Plating Thief, Etchback, Resin Recession, Tape Automated Bonding...
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IPC-9707 - Amendment 1

Spherical Bend Test Method for Characterization of Board Level Interconnects

Document #:
IPC/JEDEC-9707
Revision
Original Version
Product Type
Amendment
Released:  05/01/2018
Language
English
Current Revision
IPC/JEDEC-9707-AM1 is an amendment which clarifies that the standard is only applicable to transient bending during short-term test operations. The standard specifies a common method of establishing strain limits of board-level device interconnects under spherical transient bending conditions, the worst-case flexure condition that can occur during conventional printed board/system assembly...
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IPC/WHMA-A-620 - Revision E - Standard Only

Anforderungen und Abnahmekriterien für Kabel- und Kabelbaum-Baugruppen

Document #:
IPC/WHMA-A-620
Revision
E
Product Type
Standard Only
Released:  03/05/2025
Language
German
Current Revision
IPC/WHMA-A-620E ist die einzige, im Branchenkonsens entwickelte Richtlinie für Anforderungen und Abnahmekriterien für Kabel- und Kabelbaum-Baugruppen. IPC/WHMA-A-620E beschreibt Materialien, Methoden, Tests und Abnahmekriterien für die Herstellung gecrimpter, mechanisch gesicherter oder gelöteter Verbindungen und die zu den Kabel- und Kabelbaum-Baugruppen zugehörigen Montageaktivitäten. IPC/WHMA-A...

IPC/JEDEC-J-STD-033 - Revision D - Standard Only

Manejo, embalaje, transporte y uso de componentes sensibles a la humedad/reflujo y/o al proceso

Document #:
IPC/JEDEC-J-STD-033
Revision
D
Product Type
Standard Only
Released:  02/18/2019
Language
Spanish
Current Revision
El IPC/JEDEC J-STD-033D proporciona a los fabricantes de dispositivos de montaje superficial y a los usuarios con métodos estandarizados para la manejo, embalaje, transporte y uso de componentes sensibles a la humedad/reflujo. Estos métodos ayudan a evitar daños por la absorción de humedad y por la exposición a las temperaturas de la soldadura por reflujo que pueden tener como resultado una...
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IPC/WHMA-A-620 - Revision E - Standard Only

Exigences et acceptabilité des assemblages de câbles et de faisceaux de fils

Document #:
IPC/WHMA-A-620
Revision
E
Product Type
Standard Only
Released:  04/29/2025
Language
French
Current Revision
IPC/WHMA-A-620E est la seule norme consensuelle de l’industrie pour les exigences et l’acceptation des assemblages de câbles et de faisceaux de fils. IPC/WHMA-A-620E décrit les matériaux, les méthodes, les tests et les critères d’acceptation pour la production d’ensembles interconnectés brasés, sertis et mécaniquement sécurisés, ainsi que les activités d’assemblage qui y sont associées pour...
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IPC/WHMA-A-620 - Revision E - Standard Only

Requisitos y aceptación para ensambles con cables compuestos y mazos/ arneses de cables

Document #:
IPC/WHMA-A-620
Revision
E
Product Type
Standard Only
Released:  05/02/2025
Language
Spanish
Current Revision
El IPC/WHMA-A-620E es el único estándar consensuado por el sector sobre Requisitos y aceptabilidad de ensambles de cables y mazos de cables. El estándar IPC/WHMA-A-620E describe los materiales, métodos, pruebas y criterios de aceptabilidad para la producción de interconexiones crimpadas, mecánicamente aseguradas o soldadas y las actividades de ensamble relacionadas que estén asociadas con...

IPC/WHMA-A-620 - Revision D - Standard Only

Godkendelseskrav for kabler og for produkter med wire harness

Document #:
IPC/WHMA-A-620
Revision
D
Product Type
Standard Only
Released:  11/20/2020
Language
Danish
Current Revision
IPC/WHMA-A-620D er den eneste industriudviklede standard for ” Godkendelseskrav for kabler og for produkter med wire harness”. IPC/WHMA-A-620D beskriver materialer, metoder, test og godkendelseskriterier for fremstilling af crimpede samlinger, mekanisk sikrede og loddede forbindelser samt de tilhørende monteringsprocesser som er forbundet med kabel og harness produkter. IPC/WHMA-A-620D blev...
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IPC/WHMA-A-620 - Revision E - Standard Only

ケーブルおよびワイヤーハーネス組立品の要求事項および許容基準 Requirements and Acceptance for Cable and Wire Harness Assemblies

Document #:
IPC/WHMA-A-620
Revision
E
Product Type
Standard Only
Released:  07/13/2023
Language
Japanese
Current Revision
IPC/WHMA-A-620Eは、ケーブルおよびワイヤーハーネス組立品の要求事項および許容基準に関する、唯一の業界合意文書(規格書)である。IPC/WHMA-A-620Eでは、ケーブルおよびハーネス組立品に関係する配線の圧着、機械的固定、またははんだ付を行うための材料、方法、試験、および許容基準、ならびに関連組立活動について説明している。 IPC/WHMA-A-620Eは、IPCおよびThe Wire Harness Manufacturers Association (WHMA) (IPCの関連団体)により作成されたものである。
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IPC/WHMA-A-620 - Revision D - Standard Only

Wymagania i akceptacje dla montażu kabli i wiązek przewodów

Document #:
IPC/WHMA-A-620
Revision
D
Product Type
Standard Only
Released:  03/12/2021
Language
Polish
Current Revision
IPC/WHMA-A-620D jest jedynym standardem branżowym dotyczącym Wymagań i Akceptacji dla Montażu Kabli i Wiązek Przewodów. IPC/WHMA-A-620D opisuje materiały, metody, testy i kryteria akceptacji dla tworzenia zagniatanych, mechanicznie zabezpieczonych i lutowanych połączeń oraz powiązanych czynności montażowych związanych z zespołami kabli i wiązek przewodów. IPC/WHMA-A-620D został opracowany przez...
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IPC-6012 - Revision F - Standard Only

リジッドプリント基板の認定および性能仕様

Document #:
IPC-6012
Revision
F
Product Type
Standard Only
Released:  03/15/2024
Language
Japanese
Current Revision
本仕様書は、リジッドプリント基板(片面/両面基板、めっきスルーホールが有る/無い基板、ブラインドビア/ベリードビアが有る/無い多層基板)およびメタルコア基板の認定と性能について規定するものである。本仕様書では、表面処理と表面めっきコーティングに関する要求事項や、導体、ホール/ビア、受入試験頻度、品質適合性、また、電気的・機械的・環境的な要求事項についても触れている。改版F(リビジョンF)では、プリント基板のキャビティ、銅ラップめっき、中間対象ランド、はんだ付性試験、ディウェッティング、マイクロセクション評価、内層めっき部、絶縁間隙、マイクロビア構造の信頼性問題など、新規要件や追加要件が多く採用されている。本書はIPC-6011と併せて使用する。IPC-6012Eに優先する。
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IPC-J-STD-020 - Revision F - Standard Only

非气密表面贴装器件（SMDs）的潮湿/再流焊敏感度分级

Document #:
IPC/JEDEC-J-STD-020
Revision
F
Product Type
Standard Only
Released:  11/27/2023
Language
Chinese
Current Revision
IPC/JEDEC J-STD-020F标准旨在确定对湿气诱发应力敏感的非气密表面贴装器件（SMD）的潮湿敏感度分级，从而能够对其进行正确地包装、储存和操作，以避免其在再流焊连接和/或维修操作时受到损坏。 IPC/JEDEC J-STD-020F标准可用于确定非密封SMD鉴定应使用的分类级别。通过该测试方法中的标准本身不足以保证长期可靠性。根据JESD22-A113，本文件为SMD生成的湿度敏感度等级（MSL）用于确定预处理的浸泡条件，以及如何根据J-STD-033正确包装、储存和处理SMD，以避免在组装回流焊连接和/或维修操作期间损坏。 对于可能对过程敏感的IC器件，请参考J-STD-075，以确定是否需要PSL（过程敏感等级）分类。
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IPC-6012 - Revision F - Standard Only

刚性印制板的鉴定及性能规范

Document #:
IPC-6012
Revision
F
Product Type
Standard Only
Released:  04/01/2024
Language
Chinese
Current Revision
此标准涵盖了刚性印制板的鉴定和性能要求，印制板类型包括单/双面板、带或不带镀覆孔、带或不带盲孔/埋孔和金属芯的多层板。该规范涉及最终产品和表面处理涂敷要求、导体、通孔/过孔、验收测试频次和质量一致性以及电气、机械和环境要求。IPC-6012F新增和修订了一些印制板的要求，例如背钻孔结构，选择性表面处理，铜包覆电镀，印制板阶梯槽，中间目标连接盘，可焊性测试，显微切片分析，以及热冲击和基于性能测试的微导通孔结构的可靠性问题等。 IPC-6012F与IPC-6011一起使用，取代IPC-6012E。
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IPC/WHMA-A-620 - Revision E - Standard Only

線纜及線束組件的要求與驗收Requirements and Acceptance for Cable and Wire Harness Assemblies

Document #:
IPC/WHMA-A-620
Revision
E
Product Type
Standard Only
Released:  11/01/2023
Language
Chinese (Zhōngwén)
Current Revision
IPC/WHMA-A-620E 是線纜及線束元件的要求與驗收的唯一行業共識標準。本標準描述了用於壓接、機械緊固或焊接互連的材料、方法、測試和可接受性標準以及其他線纜線束元件組裝活動的相關標準。 IPC/WHMA-A-620E由IPC和線束製造商協會（WHMA）（隸屬於IPC）共同開發
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Coming Soon

IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards