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IPC-1782 - Revision B - Standard Only

Standard for Manufacturing and Supply Chain Traceability of Electronic Products

Document #:
IPC-1782
Revision
B
Product Type
Standard Only
Released:  10/20/2023
Language
English
Current Revision
IPC-1782B establishes minimum requirements for manufacturing and supply chain traceability based on perceived risk. IPC-1782B applies to all products, processes, assemblies, parts, components, equipment used and other items as defined by users and suppliers in the manufacture of printed board assemblies, as well as mechanical assembly and printed board fabrication. IPC-1782B is applicable both for...
IPC-9797A Cover Image

IPC-9797 - Revision A - Standard Only

Press-fit Standard for Automotive Requirements and other High-Reliability Applications

Document #:
IPC-9797
Revision
A
Product Type
Standard Only
Released:  05/18/2023
Language
English
Current Revision
IPC-9797A is the only industry-consensus standard for Requirements and Acceptance of Press-fit Pins. IPC-9797 describes materials, methods, tests and acceptance criteria for solderless press-fit pin connections. IPC-9797 is supported by IPC-HDBK-9798 “Handbook for Press-fit Standard for Automotive Requirements and other High-Reliability Applications” for those wanting additional information and...
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IPC-J-STD-048 - Revision A - Standard Only

Notification Standard for Product Discontinuance

Document #:
IPC-J-STD-048
Revision
A
Product Type
Standard Only
Released:  01/22/2026
Language
English
Current Revision
This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. The goal of this notification standard is to better enable customers to manage and mitigate the disruption caused by the discontinuation of a product and to ensure continuity of supply. This standard establishes the requirements for timely customer notification of planned...

IPC-2581 - Revision C - Standard Only

Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

Document #:
IPC-2581
Revision
C
Product Type
Standard Only
Released:  11/20/2020
Language
English
Current Revision
The IPC-2581C standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements. This format may be used for transmitting information between a printed board designer and a manufacturing or assembly facility. The data is most...
IPC-T-50N Cover Image

IPC-T-50 - Revision N - Standard Only

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

Document #:
IPC-T-50
Revision
N
Product Type
Standard Only
Released:  11/30/2021
Language
English
IPC-T-50N document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing English as a second language could understand the subtleties of the meaning. IPC-T-50N contains over 550 new or revised terms, including new terminology for via structures, surface mount device...

IPC-T-50 - Revision M - Standard Only

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

Document #:
IPC-T-50
Revision
M
Product Type
Standard Only
Released:  05/26/2015
Language
English
This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision M contains over 220 new or revised terms, including new terminology for conformal coatings, potting and encapsulation processes, stencil design, statistical process control, and flexible printed board...

IPC-T-50 - Revision K - Standard Only

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

Document #:
IPC-T-50
Revision
K
Product Type
Standard Only
Released:  07/17/2013
Language
English
This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision K contains more than 220 new or revised terms, including new terminology for thermal properties, etchback, assembly processing, hole drilling, and microvia technology. Also includes commonly used industry...
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IPC-T-50 - Revision J - Standard Only

SUPERSEDED BY T-50K

Document #:
IPC-T-50
Revision
J
Product Type
Standard Only
Released:  10/18/2011
Language
English
This essential industry standard provides descriptions and illustrations of electronics interconnect industry terminology to help users and their customers break down language barriers. Revision J contains nearly 400 new or revised terms, including new terminology for chip scale and area array packaging, cable and wire harness technology, assembly processing, moisture sensitive components, and...
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IPC-TM-650 - Standard Only

Test Methods Manual

Document #:
IPC-TM-650
Revision
Original Version
Product Type
Standard Only
Language
English
Current Revision
Contains over 150 industry approved test techniques and procedures for chemical, mechanical, electrical, and environmental tests on all forms of printed boards and connectors. New and updated test methods are available for download at https://www.ipc.org/test-methods.
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IPC-HERMES-9852 - Version 1.6 - Standard Only

The Global Standard for Machine-to-Machine Communication in SMT Assembly

Document #:
IPC/HERMES-9852
Revision
1.6
Product Type
Standard Only
Released:  08/28/2024
Language
English
Current Revision
The IPC-Hermes-9852 standard provides a state-of-the-art communication protocol for machine-to-machine communication for surface-mount technology. Used with IPC-2591, Connected Factory Exchange, IPC-HERMES-9852 can assist any electronics manufacturer, large or small, to align their companies with smart manufacturing and Industry 4.0. Version 1.6 includes updates to SendBoardInfo and capabilities...
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IPC-2591 - Version 2.0 - Standard Only

Connected Factory Exchange (CFX)

Document #:
IPC-2591
Revision
2.0
Product Type
Standard Only
Released:  03/10/2025
Language
English
Current Revision
This standard establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. This standard applies to communication between all executable processes in the manufacture of printed board assemblies, automated, semiautomated and manual, and is applicable to related mechanical assembly and...
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IPC-9716 - Standard Only

Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies

Document #:
IPC-9716
Revision
Original Version
Product Type
Standard Only
Released:  01/10/2025
Language
English
Current Revision
IPC-9716 provides requirements for automated optical inspection (AOI) systems to define, set up, establish, and apply process control for manufacturing printed board assemblies, including general and specific process and AOI system conditions. Requirements include inspection parameters, lighting conditions, calibration, detectability, resolution, threshold limits, program setups, measurement...
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IPC-9271 - Standard Only

Guidelines for In System Programming

Document #:
IPC-9271
Revision
Original Version
Product Type
Standard Only
Released:  09/30/2025
Language
English
Current Revision
The IPC-9271 standard provides guidelines for device-level In-System Programming (ISP) as part of electronics assembly process. The standard addresses PCB design for ISP, fundamental characteristics when selecting an ISP programmer and the integration of the programmer in the production environment, including: fixtures, software, mechanical and process integration methodologies to increase...
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IPC-2591 - Version 1.7 - Standard Only

Connected Factory Exchange (CFX)

Document #:
IPC-2591
Revision
1.7
Product Type
Standard Only
Released:  08/24/2023
Language
English
Current Revision
This standard establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. This standard applies to communication between all executable processes in the manufacture of printed board assemblies, automated, semiautomated and manual, and is applicable to related mechanical assembly and...
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IPC-1756 - Standard Only

Manufacturing Process Data Management

Document #:
IPC-1756
Revision
Original Version
Product Type
Standard Only
Released:  04/05/2010
Language
English
Current Revision
IPC-1756 establishes the requirements for exchanging manufacturing data between suppliers and customers for electrical and electronic products. IPC-1756 establishes 23 fields for declaration of manufacturing data supported by Scriba and other tools developed for use between users and suppliers. The type of manufacturing information includes sensitivity to moisture and high temperature, different...
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IPC-2501 - Standard Only

Definition for Web-Based Exchange of XML Data

Document #:
IPC-2501
Revision
Original Version
Product Type
Standard Only
Released:  07/01/2003
Language
English
Current Revision
IPC-2501 establishes the governing semantics and an XML based syntax for shop floor communication between electronic assembly equipment and associated software applications. This standard outlines the communication architecture and supporting XML messages. The standard also describes a messaging interface that is based upon an architecture whereby a single logical middleware server (the Message...
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IPC-T-50- Revision N - Standard Only

电子电路互连与封装术语及定义

Document #:
IPC-T-50
Revision
N
Product Type
Standard Only
Released:  01/13/2023
Language
Chinese
Current Revision
IPC-T-50N-CN文件旨在为电子行业中常用的词汇和术语提供其定义。本文件所规定的定义充分详细地阐明了术语，以便以英语为第二语言的读者能够理解含义的细微之处。IPC-T-50N-CN包含550多个新的或修订的术语，包括通孔结构、表面贴装器件类型、焊料凸点、焊料合金、焊接、退润湿、电路板制造工艺和测试的新术语。

IPC-1782 - Revision A - Standard Only

Standard for Manufacturing and Supply Chain Traceability of Electronic Products

Document #:
IPC-1782
Revision
A
Product Type
Standard Only
Released:  01/13/2021
Language
English
The IPC-1782A standard establishes minimum requirements for manufacturing and supply chain traceability based on perceived risk. IPC-1782A applies to all products, processes, assemblies, parts, components, equipment and other items used in the manufacture of printed board assemblies and in mechanical assembly.

IPC-9850 - Revision A - Standard Only

Surface Mount Placement Equipment Characterization

Document #:
IPC-9850
Revision
A
Product Type
Standard Only
Released:  12/21/2011
Language
English
This standard establishes the parameters, procedures and methodologies used to measure and report pick and place machine accuracy as a relationship to placement speed for a range of SMT component sizes and configurations. Purchase of this standard includes support documentation, report forms and the test material drawings in DWG format.

IPC-T-50 - Revision K - Standard Only

Begriffe und Definitionen für Leiterplatten und elektronische Baugruppen

Document #:
IPC-T-50
Revision
K
Product Type
Standard Only
Released:  02/03/2015
Language
German
Current Revision
Das unentbehrliche Nachschlagewerk für alle Verantwortlichen entlang der Wertschöpfungskette von elektronischen Produkten. Die Revision K enthält auf mehr als 120 Seiten, mehr als 220 neue und überarbeitete Begriffe und bildliche Darstellungen. Beispiele: Access Hole, Accelerated Equivalent Soak, Capture Land, Micro Via Technology, Plating Thief, Etchback, Resin Recession, Tape Automated Bonding...
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IPC-2581 - Revision B - Standard Only

Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

Document #:
IPC-2581
Revision
B
Product Type
Standard Only
Released:  09/01/2013
Language
English
This standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements. This format may be used for transmitting information between a printed board designer and a manufacturing or assembly facility. The data is most useful...
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IPC-9707 - Amendment 1

Spherical Bend Test Method for Characterization of Board Level Interconnects

Document #:
IPC/JEDEC-9707
Revision
Original Version
Product Type
Amendment
Released:  05/01/2018
Language
English
Current Revision
IPC/JEDEC-9707-AM1 is an amendment which clarifies that the standard is only applicable to transient bending during short-term test operations. The standard specifies a common method of establishing strain limits of board-level device interconnects under spherical transient bending conditions, the worst-case flexure condition that can occur during conventional printed board/system assembly...
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IPC-1072 - Amendment 1

Intellectual Property Protection in Electronic Assembly Manufacturing

Document #:
IPC-1072
Revision
Original Version
Product Type
Amendment
Released:  03/07/2017
Language
English
Current Revision
This amendment to IPC-1072 updates the document to align its requirements with the requirements in its counterpart standard IPC-1071 for PCB shops. 5 Pages. Released March 2017 This amendment cannot be used without a copy of IPC-1072 (December 2015). To purchase the original document please see Related Products and choose 1072(D)1
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Coming Soon

IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards