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Document #:
Revision
J
Product Type
Released:  01/22/2025
Language
English
Current Revision
IPC J-STD-001JS Space and Military Addendum supplements or replaces specifically identified requirements of IPC J-STD-001J requirements for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space and military applications.
Document #:
Revision
F
Product Type
Released:  02/23/2024
Language
English
Current Revision
The IPC-6012FS space addendum provides exceptions to IPC Performance Class 3 requirements of the IPC-6012F for use in space and military avionics product. Exceptions include changes to acceptance criteria and/or sample size and test frequency for production lot acceptance testing. The IPC-6012FS covers requirements for rigid printed boards to survive vibration, extreme thermal cycling and ground...
Document #:
Revision
E
Product Type
Released:  04/24/2020
Language
English
Current Revision
The IPC-6012ES space addendum provides exceptions to Class 3 requirements of the IPC-6012E for use in space and military avionics product. Exceptions include changes to acceptance criteria and/or sample size and test frequency for production lot acceptance testing. The IPC-6012ES covers requirements for rigid printed boards to survive vibration, extreme thermal cycling and ground testing...

IPC-J-STD-001 - Revision J - Redline Standard

Redline Comparison IPC J-STD-001HS to IPC J-STD-001JS

Document #:
Revision
J
Product Type
Released:  02/20/2025
Language
English
Current Revision
J-STD-001JS Redline document shows the changes from J-STD-001HS to J-STD-001JS in a side-by-side comparison of the two documents. The J-STD-001JS redline is only available in electronic format, it is not available in hardcopy.
Document #:
Revision
F
Released:  02/01/2017
Language
English
This addendum supplements J-STD-001F for soldered assemblies that must survive the vibration and thermal cyclic environments associated with space hardware. It is to be used with J-STD-001FS WAM 1.
Document #:
Revision
H
Product Type
Released:  05/13/2021
Language
English
IPC J-STD-001HS space and military addendum, supplements or replaces specifically identified requirements of IPC J-STD-001H requirements for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space and military applications.

IPC-J-STD-001 - Revision F - Addendum - Space and Military

Space Applications Electronic Hardware Addendum to J-STD-001F

Document #:
Revision
F
Product Type
Released:  02/12/2015
Language
English
This Addendum supplements or replaces specifically identified requirements of IPC J-STD-001, Revision F, for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space.
Document #:
Revision
E
Product Type
Released:  12/01/2010
Language
English
When specifically required by procurement documentation, this Addendum supplements or replaces specifically identified requirements of IPC J-STD-001, Revision E of April 2010 by providing additional requirements to ensure the reliability of soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments getting to and operating in space. The required...
Document #:
Revision
D
Product Type
Released:  08/04/2022
Language
English
The IPC-6018DS addendum supplements or replaces specifically identified requirements of IPC-6018D, for high frequency (microwave) printed boards that must survive the vibration, ground testing and thermal cyclic environments of space and military avionics. The IPC-6018DS addendum incorporates new requirements in areas such as copper wrap plating, dewetting, pad/land anomalies, copper cap plating...
Document #:
Revision
G
Product Type
Released:  04/16/2018
Language
English
The IPC-J-STD-001GS space addendum supplements or replaces specifically identified requirements of IPC J-STD-001G for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space and military applications.
Document #:
Revision
D
Product Type
Released:  09/22/2015
Language
English
This Addendum supplements or replaces specifically identified requirements of IPC-6012D, Revision D, for rigid printed boards that must survive the vibration, ground testing and thermal cyclic environments of space and military avionics
Document #:
Revision
C
Product Type
Released:  08/09/2016
Language
English
This Addendum supplements or replaces specifically identified requirements of IPC-6018C, for high frequency (microwave) printed boards that must survive the vibration, ground testing and thermal cyclic environments of space and military avionics.
Document #:
Revision
H
Product Type
Released:  06/22/2022
Language
German
Current Revision
Die Richtlinie IPC J-STD-001HS-DE Ergänzung für Raumfahrt-Anwendungen ergänzt oder ersetzt spezifisch identifizierte Anforderungen von IPC J-STD-001H-DE für gelötete elektrische und elektronische Baugruppen, die Schwingungen und die Umgebungsbedingungen thermischer Zyklen von Raumfahrt und militärischen Anwendungen überstehen müssen.
Document #:
Revision
J
Product Type
Released:  01/22/2026
Language
Japanese
Current Revision
“IPC J-STD-001JS 宇宙・軍事用途向け追加規格”は、IPC J-STD-001Jの要求事項のうち特定の要件を補完する/置き換えるものであり、宇宙および軍事用途において、輸送時や運用時の振動/熱サイクル環境に耐えることが求められる電気・電子組立品を対象としている。
Document #:
Revision
H
Product Type
Released:  07/26/2022
Language
French
Current Revision
Le présent Addendum IPC-J-STD-001HS relatif aux applications spatiales et militaires présente des exigences qui complètent ou remplacent des exigences spécifiques de la norme J-STD-001H, pour les assemblages électriques et électroniques brasés qui doivent résister aux vibrations et aux importantes variations thermiques subies dans des applications spatiales et militaires.

IPC-6012 - Revision F - Addendum - Space and Military

刚性印制板的鉴定及性能规范航天和军事航空应用补充标准

Document #:
Revision
F
Product Type
Released:  04/10/2025
Language
Chinese
Current Revision
IPC-6012FS 航天补充标准为 IPC-6012F 航天和军事航空应用提供了 IPC 3 级性能等级要求的例外情况。例外情况包括更改验收标准和/或样品大小以及生产批次验收测试的测试频率。IPC-6012FS 涵盖了刚性印制板在太空旅行环境中承受振动、极端热循环和静态地面测试的要求。取代 IPC-6012ES。
Document #:
Revision
E
Product Type
Released:  01/18/2021
Language
Japanese
Current Revision
IPC-6012ES 宇宙用途向け追加規格では宇宙および軍用アビオニクス製品に適用される、IPC-6012Eのクラス3要件への例外事項を示している。これら例外事項には、生産ロット受入れ試験に関する許容基準やサンプルサイズおよび試験頻度などへの変更が含まれる。

IPC-6012 - Revision E - Addendum - Space and Military

刚性印制板的鉴定及性能规范航天和军事航空应用补充标准

Document #:
Revision
E
Product Type
Released:  11/20/2020
Language
Chinese
Current Revision
IPC-6012ES附录为用于太空和军用航空电子产品的IPC-6012E的3类要求提供了例外。 例外情况包括对生产批次验收测试的验收标准和/或样本大小以及测试频率的更改。 IPC-6012ES涵盖了刚性印刷电路板的要求,以抵抗振动,极端热循环以及与太空旅行环境相关的地面测试。
Document #:
Revision
D
Product Type
Released:  11/18/2016
Language
Spanish
Current Revision
Esta adición suplementa o reemplaza específicamente identificado requisitos del IPC-6012D, revisión D, para los tableros impresos rígidos que tienen que sobrevivir a la vibración, ensayos/pruebas en tierra y ambientes cíclicos térmicos de espacio y aviónica militar.
Document #:
Revision
D
Product Type
Released:  06/09/2016
Language
French
Current Revision
Cet Avenant complète ou remplace les exigences de l’IPC-6012D, version D, spécifiquement identifiées pour les circuits imprimés rigides qui doivent supporter les environnements de vibration, de contrôle sur le terrain et de cyclage thermique du spatial et de l'aéronautique militaire.

Coming Soon

IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards