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IPC-1782 - Revision B - Standard Only

Standard for Manufacturing and Supply Chain Traceability of Electronic Products

Document #:
IPC-1782
Revision
B
Product Type
Standard Only
Released:  10/20/2023
Language
English
Current Revision
IPC-1782B establishes minimum requirements for manufacturing and supply chain traceability based on perceived risk. IPC-1782B applies to all products, processes, assemblies, parts, components, equipment used and other items as defined by users and suppliers in the manufacture of printed board assemblies, as well as mechanical assembly and printed board fabrication. IPC-1782B is applicable both for...
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IPC-J-STD-048 - Revision A - Standard Only

Notification Standard for Product Discontinuance

Document #:
IPC-J-STD-048
Revision
A
Product Type
Standard Only
Released:  01/22/2026
Language
English
Current Revision
This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. The goal of this notification standard is to better enable customers to manage and mitigate the disruption caused by the discontinuation of a product and to ensure continuity of supply. This standard establishes the requirements for timely customer notification of planned...
IPC-7091A Cover Image

IPC-7091A - Revision A - Standard Only

Design and Assembly Process Implementation of 3D Components

Document #:
IPC-7091
Revision
A
Product Type
Standard Only
Released:  01/13/2023
Language
English
Current Revision
This document describes the design and assembly challenges and ways to address those challenges for implementing 3D component technology. Recognizing the effects of combining multiple uncased semiconductor die elements in a single-package format can impact individual component characteristics and can dictate suitable assembly methodology. The information contained in this standard focuses on...

IPC-2581 - Revision C - Standard Only

Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

Document #:
IPC-2581
Revision
C
Product Type
Standard Only
Released:  11/20/2020
Language
English
Current Revision
The IPC-2581C standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements. This format may be used for transmitting information between a printed board designer and a manufacturing or assembly facility. The data is most...
IPC-T-50N Cover Image

IPC-T-50 - Revision N - Standard Only

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

Document #:
IPC-T-50
Revision
N
Product Type
Standard Only
Released:  11/30/2021
Language
English
IPC-T-50N document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing English as a second language could understand the subtleties of the meaning. IPC-T-50N contains over 550 new or revised terms, including new terminology for via structures, surface mount device...

IPC-T-50 - Revision M - Standard Only

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

Document #:
IPC-T-50
Revision
M
Product Type
Standard Only
Released:  05/26/2015
Language
English
This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision M contains over 220 new or revised terms, including new terminology for conformal coatings, potting and encapsulation processes, stencil design, statistical process control, and flexible printed board...

IPC-T-50 - Revision K - Standard Only

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

Document #:
IPC-T-50
Revision
K
Product Type
Standard Only
Released:  07/17/2013
Language
English
This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision K contains more than 220 new or revised terms, including new terminology for thermal properties, etchback, assembly processing, hole drilling, and microvia technology. Also includes commonly used industry...
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IPC-T-50 - Revision J - Standard Only

SUPERSEDED BY T-50K

Document #:
IPC-T-50
Revision
J
Product Type
Standard Only
Released:  10/18/2011
Language
English
This essential industry standard provides descriptions and illustrations of electronics interconnect industry terminology to help users and their customers break down language barriers. Revision J contains nearly 400 new or revised terms, including new terminology for chip scale and area array packaging, cable and wire harness technology, assembly processing, moisture sensitive components, and...
IPC-8401 Cover Image

IPC-8401 - Standard Only

Guidelines for In-Mold Electronics

Document #:
IPC-8401
Revision
Original Version
Product Type
Standard Only
Released:  10/22/2024
Language
English
Current Revision
IPC-8401 standard provides guidelines for In-Mold Electronics (IME) manufacturing processes, part structures, candidate materials, and production test methods. In-Mold Electronics integrates printed electronics and electrical components into injection molded plastics, creating a three-dimensional smart molded structure. IME technology uses mass production processes, materials, and components. IME...
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IPC-HERMES-9852 - Version 1.6 - Standard Only

The Global Standard for Machine-to-Machine Communication in SMT Assembly

Document #:
IPC/HERMES-9852
Revision
1.6
Product Type
Standard Only
Released:  08/28/2024
Language
English
Current Revision
The IPC-Hermes-9852 standard provides a state-of-the-art communication protocol for machine-to-machine communication for surface-mount technology. Used with IPC-2591, Connected Factory Exchange, IPC-HERMES-9852 can assist any electronics manufacturer, large or small, to align their companies with smart manufacturing and Industry 4.0. Version 1.6 includes updates to SendBoardInfo and capabilities...
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IPC-2591 - Version 2.0 - Standard Only

Connected Factory Exchange (CFX)

Document #:
IPC-2591
Revision
2.0
Product Type
Standard Only
Released:  03/10/2025
Language
English
Current Revision
This standard establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. This standard applies to communication between all executable processes in the manufacture of printed board assemblies, automated, semiautomated and manual, and is applicable to related mechanical assembly and...
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IPC-9716 - Standard Only

Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies

Document #:
IPC-9716
Revision
Original Version
Product Type
Standard Only
Released:  01/10/2025
Language
English
Current Revision
IPC-9716 provides requirements for automated optical inspection (AOI) systems to define, set up, establish, and apply process control for manufacturing printed board assemblies, including general and specific process and AOI system conditions. Requirements include inspection parameters, lighting conditions, calibration, detectability, resolution, threshold limits, program setups, measurement...
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IPC-9271 - Standard Only

Guidelines for In System Programming

Document #:
IPC-9271
Revision
Original Version
Product Type
Standard Only
Released:  09/30/2025
Language
English
Current Revision
The IPC-9271 standard provides guidelines for device-level In-System Programming (ISP) as part of electronics assembly process. The standard addresses PCB design for ISP, fundamental characteristics when selecting an ISP programmer and the integration of the programmer in the production environment, including: fixtures, software, mechanical and process integration methodologies to increase...
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IPC-2591 - Version 1.7 - Standard Only

Connected Factory Exchange (CFX)

Document #:
IPC-2591
Revision
1.7
Product Type
Standard Only
Released:  08/24/2023
Language
English
Current Revision
This standard establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. This standard applies to communication between all executable processes in the manufacture of printed board assemblies, automated, semiautomated and manual, and is applicable to related mechanical assembly and...
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IPC-1756 - Standard Only

Manufacturing Process Data Management

Document #:
IPC-1756
Revision
Original Version
Product Type
Standard Only
Released:  04/05/2010
Language
English
Current Revision
IPC-1756 establishes the requirements for exchanging manufacturing data between suppliers and customers for electrical and electronic products. IPC-1756 establishes 23 fields for declaration of manufacturing data supported by Scriba and other tools developed for use between users and suppliers. The type of manufacturing information includes sensitivity to moisture and high temperature, different...
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IPC-2501 - Standard Only

Definition for Web-Based Exchange of XML Data

Document #:
IPC-2501
Revision
Original Version
Product Type
Standard Only
Released:  07/01/2003
Language
English
Current Revision
IPC-2501 establishes the governing semantics and an XML based syntax for shop floor communication between electronic assembly equipment and associated software applications. This standard outlines the communication architecture and supporting XML messages. The standard also describes a messaging interface that is based upon an architecture whereby a single logical middleware server (the Message...
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IPC-T-50- Revision N - Standard Only

电子电路互连与封装术语及定义

Document #:
IPC-T-50
Revision
N
Product Type
Standard Only
Released:  01/13/2023
Language
Chinese
Current Revision
IPC-T-50N-CN文件旨在为电子行业中常用的词汇和术语提供其定义。本文件所规定的定义充分详细地阐明了术语，以便以英语为第二语言的读者能够理解含义的细微之处。IPC-T-50N-CN包含550多个新的或修订的术语，包括通孔结构、表面贴装器件类型、焊料凸点、焊料合金、焊接、退润湿、电路板制造工艺和测试的新术语。

IPC-1782 - Revision A - Standard Only

Standard for Manufacturing and Supply Chain Traceability of Electronic Products

Document #:
IPC-1782
Revision
A
Product Type
Standard Only
Released:  01/13/2021
Language
English
The IPC-1782A standard establishes minimum requirements for manufacturing and supply chain traceability based on perceived risk. IPC-1782A applies to all products, processes, assemblies, parts, components, equipment and other items used in the manufacture of printed board assemblies and in mechanical assembly.

IPC-9850 - Revision A - Standard Only

Surface Mount Placement Equipment Characterization

Document #:
IPC-9850
Revision
A
Product Type
Standard Only
Released:  12/21/2011
Language
English
This standard establishes the parameters, procedures and methodologies used to measure and report pick and place machine accuracy as a relationship to placement speed for a range of SMT component sizes and configurations. Purchase of this standard includes support documentation, report forms and the test material drawings in DWG format.

IPC-T-50 - Revision K - Standard Only

Begriffe und Definitionen für Leiterplatten und elektronische Baugruppen

Document #:
IPC-T-50
Revision
K
Product Type
Standard Only
Released:  02/03/2015
Language
German
Current Revision
Das unentbehrliche Nachschlagewerk für alle Verantwortlichen entlang der Wertschöpfungskette von elektronischen Produkten. Die Revision K enthält auf mehr als 120 Seiten, mehr als 220 neue und überarbeitete Begriffe und bildliche Darstellungen. Beispiele: Access Hole, Accelerated Equivalent Soak, Capture Land, Micro Via Technology, Plating Thief, Etchback, Resin Recession, Tape Automated Bonding...
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IPC-2581 - Revision B - Standard Only

Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

Document #:
IPC-2581
Revision
B
Product Type
Standard Only
Released:  09/01/2013
Language
English
This standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements. This format may be used for transmitting information between a printed board designer and a manufacturing or assembly facility. The data is most useful...
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IPC-1072 - Amendment 1

Intellectual Property Protection in Electronic Assembly Manufacturing

Document #:
IPC-1072
Revision
Original Version
Product Type
Amendment
Released:  03/07/2017
Language
English
Current Revision
This amendment to IPC-1072 updates the document to align its requirements with the requirements in its counterpart standard IPC-1071 for PCB shops. 5 Pages. Released March 2017 This amendment cannot be used without a copy of IPC-1072 (December 2015). To purchase the original document please see Related Products and choose 1072(D)1
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IPC-7091 - Revision A - Standard Only

3D(三次元)部品の設計および組立プロセスの実施

Document #:
IPC-7091
Revision
A
Product Type
Standard Only
Released:  11/04/2024
Language
Japanese
Current Revision
本書では、3D部品の技術を実施する際の設計/組立の課題や、課題への対処方法について述べる。ケースに収納されていない複数の半導体ダイ素子を単一パッケージのフォーマットに組み合わせる効果を考える場合、その影響は個々の部品特性にも、これまでの組立手法にも及ぶ。本規格に含まれる情報は、3D半導体パッケージの組立とプロセスに関連する最適な機能性、工程評価、最終製品の信頼性とリペアの諸問題の解決に向け焦点を当てたものである。
1-25 of 55

Coming Soon

IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards