<div class="field field--name-name field--type-string field--label-hidden field__item">Standards

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Product Type

Released: 04/02/2024

Language

English

Current Revision

IPC J-STD-001J is recognized globally for its criteria on soldering processes and materials. Updated with participants from 27 countries providing input and expertise. IPC J-STD-001J is a must-have for those in the electronics industry with an interest in the process and acceptance criteria for electrical and electronic assemblies. IPC J-STD-001 is developed in synergy with IPC-A-610 and is...

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Revision

Product Type

Released: 02/06/2024

Language

English

Current Revision

The IPC-7711/21 guide provides procedures for rework, repair and modification of printed board assemblies, including tools and materials, common procedures, coating removal and graphics to assist the user.

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Revision

Product Type

Released: 05/01/2024

Language

English

Current Revision

IPC J-STD-004D standard prescribes general requirements for the classification and characterization of fluxes for high quality solder interconnections. IPC J-STD-004D standard may be used for quality control and procurement purposes.

Document #:

EIA/IPC/JEDEC-J-STD-002

Revision

Product Type

Released: 11/01/2017

Language

English

Current Revision

IPC-J-STD-002E prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs, and tabs. The IPC-J-STD-002E standard also includes a test method for the resistance to dissolution/dewetting of metallization. IPC-J-STD-002E is intended for use by both supplier and user...

Document #:

IPC-7095

Revision

Product Type

Released: 10/17/2024

Language

English

Current Revision

The IPC-7095E describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages. IPC-7095E provides the useful and practical information to those who use or are considering using BGAs. IPC-7095E provides descriptions on how to...

Document #:

IPC-7095

Revision

Product Type

Released: 07/09/2019

Language

English

Current Revision

The IPC-7095D-AM1 standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages. IPC-7095D-AM1 provides the useful and practical information to those who use or are considering using BGAs. IPC-7095D-AM1 provides...

Document #:

IPC-CM-770

Revision

Product Type

Released: 01/01/2004

Language

English

Current Revision

This revision provides effective guidelines in the preparation and attachment of components for printed circuit board assembly and reviews pertinent design criteria, impacts and issues. It contains techniques for assembly (both manual and machines including SMT, BGA and flip chip) and consideration of, and impact upon, subsequent soldering, cleaning, and coating processes. 150 pages. Revised...

Document #:

IPC-J-STD-005

Revision

Product Type

Released: 05/01/2024

Language

English

Current Revision

IPC J-STD-005B standard lists the requirements for qualification and characterization of solder paste. It references test methods, criteria, and metal content, viscosity, slump, solder ball, tack and wetting of solder pastes. Additional support is provided in IPC-HDBK-005, Guide to Solder Paste Assessment.

Document #:

IPC-7525

Revision

Product Type

Released: 02/28/2022

Language

English

Current Revision

The IPC-7525C standard provides guidance for the design and fabrication of stencils for solder paste and surface-mount adhesive with much of the content based on the experience of stencil designers, fabricators, and users.

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IPC-7530

Revision

Product Type

Released: 03/13/2025

Language

English

Current Revision

This document provides useful and practical information for developing thermal profiles to produce acceptable SnPb and Pb-free electronics assemblies using reflow, vapor phase, laser, selective and wave soldering equipment. The document also includes a troubleshooting guide for addressing common defects which can be attributed to profiling.

Document #:

IPC-7526

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Product Type

Released: 04/12/2022

Language

English

Current Revision

IPC-7526A handbook addresses understencil cleanliness during stencil printing, removal of solder paste from stencils following the cleaning process and misprint PCB board cleaning considerations.

Document #:

IPC-7093

Revision

Product Type

Released: 11/30/2020

Language

English

Current Revision

The IPC-7093A standard provides essential design and assembly guidance for implementing bottom termination components (BTCs). Specifically, IPC-7093A provides guidelines on critical design, materials, assembly, inspection, repair, quality, and reliability issues associated with BTCs.

Document #:

IPC-J-STD-006

Revision

Product Type

Released: 05/26/2017

Language

English

Current Revision

This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon and powder solders for electronic soldering applications; and for ‘‘special’’ electronic grade solders. This is a quality control standard and is not intended to relate directly to the material’s performance in the manufacturing process. Solders for...

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Revision

Product Type

Released: 02/15/2023

Language

English

Current Revision

The IPC J-STD-004C WAM1 standard prescribes general requirements for the classification and characterization of fluxes for high quality solder interconnections. The IPC J-STD-004C WAM1 standard may be used for quality control and procurement purposes. Soldering flux materials include the following: liquid flux, paste flux, solder paste, solder cream as well as flux-coated and flux-cored solder...

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IPC-A-640

Revision

Product Type

Released: 05/31/2022

Language

English

Current Revision

The IPC-A-640A standard provides acceptance requirements and technical insight that have been removed from acceptance standards for cable and wire harness assemblies incorporating optical fiber, optical cable and hybrid wiring technology. The IPC-A-640A is intended for use by the design engineer, manufacturing engineer, quality engineer and other individuals responsible for tailoring specific...

Document #:

IPC-D-640

Revision

Product Type

Released: 05/31/2022

Language

English

Current Revision

The IPC-D-640A standard provides design and critical process requirements and technical insight for cable and wire harness assemblies incorporating optical fiber, optical cable and hybrid wiring technology. The IPC-D-640A standard is intended to provide information on the general design requirements for optical fiber, optical cable, hybrid wiring harness assemblies, and Fiber Optic Communications...

Document #:

IPC-7091

Revision

Product Type

Released: 01/13/2023

Language

English

Current Revision

This document describes the design and assembly challenges and ways to address those challenges for implementing 3D component technology. Recognizing the eﬀects of combining multiple uncased semiconductor die elements in a single-package format can impact individual component characteristics and can dictate suitable assembly methodology. The information contained in this standard focuses on...

Document #:

IPC-7094

Revision

Product Type

Released: 02/14/2018

Language

English

Current Revision

IPC-7094A describes the design and assembly challenges for implementing flip chip technology in a direct chip attach (DCA) assembly. The effect of bare-die or die-size components in a flip chip format has an impact on component characteristics and dictates the appropriate assembly methodology. The IPC-7094A standard focuses on design, assembly methodology, critical inspection, repair and...

Document #:

IPC-J-STD-003

Revision

Product Type

Released: 10/02/2017

Language

English

Current Revision

The IPC-J-STD-003C-WAM1&2 standard prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands and plated-through holes (PTHs). The IPC-J-STD-003C-WAM1&2 standard is not intended to verify the potential of successful processing at assembly or to evaluate design impact on wettability. The IPC-J-STD-003C-WAM1&2...

Document #:

IPC-PE-740

Revision

Product Type

Released: 12/01/1997

Language

English

Current Revision

This is the document all process engineers must have! Useful for day-to-day problem solving, it contains case histories of problems and corrective action in the design, manufacture, assembly and testing of printed wiring products. Each section has been updated to reflect today's manufacturing challenges. Sections address documentation, phototooling, raw materials, mechanical operations, hole...

Document #:

IPC-9261

Revision

Product Type

Released: 10/01/2006

Language

English

Current Revision

Now updated to align with IPC-7912A for end item DPMO, this document defines consistent methodologies for computation of in-process defects per million opportunities (DPMO) metrics for any evaluation stage in the assembly process. It is intended for use in measuring in-process assembly steps rather than end product determination. Calculation of completed item DPMO is addressed in IPC-7912A. A...

Document #:

IPC-J-STD-006

Revision

Product Type

Amendment

Released: 11/02/2017

Language

English

Current Revision

The J-STD-006C-AM1 amendment provides better detail of a solder alloy's maximum allowed deviation about the nominal level of the element's mass than was provided in past alloy standards. The J-STD-006C-AM1 amendment provides information on negative effects of adding rare earth elements to specific, heavy tin-containing, lead-free solder alloys and propensity of tin whisker formation. Finally, the...

Document #:

Revision

Product Type

Amendment

Released: 08/05/2020

Language

English

Current Revision

Amendment 1 to IPC-7711/21C, the document provides procedures for removal and installation of D-Pak components

Document #:

Revision

Product Type

Released: 04/27/2023

Language

English

Current Revision

The IPC-A-610HC Telecom Addendum to IPC-A-610H Acceptability of Electronic Assemblies provides specific requirements for telecommunications products when it is specifically required by procurement documentation. Information in this document either supplements or replaces specifically identified requirements of IPC-A-610 Revision H by providing additional requirements to ensure that electrical and...

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Revision

Product Type

IPC-J-STD-001 and IPC-A-610

Released: 01/22/2025

Language

English

Current Revision

IPC J-STD-001JS Space and Military Addendum supplements or replaces specifically identified requirements of IPC J-STD-001J requirements for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space and military applications.

Document #:

Revision

Product Type

Released: 09/30/2025

Language

English

Current Revision

IPC J-STD-001JA/IPC-A-610JA is the automotive addendum to J-STD-001J and IPC-A-610J. It provides criteria to ensure the reliability of soldered automotive electrical and electronic assemblies in the field under harsh environments and considers automated high-volume production. IPC J-STD-001JA/IPC-A-610JA addendum is not a standalone document, and it must be used in conjunction with J-STD-001J and...

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Revision

Product Type

Released: 05/31/2022

Language

English

Current Revision

IPC-A-610G-R rail transit addendum provides additional requirements to IPC-A-610G base standard, specifying a standardized set of acceptance criteria unique to electronic assemblies used in the rigorous micro-environment under high mechanical and environmental stresses associated with high railway equipment, to ensure industry-specific high reliability and environmental adaptability of electronic...

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Revision

Product Type

Released: 04/11/2024

Language

English

Current Revision

IPC-A-610H to IPC-A-610J redline document shows the changes from IPC-A-610H to IPC-A-610J in a side-by-side comparison of the two documents. The IPC-A-610J redline is only available in electronic format, it is not available in hardcopy. As a comparison document it does not replace the standard.

Document #:

Revision

Product Type

Released: 10/07/2020

Language

English

Current Revision

IPC-A-610H Redline document shows the changes from IPC-A-610G to IPC-A-610H in a side-by-side comparison of the two documents. The IPC-A-610H redline is only available in electronic format, it is not available in hardcopy

Document #:

Revision

Product Type

Released: 10/07/2020

Language

English

Current Revision

IPC-J-STD-001H redline shows the changes from J-STD-001G to J-STD-001H in a side-by-side comparison of the documents. The IPC-J-STD-001H redline is only available in electronic format, hardcopy is not available. NOTE: J-STD-001G Am 1 is not included in this redline.

Document #:

Revision

Product Type

Released: 02/20/2025

Language

English

Current Revision

J-STD-001JS Redline document shows the changes from J-STD-001HS to J-STD-001JS in a side-by-side comparison of the two documents. The J-STD-001JS redline is only available in electronic format, it is not available in hardcopy.

Document #:

Revision

Product Type

Released: 04/11/2024

Language

English

Current Revision

The IPC J-STD-001H to IPC J-STD-001J Redline Comparison Document is a redline document showing the changes from J-STd-001H to J-STD-001J. The IPC J-STD-001H to IPC J-STD-001J Redline Comparison Document is only available in digital format and provides a side-by-side comparison of the two documents.

Document #:

IPC-7527

Revision

Original Version

Product Type

Released: 05/17/2012

Language

English

Current Revision

This standard is a collection of visual quality acceptability criteria for solder paste printing. It provides a standardized language for solder paste characterization. It provides users with common descriptions and potential causes for solder paste deposits. The standard provides valuable insights to the solder paste printing operations which can be used in troubleshooting of the printing process...

Document #:

IPC-TM-650

Revision

Original Version

Product Type

Language

English

Current Revision

Contains over 150 industry approved test techniques and procedures for chemical, mechanical, electrical, and environmental tests on all forms of printed boards and connectors. New and updated test methods are available for download at https://www.ipc.org/test-methods.

Document #:

IPC-T-50

Revision

Product Type

Released: 11/25/2025

Language

English

Current Revision

This document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing English as a second language could understand the subtleties of the meaning. Revision P contains over 120 new or revised terms, including new terminology for back-drill structures, cable and wire...

Document #:

IPC-A-630

Revision

Original Version

Product Type

Released: 10/04/2013

Language

English

Current Revision

This standard is the first of its kind for IPC; the first acceptability standard for electronic enclosures. It contains acceptability criteria that pertain to the "box build" of the assembly process. This standard has been written to direct manufacturers and end users of electronic enclosures of electrical and electronic equipment to understand the best practices to meet requirements, ensuring the...

Document #:

IPC-9111

Revision

Original Version

Product Type

Released: 02/13/2019

Language

English

Current Revision

The IPC-9111 handbook is a valuable resource for anyone involved in manufacturing or purchasing printed board assemblies. Issues in the assembly process are presented along with possible causes and actions to take to resolve them. Photos are provided throughout the document to assist the reader. IPC-9111 supersedes the printed board assembly sections of IPC-PE-740A.

Document #:

IPC-SM-784

Revision

Original Version

Product Type

Released: 11/01/1990

Language

English

Current Revision

Discusses chip types, board selection, design issues and thermal transfer methods for Chip on Board (COB) applications. Details wire bonding, TAB and flip chip designs and provides information on mounting materials, including adhesives, wires and various mechanical bonding techniques. 37 pages. Released November 1990.

Document #:

IPC-0040

Revision

Original Version

Product Type

Released: 05/01/2003

Language

English

Current Revision

This document addresses the implementation of optical and optoelectronic packaging technologies. The areas discussed include: technology choices, design considerations, material properties, component mounting and interconnecting structures, assembly processes, testing, application, rework, and reliability of completed optoelectronic products. Optoelectronic packaging technologies include active...

Document #:

IPC-SMEMA 7

Revision

Original Version

Product Type

Released: 02/12/2007

Language

English

Current Revision

This document is intended to clarify terms used in the area of fluid dispensing. As is often the case, different terms are used by different manufacturers to convey a similar meaning. Common interchangeable terms are shown in parenthesis and the reader should not infer one term is preferred over the other.

Document #:

IPC-9716

Revision

Original Version

Product Type

Released: 01/10/2025

Language

English

Current Revision

IPC-9716 provides requirements for automated optical inspection (AOI) systems to define, set up, establish, and apply process control for manufacturing printed board assemblies, including general and specific process and AOI system conditions. Requirements include inspection parameters, lighting conditions, calibration, detectability, resolution, threshold limits, program setups, measurement...

Document #:

IPC-5262

Revision

Original Version

Product Type

Released: 10/17/2022

Language

English

Current Revision

The IPC-5262 prescribes the minimum design, critical process and acceptance requirements for the application of polymeric materials to electrical/electronic components, modules, printed wiring assemblies and other elements thereof. The intent of IPC-5262 is to establish a baseline of requirements, procedures, practices and process attributes based on lessons learned and best practices that have...

Document #:

IPC-S-816

Revision

Original Version

Product Type

Released: 07/01/1993

Language

English

Current Revision

Why waste time looking for answers? This handy, easy-to-use troubleshooting guide lists all types of processing problems and solutions for surface mount assembly. Covers bridging, skips, misalignment, placement and more. 38 pages. Released July 1993.

Document #:

IPC/EIA-J-STD-026

Revision

Original Version

Product Type

Released: 08/01/1999

Language

English

Current Revision

This standard addresses semiconductor flip chip design requirements. Provides information for using standard semiconductor substrates, materials, assembly and test methods with established fabrication, bumping, test and handling practices. Electrical, thermal and mechanical chip design parameters and methodologies are covered in the standard, as well as the reliability aspects associated with...

Document #:

ECA/IPC/JEDEC-J-STD-075

Revision

Original Version

Product Type

Released: 09/03/2008

Language

English

Current Revision

J-STD-075 picks up where J-STD-020 left off by providing test methods to classify worst-case thermal process limitations for electronic components. Classification is referenced to common industry wave and reflow solder profiles including lead-free processing. The classifications represent maximum process sensitivity levels and do not establish rework conditions or recommended processes for an...

Document #:

IPC-SM-780

Revision

Original Version

Product Type

Released: 07/01/1988

Language

English

Current Revision

This document examines key issues in advanced packaging techniques. Provides information on what types of parts are available, the techniques and processes necessary for their proper use, possible advantages/disadvantages or problems, how to start implementation and where to find additional information. 138 pages. Released March 1988.

Document #:

JEDEC/IPC-JP002

Revision

Original Version

Product Type

Released: 03/01/2006

Language

English

Current Revision

This document will provide insight into the theory behind tin whisker formation as it is known today and, based on this knowledge, potential mitigation practices that may delay the onset of, or prevent tin whisker formation. The potential effectiveness of various mitigation practices will also be briefly discussed. References behind each of the theories and mitigation practices are provided. It...

Document #:

IPC-CI-408

Revision

Original Version

Product Type

Released: 01/01/1994

Language

English

Current Revision

Provides information on design characteristics and the application of solderless surface mount connectors, including conductive adhesives to aid IC package and board interconnection. 34 pages. Released January 1994.

Document #:

IPC-FA-251

Revision

Original Version

Product Type

Released: 02/01/1992

Language

English

Current Revision

Guidelines for the assembly of components and mounting hardware to single- and double-sided flexible printed wiring. These guidelines describe the type of materials and processes that may be used to accomplish proper electronic assembly. 30 pages. Released February 1992.

Document #:

Revision

Product Type

Released: 02/06/2024

Language

English

Current Revision

This redline provides a side-by-side comparison the changes from Revision C to Revision D of IPC-7711/21.

Document #:

IPC-7621

Revision

Original Version

Product Type

Released: 02/14/2018

Language

English

Current Revision

Encapsulation, for the purpose of IPC-7621 standard, is defined as a low pressure molded thermoplastic, e.g., polyamide, which is brought to a liquid state and injection molded and (rather quickly) returned to a temperature below its melting point., forming a durable yet pliable (rubbery-like) form. The desired performance characteristics of low pressure molding (LPM) encapsulation depend on the...

Document #:

IPC-TP-1114

Revision

Original Version

Product Type

Released: 01/01/1998

Language

English

Current Revision

Originally developed for J-STD-001B, it is also applicable to current assembly standards. Electronics manufacturers are faced with the difficult task of proving that a candidate manufacturing process can produce acceptable hardware, either to the customer of the product, or for internal quality control. Users have to determine many of the process qualification steps on their own. This document...

Document #:

IPC-1331

Revision

Original Version

Product Type

Released: 03/01/2000

Language

English

Current Revision

This voluntary standard establishes minimum requirements for the design, installation, operation and maintenance of electrically heated process equipment in order to minimize electrical hazards and prevent fires that may occur in combustible tanks, tank liners and drying equipment.

Document #:

IPC-T-50

Revision

Product Type

Released: 01/13/2023

Language

Chinese

Current Revision

IPC-T-50N-CN文件旨在为电子行业中常用的词汇和术语提供其定义。本文件所规定的定义充分详细地阐明了术语，以便以英语为第二语言的读者能够理解含义的细微之处。IPC-T-50N-CN包含550多个新的或修订的术语，包括通孔结构、表面贴装器件类型、焊料凸点、焊料合金、焊接、退润湿、电路板制造工艺和测试的新术语。

Document #:

IPC-T-50

Revision

Product Type

Released: 02/03/2015

Language

German

Current Revision

Das unentbehrliche Nachschlagewerk für alle Verantwortlichen entlang der Wertschöpfungskette von elektronischen Produkten. Die Revision K enthält auf mehr als 120 Seiten, mehr als 220 neue und überarbeitete Begriffe und bildliche Darstellungen. Beispiele: Access Hole, Accelerated Equivalent Soak, Capture Land, Micro Via Technology, Plating Thief, Etchback, Resin Recession, Tape Automated Bonding...

Document #:

Revision

Product Type

Released: 05/13/2021

Language

Spanish

Current Revision

IPC-J-STD-001H es reconocido mundialmente por sus criterios sobre procesos y materiales de soldadura. Actualizado con participantes de 27 países que proporcionan información y experiencia, la norma IPC-J-STD-001H trae los últimos criterios a la industria, incluyendo pautas sobre el uso de rayos X para inspeccionar condiciones de soldadura en orificios con soporte que no son visibles bajo ningún...

Document #:

Revision

Product Type

Released: 08/11/2021

Language

Spanish

Current Revision

IPC-A-610H es la norma de aceptación de ensambles electrónicos más utilizada en la industria electrónica. La norma IPC-A-610H incluye una actualización general del documento, introduce varios nuevos tipos de componentes de montaje en superficie y elimina las condiciones ideales. Participantes de 29 países proporcionaron su apoyo y conocimientos especializados para traer este documento a la...

Document #:

Revision

Product Type

Released: 07/27/2021

Language

Danish

Current Revision

IPC-A-610H er den mest udbredte godkendelsesstandard for elektronikprodukter i elektronikindustrien. IPC-A-610H standarden inkluderer en generel opdatering af dokumentet, introducere flere nye overflademonterede komponenttyper og fjerner ”Ønskelig” tilstand. Deltagere fra 29 lande leverede deres input og ekspertise til at bringe dette dokument til elektronikindustrien. Dette er en ”skal have”...

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Revision

Product Type

Released: 03/08/2021

Language

German

Current Revision

IPC-J-STD-001H-DE ist weltweit anerkannt für seine Kriterien zu Lötprozessen und -materialien. Die Richtlinie IPC-J-STD-001H-DE wurde unter Mitwirkung von Teilnehmern aus 27 Ländern aktualisiert, die ihre Beiträge und ihr Fachwissen zur Verfügung gestellt haben. Sie enthält die neuesten Kriterien für die Branche, einschließlich einer Anleitung für die Verwendung von Röntgensystemen zur Inspektion...

Document #:

Revision

Product Type

Released: 01/08/2026

Language

Spanish

Current Revision

La norma J-STD-001J es reconocida mundialmente por sus criterios relacionados con los procesos y materiales de soldadura. Se ha actualizado gracias a las contribuciones y la experiencia de participantes de 27 países. La norma J-STD-001J es esencial para todos los profesionales de la industria electrónica interesados en los criterios de proceso y aceptación para ensambles eléctricos y electrónicos...

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Revision

Product Type

Released: 01/05/2026

Language

French

Current Revision

La norme J-STD-001J est reconnue mondialement pour ses critères relatifs aux procédés et matériaux de soudage. Elle a été mise à jour grâce aux contributions et à l'expertise de participants issus de 27 pays. La norme J-STD-001J est indispensable pour tous les professionnels de l'industrie électronique intéressés par les critères de processus et d'acceptation des assemblages électriques et...

Document #:

Revision

Product Type

Released: 05/04/2022

Language

Danish

Current Revision

IPC-J-STD-001H anerkendes globalt for sine kriterier for loddeprocesser og materialer. Opdateret med input og ekspertise leveret af deltagere fra 27 lande, IPC-J-STD-001H standarden indeholder de nyeste kriterier til industrien, inklusiv vejledning om anvendelse af røntgen til inspektion af hulmonterede lodninger, som ikke er synlige på anden måde.IPC-J-STD-001H er et must for folk i...

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Revision

Product Type

Released: 04/12/2022

Language

Czech

Current Revision

IPC-A-610H je nejpoužívanější standard pro provádění přejímek elektronických sestav. Standard IPC-A-610H obsahuje obecnou aktualizaci dokumentu, představuje několik nových typů komponent pro povrchovou montáž, a odstraňuje cílové podmínky. Účastníci z 29 zemí poskytli své příspěvky a odborné znalosti, aby tento dokument přinesli elektronickému průmyslu.

Jde o nepostradatelnou příručku pro...

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Revision

Product Type

Released: 09/30/2025

Language

Korean

Current Revision

J-STD-001J는 솔더링 공정과 재료에 대한 기준으로 세계적인 인정을 받는다. 정보와 전문지식을 제공하는 27개국의 참여자가 갱신 작업을 진행했다. J-STD-001J는 전기 및 전자 조립품 공정과 허용기준에 관심 있는 전자 산업 종사자가 반드시 소지해야 하는 것이다. J-STD-001은 IPC-A-610과 호환하도록 개발되었으며 요구조건에 대한 추가 정보와 설명을 원하는 사람은 IPC-HDBK-001을 확인할 수 있다. J-STD-001J를 구입한다면 IPC-A-610J도 구입하는 것이 바람직하다. 이 두 표준서를 함께 사용하면 전기 및 전자 조립품 제조 공정과 육안 검사 허용기준을 확인할 수 있다.

Document #:

Revision

Product Type

Released: 04/21/2021

Language

Chinese

Current Revision

IPC-A-610H是电子行业广泛采用的电子组件验收标准。IPC-A-610H标准中包含了本文件的一般更新内容，介绍了一些新型表面贴装元器件，同时删除了目标条件。本文件在电子行业成功问世离不开来自29个国家/地区的参与者，这些参与者在本文件编制期间投入了大量的精力并贡献了宝贵的专业知识。该标准是检查人员、操作人员及其他与电子组件验收要求相关的人员必须掌握的技术标准。与IPC-A-610一起制定的标准还有J-STD-001和IPC/WHMA-A-620。

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Released: 04/29/2025

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Thai

Current Revision

J-STD-001J ได้รับการยอมรับทั่วโลกในด้านเกณฑ์สำหรับกระบวนการบัดกรีและวัสดุ มีผู้เข้าร่วมจาก 27 ประเทศที่ให้ข้อมูลและความเชี่ยวชาญ J-STD-001J เป็นสิ่งที่ต้องมีสำหรับผู้ที่อยู่ในอุตสาหกรรมอิเล็กทรอนิกส์ที่สนใจในกระบวนการและเกณฑ์การยอมรับสำหรับการประกอบชิ้นส่วนไฟฟ้าและอิเล็กทรอนิกส์ J-STD-001 ได้รับการพัฒนาควบคู่ไปกับ IPC-A-610 และได้รับการสนับสนุนโดย IPC-HDBK-001...

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Released: 04/10/2025

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Vietnamese

Current Revision

J-STD-001J được công nhận trên toàn cầu về các tiêu chuẩn liên quan đến vật liệu và quy trình hàn . Được cập nhật với sự tham gia của các thành viên từ 27 quốc gia cung cấp thông tin đầu vào và chuyên môn. J-STD-001J là tài liệu bắt buộc dành cho những người trong ngành điện tử quan tâm đến quy trình và tiêu chuẩn chấp nhận đối với các cụm lắp ráp điện và điện tử. J-STD-001 được phát triển kết hợp...

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Released: 01/27/2025

Language

Chinese (Zhōngwén)

Current Revision

J-STD-001J 是全球公認的焊接工藝和材料標準。根據來自27個國家的參與者提供的意見和專業知識進行更新。 J-STD-001J 是電子行業中對電氣和電子元件的工藝和驗收標準感興趣的人員的必備工具。J-STD-001 是與 IPC-A-610 協同開發的，並得到 IPC-HDBK-001 的支援，供那些需要更多資訊和要求解釋的人使用。如果您購買了 J-STD-001J，還應該購買和使用 IPC-A-610J，因為它們可以一起使用，為電氣和電子元件的製造提供工藝和外觀驗收標準。

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Released: 01/10/2025

Language

Chinese

Current Revision

J-STD-001J 是全球公认的焊接工艺和材料标准。根据来自27个国家的参与者提供的意见和专业知识进行更新。 J-STD-001J 是电子行业中对电气和电子组件的工艺和验收标准感兴趣的人员的必备工具。J-STD-001 是与 IPC-A-610 协同开发的，并得到 IPC-HDBK-001 的支持，供那些需要更多信息和要求解释的人使用。如果您购买了 J-STD-001J，还应该购买和使用 IPC-A-610J，因为它们可以一起使用，为电气和电子组件的制造提供工艺和外观验收标准。

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Released: 12/17/2024

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Japanese

Current Revision

J-STD-001Jは、電気および電子組立品の工程と受入基準に関心のあるエレクトロニクス業界関係者にとって必携の書である。 J-STD-001はIPC-A-610と共に開発されたものであり、要求事項に関する追加情報や説明についてはIPC-HDBK-001で補足されている。IPC-A-610Jでは電気および電子組立品の工程と外観の合格基準が提供されているため、J-STD-001Jを購入する際にはIPC-A-610Jも併せて購入することをお勧めする。

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Released: 05/04/2022

Language

Dutch

Current Revision

IPC-A-610 is het meest gebruikte acceptatiedocument voor elektronica-assemblage. Bijgewerkt met deelnemers uit 17 landen die input en expertise leveren, brengt dit document de nieuwste criteria samen met veel nieuwe en herziene grafische afbeeldingen uit de industrie. Dit is een must-have voor inspecteurs, operators en anderen die geïnteresseerd zijn in de acceptatiecriteria voor elektronische...

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Released: 05/31/2022

Language

Turkish

Current Revision

IPC-J-STD-001H, lehimleme prosesleri ve malzemeleri konusundaki kriterleri ile dünya çapında tanınmaktadır. 27 ülkeden girdi ve uzmanlık sağlayan katılımcılarla güncellenen IPC-J-STD-001H standardı, başka hiçbir şekilde görülemeyen delik-içi lehim koşullarının denetlenmesi için x-ışını kullanımına ilişkin rehberlik te dahil olmak üzere sektöre en son kriterleri getirmektedir. IPC-J-STD-001H...

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Released: 01/10/2022

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Vietnamese

Current Revision

IPC-J-STD-001H Được công nhận trên toàn cầu về tiêu chuẩn cho các quy trình hàn và các nguyên vật liệu. Được cập nhật với những người tham gia từ 27 quốc gia cung cấp đầu vào và ý kiến chuyên môn, tiêu chuẩn IPC-J-STD-001H mang đến các tiêu chuẩn mới nhất cho ngành công nghiệp cùng với hướng dẫn sử dụng tia X để kiểm tra các tình trạng mối hàn xuyên lỗ mà không thể kiểm tra được bằng các phương...

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Released: 01/10/2022

Language

Korean

Current Revision

IPC-A-610H는 전자 산업에서 가장 널리 사용되는 전자 어셈블리 허용 표준이다. IPC-A-610H 표준은 문서에 대한 일반 업데이트를 포함하며, 몇 가지 새로운 표면 실장 소자 유형을 도입하고 대상 조건을 제거한다. 29개국에서 온 참가자들은 이 문서를 전자 산업에 가져오기 위해 그들의 조언과 전문지식을 제공했다. 이는 전자 어셈블리의 허용 기준에 관심이 있는 검사자, 작업자 및 기타 사용자에게 반드시 필요한 사항이다. IPC-A-610은 J-STD-001 및 IPC/WHMA-A-620과 함께 개발되었다.

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Released: 04/12/2022

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Hungarian

Current Revision

Az IPC-A-610 a világon legszélesebb körben használt elektronikai szerelvényekkel foglalkozó szabvány. Az IPC-A-610H szabvány jó néhány dokumentum általános frissítését tartalmazza, számos új felületszerelt alkatrésztípus követelményeivel kiegészült és megszüntetésre került a cél állapot kritérium. A szabvány 29 országból beérkező újabb észrevételek, szakvélemények alapján biztosítja az...

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Released: 03/12/2021

Language

Chinese

Current Revision

IPC-J-STD-001H是全球公认的焊接工艺和材料标准。此次更新由27个国家/地区参与者参与编制，这些参与者在本文件更新期间投入了大量的精力并贡献了宝贵的专业知识。IPC-J-STD-001H标准是业内最新标准，包含了有关使用X射线方法检查其他方法难以检测的通孔焊料状况的指导信息。 IPC-J-STD-001H是关注电子行业电气和电子组件工艺和验收标准的人员必须掌握的技术标准。 J-STD-001是与IPC-A-610一起制定的标准，由IPC-HDBK-001提供支持，其中包含了一些额外信息和要求释义。如果您已购买了IPC-J-STD-001H，您还需要购买并使用IPC-A-610H，二种标准需要配合使用。

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Released: 09/16/2021

Language

Vietnamese

Current Revision

IPC-A-610 là tiêu chuẩn chấp nhận sản phẩm lắp ráp điện tử được sử dụng rộng rãi nhất trong ngành công nghiệp điện tử. Tiêu chuẩn IPC-A-610H bao gồm một cập nhận tổng quát, giới thiệu một số loại linh kiện SMT mới và loại bổ tình trạng mục tiêu. Những người tham gia từ 29 quốc gia cung cấp đầu vào và ý kiến chuyên môn để mang đến tài liệu này cho ngành công nghiệp điện tử. Đây là bộ tiêu chuẩn...

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Released: 04/12/2022

Language

Romanian

Current Revision

IPC-A-610H este cel mai folosit standard de acceptabilitate pentru asamblare electronice din industria electronică. Standardul IPC-A-610H include o actualizare generală a documentului, introduce mai multe tipuri noi de componente cu montare pe suprafață și elimină condițiile Obiectiv. Participanții din 29 de țări și-au adus contribuția și expertiza lor pentru a da acest document industriei...

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Released: 03/01/2022

Language

Thai

Current Revision

IPC-A-610H เป็นมาตรฐานการยอมรับการประกอบอุปกรณ์อิเล็กทรอนิกส์ที่ใช้กันอย่างแพร่หลายมากที่สุดในอุตสาหกรรมอิเล็กทรอนิกส์ มาตรฐาน IPC-A-610H มีการอัพเดตทั่วไปในเอกสาร, แนะนำตัวอุปกรณ์ที่ติดตั้งบนพื้นผิวประเภทใหม่ๆ หลายประเภท และลบสภาวะเป้าหมายออกไป ผู้เข้าร่วมจาก 29 ประเทศได้ให้ข้อมูลและความเชี่ยวชาญเพื่อนำเอกสารนี้ไปสู่อุตสาหกรรมอิเล็กทรอนิกส์ นี่เป็นสิ่งที่ต้องมีสำหรับผู้ตรวจสอบ ผู้ปฏิบัติงาน...

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Revision

Product Type

Released: 03/01/2022

Language

Thai

Current Revision

IPC-J-STD-001H เป็นที่ยอมรับทั่วโลกในด้านเกณฑ์กระบวนการและวัสดุในการบัดกรี อัปเดตด้วยผู้เข้าร่วมจาก 27 ประเทศที่ให้ข้อมูลและความเชี่ยวชาญ มาตรฐาน IPC-J-STD-001H นำเกณฑ์ล่าสุดมาสู่อุตสาหกรรม รวมถึงคำแนะนำเกี่ยวกับการใช้เอ็กซ์เรย์เพื่อตรวจสอบสภาพการบัดกรีผ่านรูที่มองไม่เห็นโดยวิธีอื่น IPC-J-STD-001H...

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Revision

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Released: 04/09/2020

Language

Russian

Current Revision

Описание на русском IPC-A-610 – наиболее широко используемый в мире стандарт по приемке электронных сборок. Этот документ, в усовершенствование которого внесли свой вклад участники из 17 стран, поделившись информацией и своими знаниями и опытом, предоставляет отрасли новейшие критерии наряду со множеством новых и обновленных иллюстраций. Этот документ – то, что обязательно нужно иметь контролерам...

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Released: 06/27/2025

Language

French

Current Revision

Le guide IPC-7711/21 fournit des procédures de reprise, réparation et modification des assemblages de circuits imprimées, y compris des outils et des matériaux, des procédures courantes, le retrait du revêtement et des graphiques pour aider l'utilisateur.

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Released: 01/05/2026

Language

Spanish

Current Revision

La guía IPC-7711/21 proporciona procedimientos para reelaborar, reparar y modificar conjuntos de placas de circuitos impresos, incluidas herramientas y materiales, procedimientos comunes, eliminación de revestimiento y gráficos para ayudar al usuario.

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Revision

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Released: 02/18/2019

Language

Polish

Current Revision

J-STD-001 jest uznawany globalnie za swoje kryteria dla procesów lutowania i materiałów lutowniczych. Uaktualniony przez uczestników z 18 krajów, dostarczających danych wejściowych i wiedzy specjalistycznej, niniejszy dokument dostarcza przemysłowi najnowszych kryteriów wraz z nowymi grafikami dla łatwości użycia i zrozumienia. Dokument ten musi mieć każdy w przemyśle elektronicznym, kto jest...

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Product Type

Released: 11/09/2015

Language

Swedish

Current Revision

IPC-A-610 är den mest använda standarden i världen för elektroniktillverkning och är ett måste för alla kvalitetssäkrings- och produktionsavdelningar. IPC-A-610F illustrerar industrigodkända acceptanskriterier för kretskort genom detaljerad text som beskriver tillstånd för acceptabelt och defekt, med stöd av fyrfärgsbilder och illustrationer. Denna revision inkluderar två nya typer av...

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Released: 08/21/2025

Language

Japanese

Current Revision

本規格書は、高品質のはんだ相互接続に使用するフラックスの分類および特性評価に関し、一般的な要求事項を規定するものである。本規格書は、品質管理および調達目的のために使用することも可能である。

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Released: 06/27/2025

Language

German

Current Revision

Der Leitfaden IPC-7711/21 enthält Verfahren für die Nacharbeit, Reparatur und Änderung von Leiterplatten-Baugruppen, einschließlich Werkzeugen und Materialien, häufig angewendete Verfahren, Entfernung der Beschichtung und Grafiken zur Unterstützung des Benutzers.

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Released: 10/25/2024

Language

Chinese (Zhōngwén)

Current Revision

這份指南提供了對使用者有説明的印製板元件的返工，維修和修改程式，包含工具和材料，通用程式，塗敷的清除和圖形

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Product Type

Released: 09/04/2024

Language

Japanese

Current Revision

このガイドは、プリント基板組立品のリワーク、リペアおよび改造の手順について紹介するものである。工具や材料、一般的な手順、コーティングの除去方法、およびユーザーの助けとなるようなグラフィック等が掲載されている

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Product Type

Released: 09/04/2024

Language

Chinese

Current Revision

这份指南提供了对使用者有帮助的印制板组件的返工，维修和修改程序，包含工具和材料，通用程序，涂敷的清除和图形

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Released: 05/23/2025

Language

Chinese

Current Revision

本标准规定了高质量焊接互连用助焊剂的分类和特性描述的通用要求。本标准可用于助焊剂的质量控制和采购用途。

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Released: 03/18/2025

Language

Thai

Current Revision

คู่มือนี้ให้ขั้นตอนการทำซ้ำ ซ่อมแซม และดัดแปลงชุดประกอบแผงวงจรพิมพ์ รวมถึงเครื่องมือ วัสดุ ขั้นตอนทั่วไป การกำจัดสารเคลือบผิว และกราฟิกเพื่อช่วยเหลือผู้ใช้

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Released: 01/10/2025

Language

Vietnamese

Current Revision

Hướng dẫn này cung cấp các quy trình liên quan đến công tác làm lại, sửa chữa và sửa đổi các bảng mạch lắp ráp, bao gồm các dụng cụ và vật liệu, các quy trình chung, công tác loại bỏ lớp phủ và hình ảnh để hỗ trợ người dùng.

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EIA/IPC/JEDEC-J-STD-002

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Product Type

Released: 03/12/2021

Language

Japanese

Current Revision

IPC-J-STD-002Eは、電子部品のリード、ターミネーション、単線、より線、ラグ、およびタブのはんだ付性を評価するための試験方法、欠陥の定義、許容基準を規定し、またイラストを示すものである。また、IPC-J-STD-002Eの規格には、はんだ食われ/はんだはじきに対する耐性の試験方法も含まれている。IPC-J-STD-002Eはサプライヤーおよびユーザーの両者による使用を目的としている。IPC-J-STD-002Eの規格は次の三つの組織によって開発された：ECIA、IPC、JEDEC。 65ページ。発行 2017年11月。

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IPC-7095

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Product Type

Released: 06/17/2020

Language

Japanese

Current Revision

IPC-7095D-AM1は、ボールグリッドアレイ(BGA)およびファインピッチBGA(FBGA)技術の設計および組立の実施について記述するものであり、これらのパッケージを使用したプリント基板の設計と組立に関連する検査、リペアおよび信頼性の問題に焦点を当てている。 IPC-7095D-AM1は、BGAを使用している、もしくは使用を検討している本書読者に対し、有用で実用的な情報を提供するものである。またIPC-7095D-AM1では、BGAを使用するプリント基板組立のためのロバスト設計と組立プロセスの正しい方法について説明するとともに、BGAの組立中に発生する可能性のある一般的な異常について、トラブルシューティングの方法を説明している。

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Revision

Product Type

Released: 10/14/2020

Language

Arabic

Current Revision

IPC-A-610 هي مواصفات قبول تجميع الإلكترونيات الأكثر شيوعا واستخدامًا. تم تحديثها مع مشاركين من 17 بلداً يقدمون مدخلات وخبرات ، حيث تقدم هذه الوثيقة أحدث المعايير إلى جانب العديد من الرسومات الجديدة والمعدلة للصناعة. هذه المواصفت تمثل مرجعا هاما ولا بد منه للمفتشين والعملة و كل من لهم مصلحة في معايير قبول التجميعات الإلكترونية. تم تطوير IPC-A-610 بالتآزر مع J-STD-001 ، وللمرة الأولى مع هذه المراجعة...

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Revision

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Released: 09/17/2018

Language

Estonian

Current Revision

Kirjeldus IPC-A-610 on kõige levinum elektroonikakoostude vastavusnõudeid sisaldav dokument. Standardi uuendamisel on andnud oma sisendi tehniliste eriteadmiste näol osalejad seitsmeteistkümnest riigist. Dokumendis on toodud tööstuse uusimad kriteeriumid koos uute graafiliste materjalidega. See on kohustuslik dokument inspektoritele, operaatoritele ja kõigile teistele, kellel on huvi...

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Revision

Product Type

Released: 01/05/2015

Language

Hebrew

Current Revision

IPC-A-610 הינו תקן ההרכבות האלקטרוניות הנפוץ ביותר בעולם. בהיותו בגדר חובה עבור כל מחלקות הבטחת האיכות וההרכבה, IPC-A-610F מדגים קריטריוני מיומנות עבודה מקובלים בתעשיה עבור הרכבות אלקטרוניות, באמצעות תמונות ואיורים בצבע מלא. מהדורה זו כוללת שני סגנונות חדשים של חיבורי ,SMT כמו כן שינוי במילוי דרך קדחים וקריטריון לחלל ב- BGA . בנוסף, בכל מקום אפשרי ההגדרות שונו על מנת להפוך את הקריאה לקלה יותר וכדי...

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Released: 04/13/2010

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Hindi

Current Revision

IPC – A- 610 के समर्थन की प्रक्रिया IEC है जो इलेक्ट्रोनिक्स असेम्बली के लिए वैश्विक स्त्र पर अंतरराष्ट्रीय स्वीकार्य मानक है। IPC-A- 610 कार्य विश्व का सर्वाधिक उपयोग में लिया जाने वाला इलेक्ट्रोनिक्स असेम्बली मानक है। सबके लिए गुणवता का विश्वास व असेम्बली विभाग IPC– A- 610E जो पूर्ण रुप से रंगीन फोटोग्राफ व दृष्टांतो के द्वारा इलेक्ट्रोनिक्स असेम्बली के उध्योग द्वारा स्वीकृत कारीगरी के मानदण्डों...

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