The IPC-7711/21 guide provides procedures for rework, repair and modification of printed board assemblies, including tools and materials, common procedures, coating removal and graphics to assist the user.
Products
IPC/JEDEC J-STD-033D provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. IPC/JEDEC J-STD-033D procedures provide a...
IPC/JEDEC J-STD-020F standard is to identify the classification level of nonhermetic SMDs designed for surface mount assembly that are sensitive to moisture-induced stress so that they can be properly packaged, stored, and handled to avoid damage during assembly solder reflow attachment and/or repair operations. IPC/JEDEC J-STD-020F standard may be used to determine what classification level...
IPC J-STD-004D standard prescribes general requirements for the classification and characterization of fluxes for high quality solder interconnections. IPC J-STD-004D standard may be used for quality control and procurement purposes.
This standard provides minimum requirements, policies and procedures for printed board design, fabrication, assembly, and cable and wire harness assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products. These trusted sources shall ensure quality, supply chain risk management (SCRM), security and chain...
IPC-J-STD-002E prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs, and tabs. The IPC-J-STD-002E standard also includes a test method for the resistance to dissolution/dewetting of metallization. IPC-J-STD-002E is intended for use by both supplier and user...
IPC-1791D standard provides minimum requirements, policies and procedures for printed board design, fabrication, assembly, and cable and wire harness assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products. These trusted sources shall ensure quality, supply chain risk management (SCRM), security and...
The IPC-7095D-AM1 standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages. IPC-7095D-AM1 provides the useful and practical information to those who use or are considering using BGAs. IPC-7095D-AM1 provides...
IPC J-STD-005B standard lists the requirements for qualification and characterization of solder paste. It references test methods, criteria, and metal content, viscosity, slump, solder ball, tack and wetting of solder pastes. Additional support is provided in IPC-HDBK-005, Guide to Solder Paste Assessment.
This popular document covers land pattern design for all types of passive and active components, including resistors, capacitors, MELFs, SOPs, QFPs, BGAs, QFNs and SONs. The standard provides printed board designers with an intelligent land pattern naming convention, zero component rotations for CAD systems and three separate land pattern geometries for each component that allow the user to select...
IPC-2231A provides guidelines for establishing a best practice methodology for use in developing a formal DFX (Design for Manufacturing, Fabrication, Assembly, Testability, Cost, Reliability, Environment, Reuse) process for layout of printed boards.
The IPC-7525C standard provides guidance for the design and fabrication of stencils for solder paste and surface-mount adhesive with much of the content based on the experience of stencil designers, fabricators, and users.
Covers the information requirements for the procurement of material, box build, assembly, system integration, inspection, test, burn-in, delivery and/or distribution of electronic assemblies. 5 pages. Released January 2004.
Developed by the OEM council of the IPC, IPC-1720A categorizes electronic assembly manufacturer capabilities and supplies the OEM customer with detailed, substantive information. This program simplifies auditing processes and reduces the frequency of audits, thereby decreasing paperwork and improving efficiency. Company and Site Description, Site Capability Snap Shot, Equipment Profile (Pre-site...
IPC-7526A handbook addresses understencil cleanliness during stencil printing, removal of solder paste from stencils following the cleaning process and misprint PCB board cleaning considerations.
This document standardizes the requirements for power conversion devices (PCDs) for the computer and telecommunications industries. The phrase “power conversion devices” refers to ac to dc and dc to dc modules, converters and power supplies. This specification sets the requirements for design; qualification testing; conformance testing and manufacturing quality/reliability processes, but does not...
The IPC-7093A standard provides essential design and assembly guidance for implementing bottom termination components (BTCs). Specifically, IPC-7093A provides guidelines on critical design, materials, assembly, inspection, repair, quality, and reliability issues associated with BTCs.
This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon and powder solders for electronic soldering applications; and for ‘‘special’’ electronic grade solders. This is a quality control standard and is not intended to relate directly to the material’s performance in the manufacturing process. Solders for...
This standard provides a marking and labeling system that aids in assembly, rework, repair and recycling and provides for the identification of: 1. those assemblies that are assembled with lead-containing or lead-free solder; 2. components that have lead-containing or lead-free second level interconnect terminal finishes and materials; 3. the maximum component temperature not to be exceeded during...
The IPC J-STD-004C WAM1 standard prescribes general requirements for the classification and characterization of fluxes for high quality solder interconnections. The IPC J-STD-004C WAM1 standard may be used for quality control and procurement purposes. Soldering flux materials include the following: liquid flux, paste flux, solder paste, solder cream as well as flux-coated and flux-cored solder...
IPC/JEDEC J-STD-035A test method defines the procedures for performing acoustic microscopy on nonhermetic encapsulated electronic devices. IPC/JEDEC J-STD-035A method provides users with an acoustic microscopy process flow for detecting anomalies (delaminations, cracks, mold compound voids, etc.) nondestructively in encapsulated electronic devices while achieving reproducibility
This document describes the design and assembly challenges and ways to address those challenges for implementing 3D component technology. Recognizing the effects of combining multiple uncased semiconductor die elements in a single-package format can impact individual component characteristics and can dictate suitable assembly methodology. The information contained in this standard focuses on...
The IPC-2581C standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements. This format may be used for transmitting information between a printed board designer and a manufacturing or assembly facility. The data is most...
The IPC-J-STD-003C-WAM1&2 standard prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands and plated-through holes (PTHs). The IPC-J-STD-003C-WAM1&2 standard is not intended to verify the potential of successful processing at assembly or to evaluate design impact on wettability. The IPC-J-STD-003C-WAM1&2...
This is the document all process engineers must have! Useful for day-to-day problem solving, it contains case histories of problems and corrective action in the design, manufacture, assembly and testing of printed wiring products. Each section has been updated to reflect today's manufacturing challenges. Sections address documentation, phototooling, raw materials, mechanical operations, hole...
This document provides the designer/user with guideline information related to the use of pressure sensitive adhesives (PSAs) for fabrication and assembly of flexible, rigid or rigid-flex printed boards, membrane switches and component attachments. It also provides information on adhesive types available, their inherent strengths, weaknesses, limitations and correct processes needed for creating...
This guideline describes flexibility and stretchability testing to evaluate printable electronics for stretchable and wearable applications. 26 pages. Released March 2017
The J-STD-006C-AM1 amendment provides better detail of a solder alloy's maximum allowed deviation about the nominal level of the element's mass than was provided in past alloy standards. The J-STD-006C-AM1 amendment provides information on negative effects of adding rare earth elements to specific, heavy tin-containing, lead-free solder alloys and propensity of tin whisker formation. Finally, the...
Amendment 1 to IPC-7711/21C, the document provides procedures for removal and installation of D-Pak components
IPC-T-50N document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing English as a second language could understand the subtleties of the meaning. IPC-T-50N contains over 550 new or revised terms, including new terminology for via structures, surface mount device...
This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision M contains over 220 new or revised terms, including new terminology for conformal coatings, potting and encapsulation processes, stencil design, statistical process control, and flexible printed board...
This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision K contains more than 220 new or revised terms, including new terminology for thermal properties, etchback, assembly processing, hole drilling, and microvia technology. Also includes commonly used industry...
This essential industry standard provides descriptions and illustrations of electronics interconnect industry terminology to help users and their customers break down language barriers. Revision J contains nearly 400 new or revised terms, including new terminology for chip scale and area array packaging, cable and wire harness technology, assembly processing, moisture sensitive components, and...
The industry's first specification for the evaluation of a legend and/or marking ink material for the determination of acceptability of use in a standard printed board system. IPC-4781 provides coverage for adhesion, material qualification and testing, resistances to solvents, requirements for resistance to lead-free solders, and electrical requirements. 17 pages. Released May 2008.
Contains over 150 industry approved test techniques and procedures for chemical, mechanical, electrical, and environmental tests on all forms of printed boards and connectors. New and updated test methods are available for download at https://www.ipc.org/test-methods.
This document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing English as a second language could understand the subtleties of the meaning. Revision P contains over 120 new or revised terms, including new terminology for back-drill structures, cable and wire...
Establishes design concepts, guidelines and procedures for reliable printed wiring assemblies. Focuses on SMT or mixed technology PWAs, specifically addressing the interconnect structure and the solder joint itself. Discusses substrates, components, attachment materials, coatings and assembly processes and testing considerations. In addition, this document contains detailed appendices covering...
This document is intended to clarify terms used in the area of fluid dispensing. As is often the case, different terms are used by different manufacturers to convey a similar meaning. Common interchangeable terms are shown in parenthesis and the reader should not infer one term is preferred over the other.
The IPC-5262 prescribes the minimum design, critical process and acceptance requirements for the application of polymeric materials to electrical/electronic components, modules, printed wiring assemblies and other elements thereof. The intent of IPC-5262 is to establish a baseline of requirements, procedures, practices and process attributes based on lessons learned and best practices that have...
Tackling PCB cleanliness is a tough job; residues on printed circuit boards are directly related to the reliability of the produced hardware and can result in serious failures if not known or monitored. But how do you measure "cleanliness"? How clean is "clean"? The IPC-5701 provides guidance into how these issues should be approached and specified in purchasing documents, addressing levels of...
Every electronics manufacturer, whether an original equipment manufacturer (OEM) or electronics manufacturing services (EMS) company, must determine if the unpopulated printed boards entering the assembly process have an adequate level of cleanliness. The question of “how clean is clean enough?” is one that has no definitive answer, as there is no "golden number" for board cleanliness. The issue...
This standard is intended as a guideline in the proper preparation of a metallographic sample (microsection) of a printed board. The finished microsection is used for evaluating the quality of the laminate system and plated structures (e.g. PTHs and vias). Microsection sample preparation is regarded by many as a highly developed skill. The guidelines in this standard discuss the many variables and...
The European Union’s Restriction of Hazardous Substances (RoHS) legislation has had a profound impact on the electronics industry. One of the restricted substances, lead (Pb), is commonly used in alloys with tin for component finishes, printed board finishes and solders. Pb-free materials directly affect product performance, reliability and service life in many ways. There have been numerous...
This standard, developed jointly by IPC and the Electronic Industries Association (EIA) establishes the construction detail requirements for balls and other terminal structures on Ball Grid Array (BGA) packages. It also establishes a set of designations and expectations for product performance. A large variety of terminal structures are recognized for a wide range of applications ranging from...
IPC JEDEC J-STD-020 is used to determine what moisture-sensitivity-level (MSL) classification level should be used so that surface mount devices (SMDs) can be properly packaged, stored and handled to avoid subsequent thermal and mechanical damage during the assembly solder reflow attachment and/or repair operation. J-STD-020 covers components to be processed at higher temperatures for lead-free...
This standard establishes construction detail requirements for bumps and other terminal structures used for Flip Chip Scale carriers. The specific standards for different terminations are appropriately matched to a particular interconnection process and include such diverse terminations as solder bumps, columns, non-melting stand-offs and conductive polymer deposits. The document articulates a set...
Provides information on multichip module technology, including parametric data, design and manufacturing information and a proposed categorization of various approaches to multichip interconnect substrate technologies based on dielectric family. 120 pages. Released August 1992.
This document will provide insight into the theory behind tin whisker formation as it is known today and, based on this knowledge, potential mitigation practices that may delay the onset of, or prevent tin whisker formation. The potential effectiveness of various mitigation practices will also be briefly discussed. References behind each of the theories and mitigation practices are provided. It...
This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs and tabs. A test method for the resistance to dissolution/dewetting of metallization is also included in the standard. Intended for use by both vendors and users, J-STD-002D was developed by...
Covers requirements and test methods for thermally conductive dielectric adhesives used to bond components in place. Permanent, removable and self-shimming adhesives are addressed. 18 pages. Released January 1995.
This standard identifies the moisture sensitivity classification level of passive surface mount devices and through-hole components, subjected to reflow soldering, so that they can be properly packaged, stored, and handled to avoid subsequent thermal/mechanical damage during assembly solder reflow attachment and/or repair operation. This standard may be used to determine what classification level...
This document standardizes the performance parameters for air moving devices. The phrase "air moving device" (or "air mover") refers to equipment such as, fans, blowers and other forced air movement technologies. These air moving devices are used in the electronics industry for the cooling of heat-producing components, and range from small devices mounted directly to hot components such as...
Printed board flatness is largely affected by a change in intrinsic properties through exposure to variances in temperature. The worst case deviation of the printed board from flatness may be at room temperature, peak temperature during reflow, or at any temperature in between. Printed board flatness must therefore be characterized during the entire reflow thermal cycle, and not solely at room...
This document is a tool for a customer or supplier organization's internal audit group to assess a statistical process control (SPC) system against the requirements of IPC-9191. This document should be used by customers and suppliers of any size and for any commodity. This tool can be used to perform an assessment of the use of SPC at both organizational and process levels. The questions in this...
This redline provides a side-by-side comparison the changes from Revision C to Revision D of IPC-7711/21.
This voluntary standard establishes minimum requirements for the design, installation, operation and maintenance of electrically heated process equipment in order to minimize electrical hazards and prevent fires that may occur in combustible tanks, tank liners and drying equipment.
This guide provides procedures for rework, repair and modification of printed board assemblies. Included in this revision are the procedures previously released as change pages, an updated general information and common procedures section, new procedures for BGAs using focused IR Reflow Systems with integral preheater and general updates to all other procedures.
IPC-T-50N-CN文件旨在为电子行业中常用的词汇和术语提供其定义。本文件所规定的定义充分详细地阐明了术语，以便以英语为第二语言的读者能够理解含义的细微之处。IPC-T-50N-CN包含550多个新的或修订的术语，包括通孔结构、表面贴装器件类型、焊料凸点、焊料合金、焊接、退润湿、电路板制造工艺和测试的新术语。
This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon and powder solders for electronic soldering applications; and for ‘‘special’’ electronic grade solders. This is a quality control standard and is not intended to relate directly to the material’s performance in the manufacturing process. Solders for...
IPC-1791C provides minimum requirements, policies and procedures for printed board design, fabrication, assembly, and cable and wire harness assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products. These trusted sources shall ensure quality, supply chain risk management (SCRM), security and chain of...
This standard provides a marking and labeling system that aids in assembly, rework, repair and recycling and provides for the identification of: those assemblies that are assembled with lead-containing or lead-free solder; components that have lead-containing or lead-free second level interconnect terminal finishes and materials; the maximum component temperature not to be exceeded during assembly...
The IPC J-STD-004C standard prescribes general requirements for the classification and characterization of fluxes for high quality solder interconnections. The IPC J-004C standard may be used for quality control and procurement purposes.
IPC-1791B standard provides minimum requirements, policies and procedures for printed board design, fabrication, and assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products. IPC-1791B expands the standard’s requirements to account for trusted sources of cable and wire harness assemblies.
IPC-1791A standard provides minimum requirements, policies and procedures for printed board design, fabrication and assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products. Revision A of IPC-1791 standard includes the requirements added for CAGE Code, citizenship, security, foreign person access...
Implementing ball grid array (BGA) and fine-pitch ball grid array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7095C delivers useful and practical information to anyone currently using BGAs or FBGAs. Many issues have become especially important due to the change in the alloys of the ball, the ball shape, and the attachment procedures...
This standard lists requirements for qualification and characterization of solder paste. It references test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder pastes. Additional support is provided in IPC-HDBK-005, Guide to Solder Paste Assessment (not included with purchase of this standard). Supersedes J-STD-005.
Surface Insulation Resistance (SIR) testing is a tool used not only for characterization testing of production processes such as solder masks, soldering flux, and conformal coatings, but also for examining the electrochemical reactions at each stage of the electronic assembly production process. This handbook covers the terminology, theories, test procedures and test vehicles of SIR testing...
This standard prescribes general requirements for the classification and characterization of fluxes for high quality solder interconnections. This standard may be used for quality control and procurement purposes. The purpose of this standard is to classify and characterize tin/lead and lead-free soldering flux materials for use in electronic metallurgical interconnections for printed circuit...
This document provides guidelines for the design and fabrication of stencils for solder paste and surface mount adhesive with discussion on through-hole and mixed technology. This includes differences for tin lead and lead-free solder paste, overprint, two-print and step stencil designs. A sample order form and user inspection checklist are also included.
Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7095B delivers useful and practical information to anyone currently using BGAs or considering a conversion to area array packaging formats. This has become especially important due to the change in the alloys being used, both...
Provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. These procedures provide a minimum shelf life of 12 months...
J-STD-003C prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and plated-through holes utilizing either tin-lead or lead-free solders. This standard is intended for use by both vendor and user. The objective of the solderability test methods described in this standard is to determine the ability of...
DoD Adopted 1995 Revision A covers requirements for qualification and classification of rosin, resin, organic and inorganic fluxes according to the activity level and halide content of the fluxes. It includes solder fluxes, flux-containing materials and low residue fluxes for no-clean processes. Associated test methods may have been updated and are available online for free download. Supersedes QQ...
This standard prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and plated-through holes utilizing either tin/lead or lead-free solders. This standard is intended for use by both vendor and user. The objective of the solderability test methods described in this standard is to determine the ability of...
Das unentbehrliche Nachschlagewerk für alle Verantwortlichen entlang der Wertschöpfungskette von elektronischen Produkten. Die Revision K enthält auf mehr als 120 Seiten, mehr als 220 neue und überarbeitete Begriffe und bildliche Darstellungen. Beispiele: Access Hole, Accelerated Equivalent Soak, Capture Land, Micro Via Technology, Plating Thief, Etchback, Resin Recession, Tape Automated Bonding...
J-STD-003C prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands and plated-through holes utilizing either tin-lead or lead-free solders. This standard is intended for use by both vendor and user. The objective of the solderability test methods described in this standard is to determine the ability of...
Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. Revision A of this document delivers useful and practical information to anyone who is currently using BGAs or is considering a conversion to area array packaging formats. In addition to providing guidelines for BGA inspection...
This guide includes everything needed for repair and rework of electronic assemblies and printed circuit boards. IPC-7711B/7721B Rework, Modification and Repair of Electronic Assemblies has received a complete procedure by procedure update to assure applicability to both lead free and traditional SnPb soldered assemblies. This single volume includes all previously published changes and several new...
NEW! IPC-7351A includes both the standard and an IPC-7351A land pattern calculator on CD-ROM for accessing component and land pattern dimensional data.The calculator includes the document’s mathematical algorithms so users can build a land pattern for a corresponding surface mount part quickly and accurately.The tool also allows for modification of dimensional attributes of IPC-approved land...
This standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements. This format may be used for transmitting information between a printed board designer and a manufacturing or assembly facility. The data is most useful...
This is a list of reported errata to the printed copies of IPC/JEDEC J-STD-609A. Pen and ink changes should be made in accordance with your company's document control policies.
Le guide IPC-7711/21 fournit des procédures de reprise, réparation et modification des assemblages de circuits imprimées, y compris des outils et des matériaux, des procédures courantes, le retrait du revêtement et des graphiques pour aider l'utilisateur.
El IPC/JEDEC J-STD-033D proporciona a los fabricantes de dispositivos de montaje superficial y a los usuarios con métodos estandarizados para la manejo, embalaje, transporte y uso de componentes sensibles a la humedad/reflujo. Estos métodos ayudan a evitar daños por la absorción de humedad y por la exposición a las temperaturas de la soldadura por reflujo que pueden tener como resultado una...
La guía IPC-7711/21 proporciona procedimientos para reelaborar, reparar y modificar conjuntos de placas de circuitos impresos, incluidas herramientas y materiales, procedimientos comunes, eliminación de revestimiento y gráficos para ayudar al usuario.
本規格書は、高品質のはんだ相互接続に使用するフラックスの分類および特性評価に関し、一般的な要求事項を規定するものである。本規格書は、品質管理および調達目的のために使用することも可能である。
Der Leitfaden IPC-7711/21 enthält Verfahren für die Nacharbeit, Reparatur und Änderung von Leiterplatten-Baugruppen, einschließlich Werkzeugen und Materialien, häufig angewendete Verfahren, Entfernung der Beschichtung und Grafiken zur Unterstützung des Benutzers.
這份指南提供了對使用者有説明的印製板元件的返工，維修和修改程式，包含工具和材料，通用程式，塗敷的清除和圖形
このガイドは、プリント基板組立品のリワーク、リペアおよび改造の手順について紹介するものである。工具や材料、一般的な手順、コーティングの除去方法、およびユーザーの助けとなるようなグラフィック等が掲載されている
这份指南提供了对使用者有帮助的印制板组件的返工，维修和修改程序，包含工具和材料，通用程序，涂敷的清除和图形
本标准规定了高质量焊接互连用助焊剂的分类和特性描述的通用要求。本标准可用于助焊剂的质量控制和采购用途。
IPC/JEDEC J-STD-020F标准旨在确定对湿气诱发应力敏感的非气密表面贴装器件（SMD）的潮湿敏感度分级，从而能够对其进行正确地包装、储存和操作，以避免其在再流焊连接和/或维修操作时受到损坏。 IPC/JEDEC J-STD-020F标准可用于确定非密封SMD鉴定应使用的分类级别。通过该测试方法中的标准本身不足以保证长期可靠性。根据JESD22-A113，本文件为SMD生成的湿度敏感度等级（MSL）用于确定预处理的浸泡条件，以及如何根据J-STD-033正确包装、储存和处理SMD，以避免在组装回流焊连接和/或维修操作期间损坏。 对于可能对过程敏感的IC器件，请参考J-STD-075，以确定是否需要PSL（过程敏感等级）分类。
คู่มือนี้ให้ขั้นตอนการทำซ้ำ ซ่อมแซม และดัดแปลงชุดประกอบแผงวงจรพิมพ์ รวมถึงเครื่องมือ วัสดุ ขั้นตอนทั่วไป การกำจัดสารเคลือบผิว และกราฟิกเพื่อช่วยเหลือผู้ใช้
Hướng dẫn này cung cấp các quy trình liên quan đến công tác làm lại, sửa chữa và sửa đổi các bảng mạch lắp ráp, bao gồm các dụng cụ và vật liệu, các quy trình chung, công tác loại bỏ lớp phủ và hình ảnh để hỗ trợ người dùng.
規格書「IPC/JEDEC J-STD-020F」は、吸湿によって誘発されるストレスに敏感な非密閉型SMD(表面実装組立用に設計されたもの)の分類水準を特定し、適切に梱包/保管および取り扱うことで、組立品のはんだリフロー接続やリペア作業工程中の損傷を回避することを目的としている。 規格書「IPC/JEDEC J-STD-020F」は、非密閉型SMDの認定にあたり、どの分類水準を適用すべきかを判断する場合に使用してもよい。なお、長期的な信頼性を保証するにはこの試験方法の基準に合格するだけでは不十分である。本書によって判定されるSMDの吸湿耐性水準(MLS)評価は、JESD22-A113による事前処理のためのソーク条件や、J-STD-033による組立のはんだリフロー接続および/またはリペア作業工程中の損傷回避を目的とした、SMDの適切な梱包/保管/取扱い方法を決定する場合に利用される。...
IPC-J-STD-002Eは、電子部品のリード、ターミネーション、単線、より線、ラグ、およびタブのはんだ付性を評価するための試験方法、欠陥の定義、許容基準を規定し、またイラストを示すものである。また、IPC-J-STD-002Eの規格には、はんだ食われ/はんだはじきに対する耐性の試験方法も含まれている。IPC-J-STD-002Eはサプライヤーおよびユーザーの両者による使用を目的としている。IPC-J-STD-002Eの規格は次の三つの組織によって開発された：ECIA、IPC、JEDEC。 65ページ。発行 2017年11月。
IPC-7095D-AM1は、ボールグリッドアレイ(BGA)およびファインピッチBGA(FBGA)技術の設計および組立の実施について記述するものであり、これらのパッケージを使用したプリント基板の設計と組立に関連する検査、リペアおよび信頼性の問題に焦点を当てている。 IPC-7095D-AM1は、BGAを使用している、もしくは使用を検討している本書読者に対し、有用で実用的な情報を提供するものである。またIPC-7095D-AM1では、BGAを使用するプリント基板組立のためのロバスト設計と組立プロセスの正しい方法について説明するとともに、BGAの組立中に発生する可能性のある一般的な異常について、トラブルシューティングの方法を説明している。
IPC/JEDEC J-STD-033Dは、感湿性部品、リフロー感応性部品の取扱い、梱包、出荷および使用に関し、標準化された方法を製造者およびユーザーに提供することを目的としている。これらの方法は、生産収量や信頼性の低下、および部品の劣化につながる可能性のある、吸湿およびはんだリフロー温度にさらされることによる損傷を回避するために提供するものである。IPC/JEDEC J-STD-033Dで定義するドライパッキングの手順を適切に実施することにより、封止日から最低でも12か月間のシェルフライフが可能となる。本書はIPCおよびJEDECにより作成された。
IPC JEDEC J-STD-020は、表面実装部品(SMD)の吸湿耐性水準(MSL)の分類水準を特定し、適切にパッケージ化および保管され、また取り扱われることで、組立のはんだリフロー接続および/またはリペア作業中の熱的/機械的損傷を回避することを目的としている。J-STD-020は、高温による鉛フリーはんだ、および低温によるSnPbはんだの各組立で取り扱われる部品を対象としている。 このリビジョンでは適用範囲および用途における一貫性を確保するため、規格書内の多くの領域で明確な説明が追加された。本書では、ポリマー層のあるベアダイおよび非ICパッケージの使用に関する考慮事項について触れている。なお本書(リビジョンE)では、分類温度 (Tc)、パッケージの体積、乾燥重量の特性評価、時間間隔の特性を考慮した乾燥重量の決定方法についても明確にし、最新情報を記載している。また...
本文件的目的是，针对潮湿、再流焊和工艺敏感器件，向生产商和用户提供标准的操作、包装、运输及使用方法。所提供的这些方法可避免由于吸收湿气和暴露在再流焊温度下造成的封装损伤，这些损伤会导致合格率和可靠性的降低。一旦正确执行IPC/JEDEC J-STD-033D，这些工艺可以提供从密封时间算起12个月的最短保质期。由IPC和JEDEC开发。
Coming Soon
IPC-9242: Guidelines for Microsection Evaluation
IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures
IPC-7527A: Requirements for Solder Paste Application
IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards
IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards
IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard
IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797
IPC-WP-011: Guidance for Strain Gage Limits for Assemblies
J-STD-048A: Notification Standard for Product Discontinuance
IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits
IPC-1401B: Corporate Social Responsibility Management System Standard
IPC -1751B: Generic Requirements for Declaration Process Management
IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards